- 专利标题: Semiconductor device and method for manufacturing semiconductor device
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申请号: US16952725申请日: 2020-11-19
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公开(公告)号: US10998398B2公开(公告)日: 2021-05-04
- 发明人: Michio Nemoto , Takashi Yoshimura
- 申请人: FUJI ELECTRIC CO., LTD.
- 申请人地址: JP Kawasaki
- 专利权人: FUJI ELECTRIC CO., LTD.
- 当前专利权人: FUJI ELECTRIC CO., LTD.
- 当前专利权人地址: JP Kawasaki
- 代理机构: Rossi, Kimms & McDowell LLP
- 优先权: JP2009-251944 20091102
- 主分类号: H01L29/06
- IPC分类号: H01L29/06 ; H01L29/66 ; H01L29/739 ; H01L29/861 ; H01L29/868 ; H01L29/885 ; H01L29/32 ; H01L29/36 ; H01L29/08 ; H01L29/10 ; H01L21/263 ; H01L21/322 ; H01L21/268
摘要:
A semiconductor device includes a plurality of broad buffer layers provided in a drift layer. Each of the plurality of the broad buffer layers has an impurity concentration exceeding that of a portion of the drift layer excluding the broad buffer layers, and has a mountain-shaped impurity concentration distribution in which a local maximum value is less than the impurity concentration of an anode layer and a cathode layer. The plurality of broad buffer layers are disposed at different depths from a first main surface of the drift layer, respectively, the number of broad buffer layers close to the first main surface from the intermediate position of the drift layer is at least one, and number of broad buffer layers close to a second main surface of the drift layer from the intermediate position of the drift layer is at least two. The broad buffer layer includes a hydrogen-related donor.
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