-
1.发明授权公开(公告)号：US11851597B2
公开(公告)日：2023-12-26
申请号：US17241086
申请日：2021-04-27
发明人： Yu-Ning Chen , Ming-Che Chung
摘要： An etchant composition, a tackifier, an alkaline solution, a method of removing polyimide and an etching process are provided. The etchant composition includes a tackifier (A) and an alkaline solution (B). The tackifier (A) includes a resin containing a hydroxyl group (a), a surfactant (b) and a first solvent (c1). The alkaline solution (B) includes an alkaline compound (d) and a second solvent (c2).
-
公开(公告)号：US20230323134A1
公开(公告)日：2023-10-12
申请号：US18297001
申请日：2023-04-07
发明人： Hsiao-Chi Chiu , Jui-Yu Hsu
IPC分类号： C09D4/06 , C09D133/10 , C09D7/48 , C09D7/63 , C09D7/45
CPC分类号： C09D4/06 , C09D133/10 , C09D7/48 , C09D7/63 , C09D7/45
摘要： A photosensitive resin composition and a cured product are provided. The photosensitive resin composition includes an alkali-soluble resin (A), polymerizable monomer (B), an antioxidant (C), a photoinitiator (D) and a solvent (E). The weight average molecular weight of the alkali-soluble resin (A) is 5,000 to 40,000. The polymerizable monomer (B) includes an ethylenically unsaturated monomer (B1), an epoxy monomer (B2) or the combination thereof. The alkali-soluble resin (A) includes at least one of a structural unit represented by following Formula (A-1) to Formula (A-4).
In Formula (A-1) to Formula (A-4), the definition of R1 to R3, m, n and * are the same as defined in the detailed description.-
公开(公告)号：US11603426B2
公开(公告)日：2023-03-14
申请号：US17238207
申请日：2021-04-23
发明人： Hsiao-Jen Lai , Yu-Chun Chen
IPC分类号： C08F283/00 , C08K3/32 , C08K3/105 , C08K5/134 , C08K5/18 , C08K5/524 , G02F1/1335 , C08K5/36 , B82Y20/00
摘要： A resin composition, a light conversion layer and a light emitting device are provided. The resin composition includes a quantum dot (A), an alkali-soluble resin (B), an ethylenically unsaturated monomer (C), a photoinitiator (D), a solvent (E) and a phenyl-based compound (F). The phenyl-based compound (F) includes at least one of a compound represented by following Formula (F-1) and a compound represented by following Formula (F-2). Based on a total usage amount of the resin composition as 100 parts by weight, a usage amount of the phenyl-based compound (F) is 0.05 to 5 parts by weight. In Formula (F-1) and Formula (F-2), the definition of R1, R3, R4, Y, Z, m, n and p are the same as defined in the detailed description.
-
公开(公告)号：US20220275205A1
公开(公告)日：2022-09-01
申请号：US17352371
申请日：2021-06-21
发明人： Yung-Yu Lin , Chi-Yu Lai , Che-Wei Chang
摘要： A polyimide resin composition, a polyimide resin adhesive layer, a laminate, and a manufacturing method of an electronic component are provided. The polyimide resin composition includes a polyimide resin. The polyimide resin is obtained by the polymerization reaction of a diamine (A) and a tetracarboxylic dianhydride (B). The diamine (A) includes a diamine (A-1) represented by following Formula (I-1) and a diamine (A-2) represented by following Formula (I-2). A molar ratio ((A-1):(A-2)) of the diamine (A-1) to the diamine (A-2) is 0.1:0.2 to 0.6.
-
公开(公告)号：US11306220B2
公开(公告)日：2022-04-19
申请号：US16691618
申请日：2019-11-22
发明人： Zong-Hao Tang , Hsin-Jen Chen
摘要： A flexible encapsulating material, a method for preparing the flexible encapsulating material, and an encapsulating method using the flexible encapsulating material are provided. The flexible encapsulating material includes an epoxy resin represented by a Formula (1), a curing agent, and a curing accelerator and optionally includes a coupling agent, wherein based on 100 parts by weight of a total usage amount of the epoxy resin (A), the curing agent (B), and the curing accelerator (C), a usage amount of the epoxy resin (A) is 85 parts by weight or more, and based on 100 parts by weight of the usage amount of the epoxy resin (A), a usage amount of the coupling agent (D) is 0 to 5 parts by weight.
-
公开(公告)号：US11999868B2
公开(公告)日：2024-06-04
申请号：US17143159
申请日：2021-01-07
发明人： Yu-Wen Chen , Yi-Lun Chiu , Chia-Hao Lou , Chen-Wen Chiu
IPC分类号： C09D4/06 , C08F2/50 , C08F283/08 , C08F290/06 , C08G63/197 , C08K3/04 , C08K3/08 , G02B5/20 , B82Y20/00 , B82Y30/00 , B82Y40/00 , C08F2/44 , C08K3/22
CPC分类号： C09D4/06 , C08F2/50 , C08F283/08 , C08F290/067 , C08G63/197 , C08K3/04 , C08K3/08 , G02B5/20 , B82Y20/00 , B82Y30/00 , B82Y40/00 , C08F2/44 , C08K2003/0881 , C08K2003/2237 , C08K2201/005 , C09K2323/031 , C09D4/06 , C08F290/067 , C08F290/067 , C08F222/1006 , C08F283/08 , C08F222/1006
摘要： A resin composition and a filter element are provided. The resin composition includes a black coloring agent (A), an ethylenically-unsaturated monomer (B), a solvent (C), a resin (D), and a photoinitiator (E). The black coloring agent (A) includes a titanium black (A-1) and a carbon black (A-2). Based on a total usage amount of 100 parts by weight of the titanium black (A-1) and the carbon black (A-2), a usage amount of the titanium black (A-1) is 50 parts by weight to 75 parts by weight.
-
公开(公告)号：US20230212414A1
公开(公告)日：2023-07-06
申请号：US18090522
申请日：2022-12-29
发明人： Yu-Ning Chen , Shao-Li Ho , Jia Jheng Lin , Hui-Ju Chen
IPC分类号： C09D125/18 , C09D161/06 , C09D5/00 , C09D7/20 , C09D7/45 , C09D7/65 , C09D7/63
CPC分类号： C09D125/18 , C09D161/06 , C09D5/00 , C09D7/20 , C09D7/45 , C09D7/65 , C09D7/63
摘要： A resin composition, an anti-etching layer and an etching method are provided. The resin composition includes a resin (A), a crosslinking agent (B), a surfactant (C), and a solvent (D). The resin (A) includes a hydroxyl type polystyrene resin (A-1), a hydroxyl type phenolic resin (A-2), a polyhydroxy phenol resin (A-3), or a combination thereof. The crosslinking agent (B) includes a structure of novolac epoxy resin type (B-1), polymethyl methacrylate type (B-2), maleimide type (B-3) or hyperbranched oligomer (B-4).
-
公开(公告)号：US20220221789A1
公开(公告)日：2022-07-14
申请号：US17570314
申请日：2022-01-06
发明人： Chin-Chen Huang , Yu-Lun Li , Chen-Wen Chiu
摘要： A photosensitive resin composition for imprinting, a cured article and an optical element are provided. The photosensitive resin composition for imprinting includes a resin (A), an ethylenically unsaturated monomer (B), a photoinitiator (C), a solvent (D), and a hydrophobic oligomer (E). The resin (A) has a weight average molecular weight of 1,000 to 50,000 and has two or more ethylenic polymerizable groups.
-
公开(公告)号：US20210363283A1
公开(公告)日：2021-11-25
申请号：US17238207
申请日：2021-04-23
发明人： Hsiao-Jen Lai , Yu-Chun Chen
IPC分类号： C08F283/00 , C08K3/32 , C08K3/105 , C08K5/134 , C08K5/36 , C08K5/18 , C08K5/524 , G02F1/1335
摘要： A resin composition, a light conversion layer and a light emitting device are provided. The resin composition includes a quantum dot (A), an alkali-soluble resin (B), an ethylenically unsaturated monomer (C), a photoinitiator (D), a solvent (E) and a phenyl-based compound (F). The phenyl-based compound (F) includes at least one of a compound represented by following Formula (F-1) and a compound represented by following Formula (F-2). Based on a total usage amount of the resin composition as 100 parts by weight, a usage amount of the phenyl-based compound (F) is 0.05 to 5 parts by weight. In Formula (F-1) and Formula (F-2), the definition of R1, R3, R4, Y, Z, m, n and p are the same as defined in the detailed description.
-
公开(公告)号：US20210221946A1
公开(公告)日：2021-07-22
申请号：US17143159
申请日：2021-01-07
发明人： Yu-Wen Chen , Yi-Lun Chiu , Chia-Hao Lou , Chen-Wen Chiu
IPC分类号： C08G63/197 , C08F2/50 , G02B5/20 , C08K3/04 , C08K3/08
摘要： A resin composition and a filter element are provided. The resin composition includes a black coloring agent (A), an ethylenically-unsaturated monomer (B), a solvent (C), a resin (D), and a photoinitiator (E). The black coloring agent (A) includes a titanium black (A-1) and a carbon black (A-2). Based on a total usage amount of 100 parts by weight of the titanium black (A-1) and the carbon black (A-2), a usage amount of the titanium black (A-1) is 50 parts by weight to 75 parts by weight.
-
-
-
-
-
-
-
-
-
搜索结果
42 条记录 (耗时 0.015 秒)
