公开(公告)号：US20240334132A1

公开(公告)日：2024-10-03

申请号：US18293513

申请日：2022-07-27

申请人： GOERTEK MICROELECTRONICS INC.

发明人： Quanbo Zou ,  Guanxun Qiu ,  Zhe Wang ,  Qinglin Song

IPC分类号： H04R19/04 ,  B81B3/00 ,  H04R1/02 ,  H04R7/04 ,  H04R7/18 ,  H04R19/00

CPC分类号： H04R19/04 ,  B81B3/0021 ,  H04R1/028 ,  H04R7/04 ,  H04R7/18 ,  H04R19/005 ,  B81B2201/0257 ,  B81B2203/0127 ,  B81B2203/0307 ,  B81B2203/04 ,  B81B2207/012 ,  H04R2201/003 ,  H04R2499/11

摘要： A MEMS microphone, a microphone unit and an electronic device are disclosed by the present disclosure. The micro-electro-mechanical system microphone comprises: a substrate; a back electrode plate comprising a supporting structure; and a diaphragm located between the substrate and the back electrode plate, wherein the supporting structure comprises a supporting portion used for supporting a periphery of a diaphragm, and a supporting electrode being insulated from the supported diaphragm, and wherein the diaphragm is a stress-free film when being applied no bias, and when being applied a bias, the supporting electrode constrains the periphery of the diaphragm on the supporting portion through electrostatic interaction so as to support the diaphragm in a clamped manner.

公开(公告)号：US20230269506A1

公开(公告)日：2023-08-24

申请号：US18307411

申请日：2023-04-26

申请人： GOERTEK MICROELECTRONICS INC.

发明人： Huabin FANG ,  Luyu DUANMU

IPC分类号： H04R1/08 ,  H04R1/04 ,  H04R3/00

CPC分类号： H04R1/08 ,  H04R1/04 ,  H04R3/00

摘要： A vibration sensor module including: a substrate, a first casing, a vibration pickup unit, and a sensor unit. The first casing has an open end on the substrate, the first casing and the substrate are enclosed to form a sealing chamber, and the first casing includes a first top plate opposite to the substrate. The vibration pickup unit is arranged in the sealing chamber, the vibration pickup unit includes a second casing with an open end and an elastic vibration pickup member arranged in the second casing, the open end of the second casing is arranged on the substrate or the first top plate, and the second casing is provided with a vibration transmission through hole. The sensor unit includes a sensor chip arranged on an outer surface of the second casing, and a back cavity of the sensor chip corresponds to the vibration transmission through hole.

公开(公告)号：US20240151576A1

公开(公告)日：2024-05-09

申请号：US18417006

申请日：2024-01-19

申请人： GOERTEK MICROELECTRONICS INC.

发明人： Luyu Duanmu ,  Junyu Tian ,  Huabin Fang

IPC分类号： G01H11/08

CPC分类号： G01H11/08 ,  H04R7/00 ,  H04R2201/003

摘要： Disclosed are a vibration sensor and an electronic equipment. The vibration sensor includes a circuit board assembly, a shell, a vibration pick-up assembly, a support shell and a chip assembly. The shell is configured to cover a side of the circuit board assembly to form an installation space. The vibration pick-up assembly is provided in the installation space, and is configured to pick up an external bone vibration and generate a response vibration. The support shell is connected to a side of the vibration pick-up assembly away from the circuit board assembly. The chip assembly is connected to a side of the support shell away from the circuit board assembly, and is electrically connected to the circuit board assembly. The vibration pick-up assembly, the support shell and the chip assembly are enclosed to form a conduction cavity.