Invention Application
- Patent Title: ANTENNA MODULE CONFIGURATIONS
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Application No.: US16145100Application Date: 2018-09-27
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Publication No.: US20190103653A1Publication Date: 2019-04-04
- Inventor: Seong Heon JEONG , Rajneesh KUMAR , Mohammad Ali TASSOUDJI , Darryl JESSIE , Gurkanwal SAHOTA , Kevin Hsi Huai WANG , Jeong KIM, II , Taesik YANG , Thomas MYERS , Neil BURNS , Julio ZEGARRA , Clinton James WILBER , Jordan SZABO
- Applicant: QUALCOMM Incorporated
- Main IPC: H01Q1/22
- IPC: H01Q1/22 ; H01Q1/52 ; H01L23/552 ; H01L23/66 ; H01L23/64 ; H01L23/28

Abstract:
An antenna module is described. The antenna module include a ground plane in a multilayer substrate. The antenna module also includes a mold on the multilayer substrate. The antenna module further includes a conductive wall separating a first portion of the mold from a second portion of the mold. The conductive wall is electrically coupled to the ground plane. A conformal shield may be placed on a surface of the second portion of the mold. The conformal shield is electrically coupled to the ground plane.
Public/Granted literature
- US11245175B2 Antenna module configurations Public/Granted day:2022-02-08
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