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公开(公告)号：CN104962214A
公开(公告)日：2015-10-07
申请号：CN201510329938.2
申请日：2009-04-28
Applicant: 日立化成工业株式会社
IPC: C09J9/02 , C09J11/04 , C09J201/00 , H01L23/488 , H01L23/29 , H01L23/495
CPC classification number: H05K3/321 , C08K3/017 , C08K3/08 , C09J9/02 , C09J11/04 , H01L23/295 , H01L23/49513 , H01L24/05 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/83 , H01L24/92 , H01L33/62 , H01L2224/04026 , H01L2224/05639 , H01L2224/2731 , H01L2224/27318 , H01L2224/2732 , H01L2224/2929 , H01L2224/29294 , H01L2224/29324 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/2936 , H01L2224/29364 , H01L2224/29369 , H01L2224/2939 , H01L2224/2949 , H01L2224/32013 , H01L2224/32225 , H01L2224/32245 , H01L2224/32505 , H01L2224/45139 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/73265 , H01L2224/83192 , H01L2224/83439 , H01L2224/83464 , H01L2224/8384 , H01L2224/83862 , H01L2224/92247 , H01L2924/00014 , H01L2924/014 , H01L2924/0665 , H01L2924/09701 , H01L2924/10253 , H01L2924/12041 , H01L2924/12042 , H01L2924/14 , H01L2924/15747 , H01L2924/181 , H05K2201/0224 , H05K2203/1131 , Y10T428/2982 , H01L2924/00012 , H01L2224/29298 , H01L2924/00 , H01L2224/2919 , H01L2224/29101 , H01L2924/3512 , H01L2224/45099 , H01L2224/05599 , H01L2924/00011
Abstract: 本发明涉及连接材料和半导体装置。本发明提供一种连接材料，其特征在于，含有银粒子，所述银粒子用X射线光电子能谱法测定的氧的状态比率为10％以下，所述银粒子的平均粒径为0.1μm～50μm，所述银粒子是实施了除去其表面的氧化膜的处理以及实施了利用表面保护材料的表面处理的银粒子。
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公开(公告)号：CN102604559A
公开(公告)日：2012-07-25
申请号：CN201210016489.2
申请日：2009-04-28
Applicant: 日立化成工业株式会社
IPC: C09J9/02 , C09J11/04 , H01L21/60 , H01L23/29 , H01L23/495
CPC classification number: H05K3/321 , C08K3/017 , C08K3/08 , C09J9/02 , C09J11/04 , H01L23/295 , H01L23/49513 , H01L24/05 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/83 , H01L24/92 , H01L33/62 , H01L2224/04026 , H01L2224/05639 , H01L2224/2731 , H01L2224/27318 , H01L2224/2732 , H01L2224/2929 , H01L2224/29294 , H01L2224/29324 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/2936 , H01L2224/29364 , H01L2224/29369 , H01L2224/2939 , H01L2224/2949 , H01L2224/32013 , H01L2224/32225 , H01L2224/32245 , H01L2224/32505 , H01L2224/45139 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/73265 , H01L2224/83192 , H01L2224/83439 , H01L2224/83464 , H01L2224/8384 , H01L2224/83862 , H01L2224/92247 , H01L2924/00014 , H01L2924/014 , H01L2924/0665 , H01L2924/09701 , H01L2924/10253 , H01L2924/12041 , H01L2924/12042 , H01L2924/14 , H01L2924/15747 , H01L2924/181 , H05K2201/0224 , H05K2203/1131 , Y10T428/2982 , H01L2924/00012 , H01L2224/29298 , H01L2924/00 , H01L2224/2919 , H01L2224/29101 , H01L2924/3512 , H01L2224/45099 , H01L2224/05599 , H01L2924/00011
Abstract: 本发明涉及连接材料和半导体装置，本发明提供的连接材料，其特征在于，其是含有粘合剂(A)、填料(B)以及添加剂(C)的连接材料，把所述填料(B)和所述添加剂(C)按照与所述连接材料中的重量比相同的重量比来进行混合、加热成型而得到的成型体的热导率为40W/mK以上。
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公开(公告)号：CN102017016A
公开(公告)日：2011-04-13
申请号：CN200980115161.2
申请日：2009-04-28
Applicant: 日立化成工业株式会社
CPC classification number: H05K3/321 , C08K3/017 , C08K3/08 , C09J9/02 , C09J11/04 , H01L23/295 , H01L23/49513 , H01L24/05 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/83 , H01L24/92 , H01L33/62 , H01L2224/04026 , H01L2224/05639 , H01L2224/2731 , H01L2224/27318 , H01L2224/2732 , H01L2224/2929 , H01L2224/29294 , H01L2224/29324 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/2936 , H01L2224/29364 , H01L2224/29369 , H01L2224/2939 , H01L2224/2949 , H01L2224/32013 , H01L2224/32225 , H01L2224/32245 , H01L2224/32505 , H01L2224/45139 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/73265 , H01L2224/83192 , H01L2224/83439 , H01L2224/83464 , H01L2224/8384 , H01L2224/83862 , H01L2224/92247 , H01L2924/00014 , H01L2924/014 , H01L2924/0665 , H01L2924/09701 , H01L2924/10253 , H01L2924/12041 , H01L2924/12042 , H01L2924/14 , H01L2924/15747 , H01L2924/181 , H05K2201/0224 , H05K2203/1131 , Y10T428/2982 , H01L2924/00012 , H01L2224/29298 , H01L2924/00 , H01L2224/2919 , H01L2224/29101 , H01L2924/3512 , H01L2224/45099 , H01L2224/05599 , H01L2924/00011
Abstract: 本发明的目的是提供一种即使在不施加载荷并且在200℃以下的固化温度下进行接合的情况下，也具有高的热导率，而且即使在260℃对固化物进行加热的情况下，也然具有充分的粘接强度的连接材料以及使用它的半导体装置。本发明提供一种含有用X射线光电子能谱法测定的氧的状态比率为小于15％的金属粒子的连接材料，特别是含有实施了除去其表面的氧化膜的处理以及实施了利用表面保护材料的表面处理的金属粒子的连接材料。
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公开(公告)号：CN1993774A
公开(公告)日：2007-07-04
申请号：CN200580025605.5
申请日：2005-07-29
Applicant: 日立化成工业株式会社
Abstract: 本发明的导电糊料为含有导电粉及粘合剂成分的导电糊料，其特征为，该导电粉是由铜粉或铜合金粉表面部分以银被覆的金属粉所构成，且为由略为球状的该金属粉与扁平状的该金属粉的混合物、或为略为球状或扁平状的该金属粉的单独粉所构成，粘合剂成分为含有环氧树脂与具有羟基的咪唑化合物的混合物，或为含有环氧树脂与具有羧基的咪唑化合物的混合物。
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