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公开(公告)号：USD1021892S1
公开(公告)日：2024-04-09
申请号：US29759794
申请日：2020-11-25
Applicant: Apple Inc.
Designer： Jody Akana , Bartley K. Andre , Shota Aoyagi , Anthony Michael Ashcroft , Jeremy Bataillou , Daniel J. Coster , Daniele De Iuliis , M. Evans Hankey , Julian Hoenig , Richard P. Howarth , Jonathan P. Ive , Duncan Robert Kerr , Scott A. Myers , David A. Pakula , Rasamy Phouthavong , Matthew Dean Rohrbach , Peter Russell-Clarke , Benjamin Andrew Shaffer , Ashutosh Y. Shukla , Mikael Silvanto , Christopher J. Stringer , Eugene Antony Whang , Rico Zörkendörfer
Abstract: FIG. 1 is a front perspective view of a display for electronic communication device showing the claimed design;
FIG. 2 is a front view thereof;
FIG. 3 is a rear view thereof;
FIG. 4 is a left side view thereof;
FIG. 5 is a right side view thereof;
FIG. 6 is a bottom view thereof; and,
FIG. 7 is a top view thereof.
The broken lines in the figures show portions of the display for electronic communication device that form no part of the claimed design.
The oblique shade lines in the figures show transparency or translucency.-
公开(公告)号：US20170066011A1
公开(公告)日：2017-03-09
申请号：US14846269
申请日：2015-09-04
Applicant: Apple Inc.
Inventor： Jared M. Kole , Ashutosh Y. Shukla , Yi Zhang , Vincent Yan , Wai Man Raymund Kwok
CPC classification number: B05D5/005 , B05B3/00 , B05B7/24 , B05D1/02 , B05D5/083 , B05D7/14 , B05D2202/25 , C25D11/24
Abstract: Coatings for filling cracks within anodic films formed from, for example, a laser marking process are described. The cracks generally have widths of nanometers in scale and can extend from an external surface of an anodic film to an underlying metal substrate. The coatings fill the cracks to prevent liquid and contaminants from entering the cracks and reaching the metal substrate, thereby preventing corrosion of the underlying metal substrate. The coatings can be hydrophobic such that water is wicked away from the cracks. In some cases, the coatings are fluoropolymer coatings. Methods include spray-on techniques that provide a thin and uniform layer of the coating. The spray-on technique can be configured to spray on a fluoropolymer precursor onto the anodic film such that the fluoropolymer precursor diffuses into and polymerizes into the fluoropolymer coating within the cracks.
Abstract translation: 描述了用于在由例如激光打标工艺形成的阳极膜内填充裂纹的涂层。 裂纹通常具有纳米级的尺寸并且可以从阳极膜的外表面延伸到下面的金属基底。 涂层填充裂缝以防止液体和污染物进入裂纹并到达金属基底，从而防止下面的金属基底的腐蚀。 涂层可以是疏水性的，使得水从裂纹中恶化。 在某些情况下，涂层是氟聚合物涂层。 方法包括喷涂技术，其提供薄且均匀的涂层层。 喷涂技术可以配置成将氟聚合物前体喷涂到阳极膜上，使得含氟聚合物前体扩散到裂缝内并聚合到含氟聚合物涂层中。
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公开(公告)号：US09494845B2
公开(公告)日：2016-11-15
申请号：US14604657
申请日：2015-01-23
Applicant: Apple Inc.
Inventor： Marwan Rammah , Eric N. Nyland , Matthew D. Hill , Sawyer I. Cohen , Scott A. Myers , David A. Pakula , Michael Benjamin Wittenberg , Ashutosh Y. Shukla
CPC classification number: G03B17/12 , G02B7/003 , G03B17/02 , G03B43/00 , H04M1/0264 , H04N5/2257
Abstract: An electronic device having a securing member for a camera module is disclosed. The securing member may include several flexible spring elements extending around the camera module to maintain the position of the camera module during an assembly process of the electronic device. The securing member and the housing may be made from an electrically conductive material or materials. In this manner, the securing member may further provide the camera module with an electrical ground to prevent excessive electric charge within the camera module. In some embodiments, an alignment member is positioned on the housing and aligns the camera module and/or securing member with an aperture of the housing.
Abstract translation: 公开了一种具有相机模块固定部件的电子装置。 固定构件可以包括围绕照相机模块延伸的多个柔性弹簧元件，以在电子设备的组装过程期间保持相机模块的位置。 固定构件和壳体可以由导电材料或材料制成。 以这种方式，固定构件还可以向相机模块提供电接地，以防止相机模块内的过度电荷。 在一些实施例中，对准构件定位在壳体上并且使相机模块和/或固定构件与壳体的孔对准。
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公开(公告)号：US20160071660A1
公开(公告)日：2016-03-10
申请号：US14550814
申请日：2014-11-21
Applicant: Apple Inc.
Inventor： Ashutosh Y. Shukla , Tyler B. Cater , Sawyer I. Cohen , Edward S. Huo , David A. Pakula , Benjamin Shane Bustle , Dhaval N. Shah , Yaocheng Zhang , Vivek Katiyar
CPC classification number: H04B1/3888 , H01H13/06 , H01H2205/016 , H01H2207/032 , H01H2213/00 , H01H2213/002 , H01H2213/016 , H01H2223/002 , H04B2001/3894 , H04M1/0249 , H04M1/026 , H04M1/236
Abstract: This application relates to various button related embodiments for use with a portable electronic device. In some embodiments, a snap clip can be integrated with a button bracket to save space where two separate brackets would take up too much space in the portable electronic device. In other embodiments, a tactile switch can be waterproofed by welding a polymeric layer atop a tactile switch assembly. In this way water can be prevented from contacting moisture sensitive components of the tactile switch assembly. The weld joining the polymeric layer to the tactile switch can include at least one gap to trapped gas surrounding the tactile switch assembly to enter and exit during heat excursions caused by various operating and/or assembly operations.
Abstract translation: 本申请涉及与便携式电子设备一起使用的各种按钮相关实施例。 在一些实施例中，卡扣夹可以与按钮支架集成，以节省空间，其中两个单独的支架将占据便携式电子装置中太多的空间。 在其他实施例中，触觉开关可以通过在触觉开关组件顶部焊接聚合物层来防水。 以这种方式，可以防止水与触觉开关组件的湿气敏感部件接触。 将聚合物层连接到触觉开关的焊接可以包括围绕触觉开关组件的被捕获的气体的至少一个间隙，以在由各种操作和/或组装操作引起的热偏移期间进入和离开。
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公开(公告)号：US20150270227A1
公开(公告)日：2015-09-24
申请号：US14218384
申请日：2014-03-18
Applicant: Apple Inc.
Inventor： Richard H. Dinh , Ashutosh Y. Shukla , Scott A. Myers
IPC: H01L23/552 , H01L23/58 , H05K1/11 , H05K1/03 , H05K1/02 , H01L23/538 , H05K1/18
CPC classification number: H01L23/552 , H01L23/13 , H01L23/15 , H01L23/49805 , H01L23/49827 , H01L23/49838 , H01L24/13 , H01L24/16 , H01L24/81 , H01L27/14618 , H01L2224/0401 , H01L2224/131 , H01L2224/16225 , H01L2224/16235 , H01L2224/16238 , H01L2224/81801 , H01L2924/12041 , H01L2924/12042 , H01L2924/12044 , H01L2924/14 , H01L2924/15151 , H01L2924/15159 , H01L2924/15162 , H01L2924/15311 , H01L2924/15787 , H05K1/0218 , H05K1/189 , H05K3/0052 , H05K3/363 , H05K2201/053 , H05K2201/056 , H05K2201/09145 , H05K2201/09354 , H05K2201/09509 , H05K2201/09618 , H05K2201/10378 , H05K2201/2018 , H01L2924/014 , H01L2924/00
Abstract: An electrical component may be mounted on a substrate such as a ceramic substrate. Contacts may be formed on upper and lower surfaces of the substrate. The electrical component may be soldered to the contacts on the upper surface. The contacts on the lower surface may be used to solder the substrate to a printed circuit. During manufacturing, it may be desirable to use metal traces on a ceramic panel to make connections to contacts on the substrate. Following singulation of the ceramic panel to form the ceramic substrate, some of the metal traces may run to the edge of the ceramic substrate. A folded tab of the printed circuit may form a shield that covers these exposed traces. A divided metal-coated groove or a row of divided metal-coated vias running along each edge of the substrate may also provide shielding.
Abstract translation: 电气部件可以安装在诸如陶瓷基板的基板上。 可以在基板的上表面和下表面上形成接触。 电气部件可以焊接到上表面上的触点。 下表面上的触点可用于将基板焊接到印刷电路。 在制造过程中，可能需要在陶瓷板上使用金属迹线来连接到基板上的触点。 在陶瓷面板分层以形成陶瓷衬底之后，一些金属迹线可以流到陶瓷衬底的边缘。 印刷电路的折叠片可以形成覆盖这些暴露痕迹的屏蔽。 沿着衬底的每个边缘延伸的划分的金属涂覆的凹槽或一排划分的金属涂覆的通孔也可以提供屏蔽。
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Patent Agency Ranking
公开(公告)号：US20210344784A1
公开(公告)日：2021-11-04
申请号：US17378695
申请日：2021-07-17
Applicant: Apple Inc.
Inventor： Matthew D. Hill , Derek C. Krass , Benjamin Shane Bustle , Lucy Elizabeth Browning , Michael Benjamin Wittenberg , James B. Smith , Ashutosh Y. Shukla , Scott A. Myers
IPC: H04M1/02
Abstract: An enclosure and a method for forming an enclosure are disclosed. The enclosure may be formed from metal, such as aluminum, and further include a non-metal portion allowing for transmission and receipt of electromagnetic waves. The non-metal portion may be interlocked to the enclosure and in particular, to a region within the enclosure including a first material having a relatively high strength and stiffness compared to the non-metal portion. Interlocking means may include forming dovetail cuts into the enclosure to receive the non-metal portion, a hole or cavity drilled into the enclosure which includes internal threads, and a rod inserted into the first material to provide a tension to the non-metal portion. Methods of assembling internal components using anodization are also disclosed.
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公开(公告)号：US10547717B2
公开(公告)日：2020-01-28
申请号：US16241914
申请日：2019-01-07
Applicant: Apple Inc.
Inventor： Matthew D. Hill , Derek C. Krass , Benjamin Shane Bustle , Lucy Elizabeth Browning , Michael Benjamin Wittenberg , James B. Smith , Ashutosh Y. Shukla , Scott A. Myers
Abstract: An enclosure and a method for forming an enclosure are disclosed. The enclosure may be formed from metal, such as aluminum, and further include a non-metal portion allowing for transmission and receipt of electromagnetic waves. The non-metal portion may be interlocked to the enclosure and in particular, to a region within the enclosure including a first material having a relatively high strength and stiffness compared to the non-metal portion. Interlocking means may include forming dovetail cuts into the enclosure to receive the non-metal portion, a hole or cavity drilled into the enclosure which includes internal threads, and a rod inserted into the first material to provide a tension to the non-metal portion. Methods of assembling internal components using anodization are also disclosed.
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公开(公告)号：US09780827B2
公开(公告)日：2017-10-03
申请号：US15263259
申请日：2016-09-12
Applicant: Apple Inc.
Inventor： Ashutosh Y. Shukla , Tyler B. Cater , Sawyer I. Cohen , Edward S. Huo , David A. Pakula , Benjamin Shane Bustle , Dhaval N. Shah , Yaocheng Zhang , Vivek Katiyar
IPC: H01H1/64 , H01H1/66 , H01H9/02 , H01H9/06 , H01H13/00 , H01H19/04 , H01H19/08 , H01H21/00 , H04B1/3888 , H01H13/06 , H04M1/23 , H04M1/02 , H04B1/38
CPC classification number: H04B1/3888 , H01H13/06 , H01H2205/016 , H01H2207/032 , H01H2213/00 , H01H2213/002 , H01H2213/016 , H01H2223/002 , H04B2001/3894 , H04M1/0249 , H04M1/026 , H04M1/236
Abstract: This application relates to various button related embodiments for use with a portable electronic device. In some embodiments, a snap clip can be integrated with a button bracket to save space where two separate brackets would take up too much space in the portable electronic device. In other embodiments, a tactile switch can be waterproofed by welding a polymeric layer atop a tactile switch assembly. In this way water can be prevented from contacting moisture sensitive components of the tactile switch assembly. The weld joining the polymeric layer to the tactile switch can include at least one gap to trapped gas surrounding the tactile switch assembly to enter and exit during heat excursions caused by various operating and/or assembly operations.
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公开(公告)号：US09608685B2
公开(公告)日：2017-03-28
申请号：US14842728
申请日：2015-09-01
Applicant: Apple Inc.
Inventor： Ashutosh Y. Shukla , Sawyer I. Cohen , Scott A. Myers , David A. Pakula
IPC: H04M1/00 , H04B1/3888 , H04M1/02
CPC classification number: H04B1/3888 , G06F1/16 , H04M1/026 , H04M1/0266 , H04M1/18
Abstract: An electronic device that includes a deformable feature designed to seal two or more parts of the electronic device is disclosed. The deformable feature may be designed to deform, in response to a force applied to the deformable feature, with little or no compression. The deformable feature may include a cavity or relief volume extending along the deformable feature to define a space or void in the deformable feature. In response to a force, the deformable feature may deform such that a material (or materials) defining the deformable feature occupies or extends into the space or void, or in a location previously occupied by the space or void. The deformable feature may provide a protective seal between two or more parts that prevents ingress of contaminants, such as a liquid.
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公开(公告)号：US09445520B2
公开(公告)日：2016-09-13
申请号：US14317711
申请日：2014-06-27
Applicant: Apple Inc.
Inventor： Ashutosh Y. Shukla , Benjamin J. Pope , Kenneth A. Jenks , Scott A. Myers
CPC classification number: H05K7/1401 , F16H19/001 , G06F1/1658 , G06K13/0831 , H04B1/3816 , H05K5/0295 , H05K5/03 , H05K7/2039 , Y10T74/18992
Abstract: An electronic device may be provided with an ejectable component assembly having a connector that can receive and retain a removable module within a housing of the electronic device. The ejectable component assembly may also be provided with an ejector mechanism for at least partially ejecting the removable module from the connector. The ejector mechanism may receive a user input force at an ejector user interface, translate that user input force into an ejection force, and apply that ejection force onto the removable module for ejecting the module. The ejector user interface may be provided at any suitable position of the housing that may not interfere with other functions of the device. The path along which the ejector mechanism translates the user input force into the ejection force between the ejector user interface and the removable module may be provided in any suitable way throughout the device.
Abstract translation: 电子设备可以设置有具有可以在电子设备的壳体内容纳和保持可拆卸模块的连接器的可弹出部件组件。 可喷射部件组件还可以设置有用于从连接器至少部分地弹出可移除模块的喷射器机构。 喷射器机构可以在喷射器用户界面处接收用户输入力，将该用户输入力转换成弹出力，并且将该弹出力施加到可移除模块上用于弹出模块。 喷射器用户界面可以设置在壳体的任何合适的位置，其可以不干扰装置的其它功能。 喷射器机构将用户输入力平移到喷射器用户界面和可移除模块之间的弹出力的路径可以以整个装置中的任何合适的方式提供。
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