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公开(公告)号：CN104584140A
公开(公告)日：2015-04-29
申请号：CN201380043064.3
申请日：2013-08-05
Applicant: 日立化成株式会社
CPC classification number: B23K35/3006 , B23K35/025 , B23K35/362 , C22C5/06 , H01B1/22 , H01L23/3107 , H01L23/3121 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/83 , H01L24/92 , H01L2224/2732 , H01L2224/29139 , H01L2224/2929 , H01L2224/29339 , H01L2224/32221 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/73265 , H01L2224/83192 , H01L2224/8384 , H01L2224/92247 , H01L2924/014 , H01L2924/10253 , H01L2924/12032 , H01L2924/12041 , H01L2924/12042 , H01L2924/1301 , H01L2924/13055 , H01L2924/13091 , H01L2924/15747 , H01L2924/181 , H01L2924/203 , H01L2924/2064 , H01L2924/00012 , H01L2924/00014 , H01L2924/00 , H01L2924/0002
Abstract: 一种银糊组合物，其为包含粒径0.1μm～20μm的银粒子和溶剂的银糊组合物，上述溶剂包含具有大于或等于300℃的沸点的溶剂。
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公开(公告)号：CN104584140B
公开(公告)日：2018-01-02
申请号：CN201380043064.3
申请日：2013-08-05
Applicant: 日立化成株式会社
CPC classification number: B23K35/3006 , B23K35/025 , B23K35/362 , C22C5/06 , H01B1/22 , H01L23/3107 , H01L23/3121 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/83 , H01L24/92 , H01L2224/2732 , H01L2224/29139 , H01L2224/2929 , H01L2224/29339 , H01L2224/32221 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/73265 , H01L2224/83192 , H01L2224/8384 , H01L2224/92247 , H01L2924/014 , H01L2924/10253 , H01L2924/12032 , H01L2924/12041 , H01L2924/12042 , H01L2924/1301 , H01L2924/13055 , H01L2924/13091 , H01L2924/15747 , H01L2924/181 , H01L2924/203 , H01L2924/2064 , H01L2924/00012 , H01L2924/00014 , H01L2924/00 , H01L2924/0002
Abstract: 一种银糊组合物，其为包含粒径0.1μm～20μm的银粒子和溶剂的银糊组合物，上述溶剂包含具有大于或等于300℃的沸点的溶剂。
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公开(公告)号：CN104379689B
公开(公告)日：2017-12-19
申请号：CN201380031406.X
申请日：2013-06-14
Applicant: 日立化成株式会社
CPC classification number: C09J11/04 , C08K3/08 , C08K7/00 , C08K2003/0806 , C08K2003/0893 , C08K2201/001 , C09J1/00 , C09J9/02 , H01B1/22 , H01L23/49579 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/83 , H01L2224/2929 , H01L2224/29318 , H01L2224/29339 , H01L2224/29499 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2224/83203 , H01L2224/83862 , H01L2224/92247 , H01L2924/00014 , H01L2924/10253 , H01L2924/12032 , H01L2924/12041 , H01L2924/12042 , H01L2924/1301 , H01L2924/13055 , H01L2924/13091 , H01L2924/15747 , H01L2924/15788 , H01L2924/181 , H01L2224/45099 , H01L2924/00012 , H01L2924/00
Abstract: 本发明提供一种粘接剂组合物，其为包含含有银原子的银粒子和含有金属锌的锌粒子的粘接剂组合物，相对于该粘接剂组合物的固体成分中的全部过渡金属原子，银原子的含量大于或等于90质量％，锌原子的含量大于或等于0.01质量％且小于或等于0.6质量％。
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公开(公告)号：CN104379689A
公开(公告)日：2015-02-25
申请号：CN201380031406.X
申请日：2013-06-14
Applicant: 日立化成株式会社
CPC classification number: C09J11/04 , C08K3/08 , C08K7/00 , C08K2003/0806 , C08K2003/0893 , C08K2201/001 , C09J1/00 , C09J9/02 , H01B1/22 , H01L23/49579 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/83 , H01L2224/2929 , H01L2224/29318 , H01L2224/29339 , H01L2224/29499 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2224/83203 , H01L2224/83862 , H01L2224/92247 , H01L2924/00014 , H01L2924/10253 , H01L2924/12032 , H01L2924/12041 , H01L2924/12042 , H01L2924/1301 , H01L2924/13055 , H01L2924/13091 , H01L2924/15747 , H01L2924/15788 , H01L2924/181 , H01L2224/45099 , H01L2924/00012 , H01L2924/00
Abstract: 本发明提供一种粘接剂组合物，其为包含含有银原子的银粒子和含有金属锌的锌粒子的粘接剂组合物，相对于该粘接剂组合物的固体成分中的全部过渡金属原子，银原子的含量大于或等于90质量％，锌原子的含量大于或等于0.01质量％且小于或等于0.6质量％。
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