公开(公告)号：US12073955B2

公开(公告)日：2024-08-27

申请号：US16883629

申请日：2020-05-26

Applicant: THE BOEING COMPANY

Inventor： Patrick J. Kinlen ,  Daniel A. Charles

IPC: H01B1/12 ,  B32B27/08 ,  B64D45/02 ,  C09D5/24 ,  C09D7/40 ,  C09D7/61 ,  C09D7/62 ,  C09D125/18 ,  C09D133/00 ,  C09D153/00 ,  C09D163/00 ,  C09D165/00 ,  C09D175/04 ,  C09D179/02 ,  H01B1/04

CPC classification number: H01B1/124 ,  B32B27/08 ,  B64D45/02 ,  C09D5/24 ,  C09D7/61 ,  C09D7/62 ,  C09D7/70 ,  C09D125/18 ,  C09D133/00 ,  C09D153/00 ,  C09D163/00 ,  C09D165/00 ,  C09D175/04 ,  C09D179/02 ,  H01B1/04 ,  H01B1/127 ,  H01B1/128 ,  B32B2264/108 ,  B32B2307/302 ,  B32B2313/04

Abstract: Methods of forming an electrically conductive carbon allotrope material comprise depositing a first material comprising a polymer and a sulfonic acid onto a carbon allotrope material to form a second material. The methods comprise curing the second material. Methods of heating a surface of a vehicle component comprise applying a voltage to a material comprising a carbon allotrope material, a polymer, and a sulfonic acid. The material is disposed on a surface of a vehicle component. Electrically conductive materials comprise at least one polymer, at least one sulfonic acid, and a carbon allotrope material.

公开(公告)号：US11820840B2

公开(公告)日：2023-11-21

申请号：US18187584

申请日：2023-03-21

Applicant: Kioxia Corporation

Inventor： Norikatsu Sasao ,  Koji Asakawa ,  Shinobu Sugimura

IPC: C08F20/30 ,  C07C69/76 ,  H01L21/027 ,  C09D125/18 ,  C09D133/14 ,  C08F12/22

CPC classification number: C08F20/30 ,  C07C69/76 ,  C08F12/22 ,  C09D125/18 ,  C09D133/14 ,  H01L21/0271

Abstract: A pattern forming material is configured to use for forming an organic film on a film to be processed, patterning the organic film, and then forming a composite film by infiltrating a metallic compound into the patterned organic film. The pattern forming material contains a polymer including a monomer unit represented by a general formula (3) described below,




where R21 is H or CH3, each R22 is a hydrocarbon group of C2-14 where a carbon is primary carbon, secondary carbon or tertiary carbon, Q is a single bond or a hydrocarbon group of C1-20 carbon atoms which may include an oxygen atom, a nitrogen atom, or a sulfur atom between carbon-carbon atoms of or at a bond terminal, and a halogen atom may be substituted for the hydrogen atom.

公开(公告)号：US20230212414A1

公开(公告)日：2023-07-06

申请号：US18090522

申请日：2022-12-29

Applicant: eChem Solutions Corp.

Inventor： Yu-Ning Chen ,  Shao-Li Ho ,  Jia Jheng Lin ,  Hui-Ju Chen

IPC: C09D125/18 ,  C09D161/06 ,  C09D5/00 ,  C09D7/20 ,  C09D7/45 ,  C09D7/65 ,  C09D7/63

CPC classification number: C09D125/18 ,  C09D161/06 ,  C09D5/00 ,  C09D7/20 ,  C09D7/45 ,  C09D7/65 ,  C09D7/63

Abstract: A resin composition, an anti-etching layer and an etching method are provided. The resin composition includes a resin (A), a crosslinking agent (B), a surfactant (C), and a solvent (D). The resin (A) includes a hydroxyl type polystyrene resin (A-1), a hydroxyl type phenolic resin (A-2), a polyhydroxy phenol resin (A-3), or a combination thereof. The crosslinking agent (B) includes a structure of novolac epoxy resin type (B-1), polymethyl methacrylate type (B-2), maleimide type (B-3) or hyperbranched oligomer (B-4).

公开(公告)号：US20230159766A1

公开(公告)日：2023-05-25

申请号：US17916899

申请日：2021-03-24

Applicant: SHIN-ETSU CHEMICAL CO., LTD.

Inventor： Takayuki NAGASAWA ,  Jun HATAKEYAMA

IPC: C09D5/24 ,  C08F220/38 ,  C08F212/14 ,  C08K5/17 ,  C09D7/20 ,  C09D7/63 ,  C09D7/45 ,  C09D133/16 ,  C09D125/18 ,  C09D11/52 ,  C09D11/38 ,  C09D11/107 ,  C09D11/033 ,  H10K85/10 ,  H10K71/13

CPC classification number: C09D5/24 ,  C08F220/382 ,  C08F212/30 ,  C08F212/24 ,  C08K5/175 ,  C09D7/20 ,  C09D7/63 ,  C09D7/45 ,  C09D133/16 ,  C09D125/18 ,  C09D11/52 ,  C09D11/38 ,  C09D11/107 ,  C09D11/033 ,  H10K85/151 ,  H10K85/141 ,  H10K85/113 ,  H10K71/135 ,  H10K50/17

Abstract: A conductive polymer composition containing: a composite containing a π-conjugated polymer (A) and a polymer (B) shown by the following general formula (2); H2O (D) for dispersing the composite; and a water-soluble organic solvent (C). This provides a composition which has favorable filterability and film formability, and which is capable of relieving acidity and forming a conductive film with high transparency. Moreover, since the H2O dispersion of the conductive polymer compound is mixed with an organic solvent, the surface tension and the contact angle are so low that leveling property on a substrate is imparted. The composition is usable in droplet-coating methods. Since an organic solvent having a higher boiling point than H2O is used as the organic solvent, the composition can avoid solid content precipitation around a nozzle and solid content precipitation due to drying between ejecting the liquid material from a nozzle tip and landing on a substrate.

公开(公告)号：US20220389127A1

公开(公告)日：2022-12-08

申请号：US17621007

申请日：2020-09-18

Applicant: LG Chem, Ltd.

Inventor： Min Suk Jung ,  Jaesoon Bae ,  Youngju Park ,  Esder Kang ,  Byeong Yun Lim ,  Dowon Lim ,  Jaechol Lee ,  Hyunju Choi

IPC: C08F12/32 ,  C07C211/54 ,  C07D209/82 ,  C07D307/91 ,  H01L51/56 ,  C09D125/18 ,  H01L51/00

Abstract: The present specification relates to a polymer comprising a unit represented by Chemical Formula 1, a monomer represented by Chemical Formula 2, a coating composition comprising the same, an organic light emitting device formed using the same, and a method for manufacturing an organic light emitting device using the same: wherein the variables are described herein.

公开(公告)号：US20220169759A1

公开(公告)日：2022-06-02

申请号：US17485950

申请日：2021-09-27

Applicant: Mussel Polymers, Inc.

Inventor： Adam Gregg Malofsky ,  Bernard Miles Malofsky ,  Jason Andrew Stieg ,  David Schmidt

IPC: C08F12/24 ,  C09D125/18 ,  B05D7/14 ,  C08G59/68 ,  C08G18/62 ,  C08J7/04 ,  C08J7/043

Abstract: The disclosure relates to thin layers comprising a catechol containing polymer or oligomer, as well as methods of making and using the thin layers comprising the catechol containing polymer or oligomer. The layers demonstrate improved adhesion between two materials without substantial modification of the adhesive matrix.

公开(公告)号：US20220026806A1

公开(公告)日：2022-01-27

申请号：US17311965

申请日：2020-01-20

Applicant: NISSAN CHEMICAL CORPORATION

Inventor： Tokio NISHITA ,  Takafumi ENDO ,  Yuki ENDO ,  Takahiro KISHIOKA

IPC: G03F7/11 ,  C08F212/14 ,  C09D125/18 ,  C09D133/14 ,  C08F220/28 ,  H01L21/027

Abstract: A composition for forming a protective film having excellent resistance to a wet etching solution for semiconductors during a lithographic process in the manufacture of semiconductors; a method of forming a resist pattern using said protective film; and a method for manufacturing a semiconductor device. This composition for forming a protective film against a wet etching solution for semiconductors includes: a compound or polymer which contains at least one among an acetal structure and an amide structure; and a solvent. The polymer is preferably a copolymer of: a compound (a) containing at least one acetal structure in a molecule; and a compound (b) containing at least one amide structure in a molecule.

公开(公告)号：US20210175427A1

公开(公告)日：2021-06-10

申请号：US17047261

申请日：2019-08-16

Applicant: LG Chem, Ltd.

Inventor： Min Suk Jung ,  Esder Kang ,  Beomgoo Kang ,  Jaesoon Bae ,  Jaechol Lee ,  Jiyeon Shin ,  Seog Jae Seo ,  Hyungil Park ,  Byeong Yun Lim ,  Dowon Lim

IPC: H01L51/00 ,  C09D125/18 ,  C08F12/32 ,  C08F12/28 ,  C07C211/61 ,  C07D209/86 ,  C07C211/54 ,  C07D209/88 ,  C07D307/91

Abstract: The present specification relates to a polymer including a unit represented by Chemical Formula 1, a coating composition including the same, and an organic light emitting device formed using the same.

公开(公告)号：US20210130628A1

公开(公告)日：2021-05-06

申请号：US16635722

申请日：2018-05-09

Applicant: SHOWA DENKO K.K.

Inventor： Motoaki ARAKI ,  Takashi OKUBO

IPC: C09D5/24 ,  C09D7/63 ,  C09D7/65 ,  C09D125/18 ,  H01G9/00 ,  H01G9/025

Abstract: A method of manufacturing a solid electrolytic capacitor, including: a step (A) of providing a conjugated conductive polymer-containing dispersion by polymerizing, in a dispersion medium containing seed particles turned into protective colloid by a polyanion or in a dispersion medium containing the polyanion, a monomer for obtaining a conjugated conductive polymer; a step (B) of preparing a dispersion containing a morpholine compound and the conjugated conductive polymer by adding the morpholine compound to the conjugated conductive polymer-containing dispersion; a step (C) of causing the dispersion to adhere to a porous anode body formed of a valve metal having a dielectric film on a surface thereof; and a step (D) of forming a solid electrolyte layer by removing the dispersion medium from the dispersion containing the morpholine compound and the conjugated conductive polymer, the dispersion adhering to the porous anode body.

公开(公告)号：US10824073B2

公开(公告)日：2020-11-03

申请号：US16043283

申请日：2018-07-24

Applicant: JSR CORPORATION

Inventor： Katsuaki Nishikori ,  Hayato Namai

IPC: G03F7/004 ,  G03F7/039 ,  G03F7/038 ,  G03F7/16 ,  G03F7/20 ,  G03F7/32 ,  G03F7/38 ,  C08F12/22 ,  C09D125/18 ,  C08F2/48 ,  C08F220/18 ,  C08F220/28 ,  C08F220/36 ,  C08F220/38 ,  C08F212/14 ,  C08F220/16

Abstract: A radiation-sensitive resin composition includes a first compound represented by formula (1), a first polymer comprising an acid-labile group, and a radiation-sensitive acid generator other than the first compound. The radiation-sensitive acid generator includes an onium salt compound. In the formula (1), n is 2 or 3; m is 1 or 2; Y+ represents a monovalent radiation-sensitive onium cation; and L represents a single bond or an organic group having a valency of n. L includes linking moieties each linking two of the carboxylate groups in formula (1). Number of atom(s) included in a linking moiety having a minimum number of bonds among the linking moieties is 0 to 10. In a case where L represents a single bond, n is 2, and in a case where n is 2, m is 1.