发明公开
- 专利标题: MICRO-ELECTRO-MECHANICAL SYSTEM MICROPHONE, MICROPHONE UNIT AND ELECTRONIC DEVICE
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申请号: US18293513申请日: 2022-07-27
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公开(公告)号: US20240334132A1公开(公告)日: 2024-10-03
- 发明人: Quanbo Zou , Guanxun Qiu , Zhe Wang , Qinglin Song
- 申请人: GOERTEK MICROELECTRONICS INC.
- 申请人地址: CN Qingdao Shandong
- 专利权人: GOERTEK MICROELECTRONICS INC.
- 当前专利权人: GOERTEK MICROELECTRONICS INC.
- 当前专利权人地址: CN Qingdao Shandong
- 优先权: CN 2110875302.3 2021.07.30
- 国际申请: PCT/CN2022/108092 2022.07.27
- 进入国家日期: 2024-01-30
- 主分类号: H04R19/04
- IPC分类号: H04R19/04 ; B81B3/00 ; H04R1/02 ; H04R7/04 ; H04R7/18 ; H04R19/00
摘要:
A MEMS microphone, a microphone unit and an electronic device are disclosed by the present disclosure. The micro-electro-mechanical system microphone comprises: a substrate; a back electrode plate comprising a supporting structure; and a diaphragm located between the substrate and the back electrode plate, wherein the supporting structure comprises a supporting portion used for supporting a periphery of a diaphragm, and a supporting electrode being insulated from the supported diaphragm, and wherein the diaphragm is a stress-free film when being applied no bias, and when being applied a bias, the supporting electrode constrains the periphery of the diaphragm on the supporting portion through electrostatic interaction so as to support the diaphragm in a clamped manner.
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