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    Methods and apparatus for conditioning of chemical mechanical polishing pads
    1.
    发明授权
    Methods and apparatus for conditioning of chemical mechanical polishing pads 有权

    公开(公告)号：US10226853B2

    公开(公告)日：2019-03-12

    申请号：US13801127

    申请日：2013-03-13

    Applicant: Rajeev Bajaj ,  Hung Chih Chen

    Inventor： Rajeev Bajaj ,  Hung Chih Chen

    IPC: B24B53/017 ,  B23K26/38 ,  B24B37/34

    Abstract: A method and apparatus for conditioning a polishing pad is provided. In one embodiment, a pad conditioning device for a substrate polishing process is provided. The pad conditioning device includes an optical device coupled to a portion of a polishing station adjacent a polishing pad, the optical device comprising a laser emitter adapted to emit a beam toward a polishing surface of the polishing pad, the beam having a wavelength range that is substantially non-reactive with a polishing fluid utilized in the polishing process, but is reactive with the polishing pad.

    Polishing pad with endpoint window and systems and method using the same
    4.
    发明授权
    Polishing pad with endpoint window and systems and method using the same 有权
    具有端点窗口和系统的抛光垫及其使用方法

    公开(公告)号：US08292692B2

    公开(公告)日：2012-10-23

    申请号：US12616323

    申请日：2009-11-11

    Applicant: Rajeev Bajaj

    Inventor： Rajeev Bajaj

    IPC: B24B49/00

    CPC classification number: B24B37/205

    Abstract: A polishing pad includes a guide plate, a compressible foam under layer disposed adjacent to a lower surface of the guide plate, and a plurality of polishing elements that extend in a first direction substantially normal to a plane defined by the guide plate and through the guide plate. The pad further includes an optical path along the first direction and which is defined by an aperture in the compressible foam under layer and the guide plate. The optical path includes a transparent window that extends above an upper surface of the guide plate but below tips of the polishing elements, the upper surface of the guide plate being opposite the lower surface thereof. An optional slurry distribution layer may be disposed on the upper surface of the guide plate, in which case the polishing elements extend through the slurry distribution layer and the transparent window extends beyond a top surface thereof.

    Abstract translation: 抛光垫包括引导板，与导板的下表面相邻设置的可压缩泡沫底层，以及多个抛光元件，其沿基本上垂直于由导板限定的平面的第一方向延伸并穿过导向件 盘子。 衬垫还包括沿着第一方向的光路，并且由可压缩泡沫底层和引导板中的孔限定。 光路包括在导板的上表面上方但在抛光元件的顶端之上的透明窗口，导向板的上表面与其下表面相对。 可选的浆料分配层可以设置在导向板的上表面上，在这种情况下，抛光元件延伸穿过浆料分布层，并且透明窗延伸超过其顶表面。

    PAD CONDITIONER AND METHOD
    5.
    发明申请
    PAD CONDITIONER AND METHOD 失效
    PAD调节器和方法

    公开(公告)号：US20110143640A1

    公开(公告)日：2011-06-16

    申请号：US12636644

    申请日：2009-12-11

    Applicant: Rajeev Bajaj

    Inventor： Rajeev Bajaj

    IPC: B24B1/00 ,  B24B53/095 ,  B24B53/12

    CPC classification number: B24B53/017 ,  B23K26/3576 ,  B24B53/095

    Abstract: A polishing pad conditioning apparatus includes a laser beam generating unit for providing a laser beam, a fluid delivery system for providing a fluid stream and a vacuum line for removing debris. The laser beam may directly impinge on a surface of a polishing pad thereby creating cutting action, while an atomized fluid stream provides cooling and pad debris along with fluid are removed thru the vacuum line. Alternatively, the laser beam may be combined with the atomized fluid stream in a region above the pad surface to substantially impart part of its energy to the fluid stream, generating high energy droplets which provide “cool” cutting action on the pad surface.

    Abstract translation: 抛光垫调节装置包括用于提供激光束的激光束产生单元，用于提供流体流的流体输送系统和用于去除碎屑的真空管线。 激光束可以直接冲击抛光垫的表面，从而产生切割作用，而雾化的流体流提供冷却和垫片碎屑以及流体通过真空管线被去除。 或者，激光束可以与垫表面上方的区域中的雾化流体流组合，以将其能量的一部分基本上赋予流体流，产生在焊盘表面上提供“冷”切割作用的高能量液滴。

    Pad conditioner design and method of use
    6.
    发明申请
    Pad conditioner design and method of use 有权
    垫调节器的设计和使用方法

    公开(公告)号：US20060199471A1

    公开(公告)日：2006-09-07

    申请号：US11369876

    申请日：2006-03-06

    Applicant: Rajeev Bajaj

    Inventor： Rajeev Bajaj

    IPC: B24B51/00 ,  B24B1/00

    CPC classification number: B24B53/017 ,  B23K26/0006 ,  B23K26/352 ,  B23K2103/42 ,  B24B37/20

    Abstract: A polishing pad conditioning apparatus includes a laser beam generating unit along with a system to transmit or focus the beam. The unit is mounted on a conditioning arm, such that the laser beam may be directed perpendicular to the plane of the polishing pad, which is next to the polishing platen. The conditioning arm is capable of moving across the polishing table to scan the pad radius, allowing the laser to traverse the pad radius.

    Abstract translation: 抛光垫调节装置包括激光束产生单元以及用于传输或聚焦光束的系统。 该单元安装在调节臂上，使得激光束可以垂直于抛光垫的平面定向，抛光垫的平面邻近研磨台板。 调理臂能够移动穿过抛光台以扫描焊盘半径，允许激光穿过焊盘半径。

    Chemical mechanical polishing composition and process
    8.
    发明授权
    Chemical mechanical polishing composition and process 失效
    化学机械抛光组合物和工艺

    公开(公告)号：US06872329B2

    公开(公告)日：2005-03-29

    申请号：US09842476

    申请日：2001-04-25

    Applicant: Yuchun Wang ,  Rajeev Bajaj ,  Fred C. Redeker ,  Shijian Li

    Inventor： Yuchun Wang ,  Rajeev Bajaj ,  Fred C. Redeker ,  Shijian Li

    IPC: B24B37/04 ,  C09G1/02 ,  H01L21/321 ,  C09K13/00 ,  C09K13/04 ,  C09K13/06 ,  H01L21/302

    CPC classification number: H01L21/3212 ,  B24B37/044 ,  C09G1/02

    Abstract: A method and composition for planarizing a substrate surface is provided. The polishing composition includes an oxidizer capable of oxidizing a metal undergoing planarization and yielding a complexing agent which complexes with the oxidized metal and a stabilizer such as a stannate salt. The composition may further include abrasive particles and/or inhibitors. The composition may be used in a multi-step polishing process including polishing a substrate surface to selectively remove a metal layer with respect to a barrier layer and dielectric layer and polishing a substrate surface using the composition to non-selectively remove the metal layer, a barrier layer, and a dielectric layer from the substrate surface.

    Abstract translation: 提供了用于平坦化基板表面的方法和组合物。 抛光组合物包括能够氧化经历平坦化的金属并产生与氧化金属络合的络合剂和稳定剂如锡酸盐的氧化剂。 组合物还可以包括研磨颗粒和/或抑制剂。 组合物可以用于多步抛光工艺中，包括抛光衬底表面以相对于阻挡层和电介质层选择性去除金属层，并使用该组合物抛光衬底表面以非选择性地去除金属层， 阻挡层和介电层。

    Additives for pressure sensitive polishing compositions
    9.
    发明授权
    Additives for pressure sensitive polishing compositions 失效
    用于压敏抛光组合物的添加剂

    公开(公告)号：US06783432B2

    公开(公告)日：2004-08-31

    申请号：US09874177

    申请日：2001-06-04

    Applicant: Jui-Lung Li ,  Yuchun Wang ,  Rajeev Bajaj ,  Fred C. Redeker

    Inventor： Jui-Lung Li ,  Yuchun Wang ,  Rajeev Bajaj ,  Fred C. Redeker

    IPC: B24B100

    CPC classification number: B24B37/0056 ,  B24B37/044 ,  C09G1/02

    Abstract: A method and composition for planarizing a substrate. The composition includes a pressure sensitive solution and one or more chemical agents for complexing with a metal or oxidized metal. The method for removal of a copper containing layer from a substrate surface, comprising applying a composition to a polishing media, the composition comprising a pressure sensitive solution, and one or more chemical agents for complexing with a metal or oxidized metal, and polishing the substrate surface with the polishing media.

    Abstract translation: 一种用于平坦化衬底的方法和组合物。 组合物包括压敏溶液和用于与金属或氧化金属络合的一种或多种化学试剂。 一种从基材表面除去含铜层的方法，包括将组合物施用于抛光介质，所述组合物包含压敏溶液，以及一种或多种与金属或氧化金属络合的化学试剂，以及研磨该基材 表面与抛光介质。

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