公开(公告)号：US20240334132A1

公开(公告)日：2024-10-03

申请号：US18293513

申请日：2022-07-27

Applicant: GOERTEK MICROELECTRONICS INC.

Inventor： Quanbo Zou ,  Guanxun Qiu ,  Zhe Wang ,  Qinglin Song

IPC: H04R19/04 ,  B81B3/00 ,  H04R1/02 ,  H04R7/04 ,  H04R7/18 ,  H04R19/00

CPC classification number: H04R19/04 ,  B81B3/0021 ,  H04R1/028 ,  H04R7/04 ,  H04R7/18 ,  H04R19/005 ,  B81B2201/0257 ,  B81B2203/0127 ,  B81B2203/0307 ,  B81B2203/04 ,  B81B2207/012 ,  H04R2201/003 ,  H04R2499/11

Abstract: A MEMS microphone, a microphone unit and an electronic device are disclosed by the present disclosure. The micro-electro-mechanical system microphone comprises: a substrate; a back electrode plate comprising a supporting structure; and a diaphragm located between the substrate and the back electrode plate, wherein the supporting structure comprises a supporting portion used for supporting a periphery of a diaphragm, and a supporting electrode being insulated from the supported diaphragm, and wherein the diaphragm is a stress-free film when being applied no bias, and when being applied a bias, the supporting electrode constrains the periphery of the diaphragm on the supporting portion through electrostatic interaction so as to support the diaphragm in a clamped manner.