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公开(公告)号：US20240359968A1
公开(公告)日：2024-10-31
申请号：US18689085
申请日：2022-07-23
发明人： Raj CN Thiagarajan
CPC分类号： B81B3/0021 , B81C1/00182 , H04R19/005 , B81B2203/0127 , B81B2203/04 , B81B2207/05
摘要： The present disclosure provides a Capacitive Micromachined Ultrasound Transducer cell, comprising a membrane (203, 303, 403), a substrate (204, 304, 404), a top electrode (201, 301, 401) in contact with the membrane (203, 303, 403), a bottom electrode (202, 302, 402) in contact with the substrate (204, 304, 404) and a layer (206, 306, 406) of material filled in the Capacitive Micromachined Ultrasound Transducer cell extending from the membrane (203, 303, 403), thereby eliminating a gap.
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公开(公告)号：US20240334132A1
公开(公告)日：2024-10-03
申请号：US18293513
申请日：2022-07-27
发明人： Quanbo Zou , Guanxun Qiu , Zhe Wang , Qinglin Song
CPC分类号： H04R19/04 , B81B3/0021 , H04R1/028 , H04R7/04 , H04R7/18 , H04R19/005 , B81B2201/0257 , B81B2203/0127 , B81B2203/0307 , B81B2203/04 , B81B2207/012 , H04R2201/003 , H04R2499/11
摘要： A MEMS microphone, a microphone unit and an electronic device are disclosed by the present disclosure. The micro-electro-mechanical system microphone comprises: a substrate; a back electrode plate comprising a supporting structure; and a diaphragm located between the substrate and the back electrode plate, wherein the supporting structure comprises a supporting portion used for supporting a periphery of a diaphragm, and a supporting electrode being insulated from the supported diaphragm, and wherein the diaphragm is a stress-free film when being applied no bias, and when being applied a bias, the supporting electrode constrains the periphery of the diaphragm on the supporting portion through electrostatic interaction so as to support the diaphragm in a clamped manner.
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公开(公告)号：US12047744B2
公开(公告)日：2024-07-23
申请号：US17240752
申请日：2021-04-26
发明人： Stephan Pohlner , Christoph Eggs , Stefan Freisleben , Matthias Jungkunz , Thomas Telgmann , Marc Esquius Morote , Ilya Lukashov , Marcel Giesen
CPC分类号： H04R19/005 , H04R31/006 , H04R2499/11
摘要： Electroacoustic devices with a capacitive element and methods for fabricating such electroacoustic devices. An example method includes forming an acoustic device above a first region of a substrate, and forming a capacitive element above a second region of the substrate and adjacent to the acoustic device. The forming of the capacitive element may include forming a protective layer above the substrate where a first portion of the protective layer is above the second region of the substrate and a second portion of the protective layer is above the first region of the substrate, forming a dielectric region above the protective layer, and forming an electrode above the dielectric region. The dielectric region may include a different material than the protective layer.
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公开(公告)号：US12007520B2
公开(公告)日：2024-06-11
申请号：US17368846
申请日：2021-07-07
发明人： Katsuhiko Nakano , Shinya Tahara , Masaki Nasu
IPC分类号： G01V3/08 , B06B1/02 , B60R21/015 , G01D5/241 , H04R19/00
CPC分类号： G01V3/088 , B06B1/0292 , B60R21/01552 , G01D5/241 , H04R19/00
摘要： Provided is an electrostatic transducer capable of reducing thickness and enhancing detection precision or operation precision. An electrostatic transducer (1) includes an insulating sheet (11), a first electrode sheet (12) arranged on the front surface side of the insulating sheet (11) and having a plurality of first through holes (12a) penetrating in a thickness direction, and a second electrode sheet (13) arranged on the back surface side of the insulating sheet (11) and having no through holes in the thickness direction or having a plurality of second through holes (13a) which have a smaller aperture ratio than the plurality of first through holes (12a).
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公开(公告)号：US11913827B1
公开(公告)日：2024-02-27
申请号：US17954728
申请日：2022-09-28
发明人： Qin Zhou , Alexander K. Zettl
CPC分类号： G01H11/06 , G01S15/104 , G08B1/08 , H04R19/005 , G01H3/12 , G06F3/0325
摘要： This disclosure provides systems, methods, and apparatus related to an ultrasonic microphone and an ultrasonic acoustic radio. In one aspect a system includes a transmitter and a receiver. The receiver comprises a membrane. The membrane comprises a single layer or multiple layers of a two-dimensional material. The receiver is operable to receive sound waves in a frequency range, with the frequency range being the ultrasonic frequency range.
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公开(公告)号：US11863933B2
公开(公告)日：2024-01-02
申请号：US17484115
申请日：2021-09-24
CPC分类号： H04R19/005 , B81B7/008 , B81B2201/0257 , H04R2201/003
摘要： A MEMS device includes a MEMS sound transducer, and control circuitry. The control circuitry includes a supply signal provider for providing a high-level supply signal and read-out circuitry for receiving an output signal from the MEMS sound transducer, and a switching arrangement for selectively connecting the MEMS sound transducer to the supply signal provider, and for selectively connecting the MEMS sound transducer to the read-out circuitry based on a control signal. The control circuitry provides the control signal having an ultrasonic actuation pattern to the switching arrangement during a first condition TX of the control signal, wherein the ultrasonic actuation pattern of the control signal triggers the switching arrangement for alternately coupling the high-level supply signal to the MEMS sound transducer.
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公开(公告)号：US20230412989A1
公开(公告)日：2023-12-21
申请号：US18320000
申请日：2023-05-18
申请人： VERMON SA
CPC分类号： H04R19/005 , H04R17/10 , H04R31/006
摘要： A method of manufacturing a CMUT transducer includes: a) forming a first silicon oxide layer on a face of a first silicon layer defining a first electrode of the transducer; b) forming a second silicon oxide layer on a face of a second silicon layer; c) subsequent to step a), forming, at the side of said face of the first silicon layer, by locally oxidizing the silicon of the first silicon layer, silicon oxide walls; and d) subsequent to steps b) and c), transferring and attaching the set comprising the second silicon layer and the second silicon oxide layer on the set comprising the first silicon layer, the first silicon oxide layer, and the silicon oxide walls.
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公开(公告)号：US20230370785A1
公开(公告)日：2023-11-16
申请号：US18026235
申请日：2021-02-07
发明人： Yunlong Wang , Guanghua Wu , Xingshuo Lan
CPC分类号： H04R19/04 , H04R19/005
摘要： Embodiments of the present application provide a silicon based microphone apparatus and an electronic device. The silicon based microphone apparatus comprises: a circuit board provided with at least one sound inlet hole; a shielding cover covering one side of the circuit board to form an acoustic cavity; at least two differential silicon based microphone chips arranged on one side of the circuit board and located within the acoustic cavity, back cavities of some differential silicon based microphone chips being communicated with the sound inlet holes in one-to-one correspondence; and a separator located within the acoustic cavity and used for separating the acoustic cavity into sub-acoustic cavities corresponding to the back cavities of at least some adjacent differential silicon based microphone chips. According to the embodiments of the present application, a sound pickup structure comprising at least two differential silicon based microphone chips is used, so that noise reduction can be achieved and the quality of an output audio signal can be improved; the separator in the acoustic cavity can effectively reduce interference caused by sound waves on other differential silicon based microphone chips, can effectively improve the sound pickup precision of the differential microphone chips, and can further improve the quality of the audio signal output by the silicon based microphone apparatus.
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公开(公告)号：US11814284B2
公开(公告)日：2023-11-14
申请号：US16825593
申请日：2020-03-20
发明人： Roberto Brioschi , Rkia Achehboune
CPC分类号： B81C1/0023 , B81B3/0021 , B81C1/00253 , H01L24/19 , H04R19/005 , B81B2201/0257 , B81B2201/0264 , B81B2203/0127 , H01L2924/1461 , H04R2201/003
摘要： The application relates to structures, e.g. substrates for supporting semiconductor die. The substrate defines a frame which lateral surrounds one or more die and is provided in contact with at least one side surface of the die, wherein the frame defines upper and lower surfaces of the substrate.
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公开(公告)号：US20230353949A1
公开(公告)日：2023-11-02
申请号：US17922874
申请日：2021-02-07
发明人： Yunlong Wang , Guanghua Wu , Xingshuo Lan
CPC分类号： H04R19/005 , H04R19/04 , H04R3/005 , H04R2307/023 , H04R2410/03
摘要： Provided are a silicon-based microphone device and an electronic apparatus. The silicon-based microphone device comprises: a circuit board, provided with at least two sound inlets; a shielding housing, covering one side of the circuit board; an even number of differential silicon-based microphone chips, which are arranged within an acoustic cavity, between every two differential silicon-based microphone chips, a first microphone structure of either differential silicon-based microphone chip being electrically connected to a second microphone structure of the other differential silicon-based microphone chip, and the second microphone structure of either differential silicon-based microphone chip being electrically connected to the first microphone structure of the other differential silicon-based microphone chip; and, a mounting plate, provided with at least one opening, the opening being in communication with some of the sound inlets.
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