- 专利标题: Gate-all-around fin device
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申请号: US15819486申请日: 2017-11-21
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公开(公告)号: US10388793B2公开(公告)日: 2019-08-20
- 发明人: John B. Campi, Jr. , Robert J. Gauthier, Jr. , Rahul Mishra , Souvick Mitra , Mujahid Muhammad
- 申请人: INTERNATIONAL BUSINESS MACHINES CORPORATION
- 申请人地址: US NY Armonk
- 专利权人: INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人: INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人地址: US NY Armonk
- 代理机构: Roberts Mlotkowski Safran Cole & Calderon, P.C.
- 代理商 Steven J. Meyers; Andrew M. Calderon
- 主分类号: H01L29/78
- IPC分类号: H01L29/78 ; H01L29/66 ; B29C48/21 ; B29C48/49 ; H01L29/423 ; H01L29/06 ; H01L29/10 ; H01L29/08 ; B29C37/00 ; B32B3/08 ; B32B7/02 ; B32B27/00 ; B32B27/08 ; B32B27/28 ; B32B27/30 ; B32B27/32 ; B32B27/34 ; B32B27/36 ; H01G4/005 ; H01G4/14 ; H01G4/228 ; H01G4/30 ; H01G4/33 ; H01L21/8234 ; H01L21/265 ; H01L21/266 ; H01L27/088 ; B29K23/00 ; B29K105/16 ; B29K507/04 ; B29L9/00 ; B29L31/34
摘要:
A gate-all around fin double diffused metal oxide semiconductor (DMOS) devices and methods of manufacture are disclosed. The method includes forming a plurality of fin structures from a substrate. The method further includes forming a well of a first conductivity type and a second conductivity type within the substrate and corresponding fin structures of the plurality of fin structures. The method further includes forming a source contact on an exposed portion of a first fin structure. The method further comprises forming drain contacts on exposed portions of adjacent fin structures to the first fin structure. The method further includes forming a gate structure in a dielectric fill material about the first fin structure and extending over the well of the first conductivity type.
公开/授权文献
- US20180076328A1 GATE-ALL-AROUND FIN DEVICE 公开/授权日:2018-03-15
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