Patent search ap:("松下电器产业株式会社") AND inv:"山下裕贵" Page 1

1.

发明公开
半导体装置有权

公开(公告)号：CN103635999A

公开(公告)日：2014-03-12

申请号：CN201280029271.9

申请日：2012-08-29

Applicant: 松下电器产业株式会社

Inventor： 山下裕贵 , 油井隆 , 川端毅 , 萩原清己 , 横山贤司

IPC: H01L25/065 , H01L23/12 , H01L25/07 , H01L25/18

CPC classification number: H01L23/49541 , H01L21/563 , H01L23/13 , H01L23/49575 , H01L23/5389 , H01L24/05 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/17 , H01L24/19 , H01L24/20 , H01L24/32 , H01L24/33 , H01L24/48 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/85 , H01L24/92 , H01L25/0657 , H01L25/18 , H01L2224/0401 , H01L2224/04042 , H01L2224/04105 , H01L2224/12105 , H01L2224/13021 , H01L2224/13023 , H01L2224/14136 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/1703 , H01L2224/2101 , H01L2224/211 , H01L2224/215 , H01L2224/26145 , H01L2224/32013 , H01L2224/32058 , H01L2224/32059 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/3312 , H01L2224/48091 , H01L2224/48105 , H01L2224/48227 , H01L2224/48247 , H01L2224/48463 , H01L2224/48465 , H01L2224/73204 , H01L2224/73207 , H01L2224/73209 , H01L2224/73253 , H01L2224/73265 , H01L2224/73267 , H01L2224/81193 , H01L2224/82101 , H01L2224/82106 , H01L2224/83104 , H01L2224/85 , H01L2224/92 , H01L2224/92127 , H01L2224/92225 , H01L2224/92247 , H01L2225/0651 , H01L2225/06513 , H01L2225/0652 , H01L2924/00014 , H01L2924/15311 , H01L2924/18162 , H01L2924/30107 , H01L2924/381 , H01L2924/00012 , H01L2924/00 , H01L2224/19 , H01L2224/11 , H01L2224/81 , H01L2224/83 , H01L2224/45099 , H01L2224/45015 , H01L2924/207

Abstract: 本发明的半导体装置，在具有电极(20a)以及(20b)的芯片(6)的外缘设置扩展部(1)而成的扩展型半导体芯片(31)上，搭载具有电极(24)的芯片(5)。电极(20a)和电极(24)通过导电构件(8)而电连接。从芯片(6)上的导电构件(8)的配置区域的外侧遍及到扩展部(，1)上而形成有重新布线构造(2)。在扩展部(1)上形成有经由重新布线构造(2)与电极(20b)电连接的连接端子(21)。

2.

发明授权
半导体装置有权

公开(公告)号：CN103635999B

公开(公告)日：2017-04-05

申请号：CN201280029271.9

申请日：2012-08-29

Applicant: 松下电器产业株式会社

Inventor： 山下裕贵 , 油井隆 , 川端毅 , 萩原清己 , 横山贤司

IPC: H01L25/065 , H01L23/12 , H01L25/07 , H01L25/18

CPC classification number: H01L23/49541 , H01L21/563 , H01L23/13 , H01L23/49575 , H01L23/5389 , H01L24/05 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/17 , H01L24/19 , H01L24/20 , H01L24/32 , H01L24/33 , H01L24/48 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/85 , H01L24/92 , H01L25/0657 , H01L25/18 , H01L2224/0401 , H01L2224/04042 , H01L2224/04105 , H01L2224/12105 , H01L2224/13021 , H01L2224/13023 , H01L2224/14136 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/1703 , H01L2224/2101 , H01L2224/211 , H01L2224/215 , H01L2224/26145 , H01L2224/32013 , H01L2224/32058 , H01L2224/32059 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/3312 , H01L2224/48091 , H01L2224/48105 , H01L2224/48227 , H01L2224/48247 , H01L2224/48463 , H01L2224/48465 , H01L2224/73204 , H01L2224/73207 , H01L2224/73209 , H01L2224/73253 , H01L2224/73265 , H01L2224/73267 , H01L2224/81193 , H01L2224/82101 , H01L2224/82106 , H01L2224/83104 , H01L2224/85 , H01L2224/92 , H01L2224/92127 , H01L2224/92225 , H01L2224/92247 , H01L2225/0651 , H01L2225/06513 , H01L2225/0652 , H01L2924/00014 , H01L2924/15311 , H01L2924/18162 , H01L2924/30107 , H01L2924/381 , H01L2924/00012 , H01L2924/00 , H01L2224/19 , H01L2224/11 , H01L2224/81 , H01L2224/83 , H01L2224/45099 , H01L2224/45015 , H01L2924/207

Abstract: 本发明的半导体装置，在具有电极(20a)以及(20b)的芯片(6)的外缘设置扩展部(1)而成的扩展型半导体芯片(31)上，搭载具有电极(24)的芯片(5)。电极(20a)和电极(24)通过导电构件(8)而电连接。从芯片(6)上的导电构件(8)的配置区域的外侧遍及到扩展部(，1)上而形成有重新布线构造(2)。在扩展部(1)上形成有经由重新布线构造(2)与电极(20b)电连接的连接端子(21)。

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