公开(公告)号：US10566286B2

公开(公告)日：2020-02-18

申请号：US16250854

申请日：2019-01-17

Applicant: Apple Inc.

Inventor： Sanjay Dabral ,  David A. Secker ,  Huabo Chen ,  Zhenggang Cheng

IPC: H01L23/52 ,  H01L23/538 ,  H01L23/498 ,  H01L23/14 ,  H01L23/00 ,  H01L25/065

Abstract: Routing structures including signal routing between die areas is described. In an embodiment, routing structures include signal lines with a characteristic thickness that is greater than a width. The signal lines may be twisted, and run directly underneath pads.

公开(公告)号：US11906745B1

公开(公告)日：2024-02-20

申请号：US17721255

申请日：2022-04-14

Applicant: Apple Inc.

Inventor： Qianyi Zhao ,  Runren Zhang ,  Zhenggang Cheng ,  Jeffrey A Griffis ,  Stephen E Dey

IPC: G02B27/01 ,  G06F3/01

CPC classification number: G02B27/0172 ,  G06F3/011 ,  G02B2027/014

Abstract: Display backing components for head-mounted devices (HMDs) are described that reduce eddy currents in magnetic fields generated by a coil. A HMD may include a coil that is used to generate a magnetic field that may be used to track position of other devices with respect to the HMD. Display backing components, used to provide rigidity, are modified with holes or other gaps to interrupt the path of the eddy currents and reduce the interference with the magnetic field, thus improving the power efficiency of the coil and of the HMD. These modifications may be formed by casting, drilling, cutting or otherwise perforating the display backing during manufacture.

公开(公告)号：US20190189560A1

公开(公告)日：2019-06-20

申请号：US16250854

申请日：2019-01-17

Applicant: Apple Inc.

Inventor： Sanjay Dabral ,  David A. Secker ,  Huabo Chen ,  Zhenggang Cheng

IPC: H01L23/538 ,  H01L23/498 ,  H01L23/14

Abstract: Routing structures including signal routing between die areas is described. In an embodiment, routing structures include signal lines with a characteristic thickness that is greater than a width. The signal lines may be twisted, and run directly underneath pads.

公开(公告)号：US10217708B1

公开(公告)日：2019-02-26

申请号：US15845978

申请日：2017-12-18

Applicant: Apple Inc.

Inventor： Sanjay Dabral ,  David A. Secker ,  Huabo Chen ,  Zhenggang Cheng

IPC: H01L23/538 ,  H01L23/498 ,  H01L23/14 ,  H01L23/00 ,  H01L25/065

Abstract: Routing structures including signal routing between die areas is described. In an embodiment, routing structures include signal lines with a characteristic thickness that is greater than a width. The signal lines may be twisted, and run directly underneath pads.