公开(公告)号：US20230323134A1

公开(公告)日：2023-10-12

申请号：US18297001

申请日：2023-04-07

申请人： eChem Solutions Corp.

发明人： Hsiao-Chi Chiu ,  Jui-Yu Hsu

IPC分类号： C09D4/06 ,  C09D133/10 ,  C09D7/48 ,  C09D7/63 ,  C09D7/45

CPC分类号： C09D4/06 ,  C09D133/10 ,  C09D7/48 ,  C09D7/63 ,  C09D7/45

摘要： A photosensitive resin composition and a cured product are provided. The photosensitive resin composition includes an alkali-soluble resin (A), polymerizable monomer (B), an antioxidant (C), a photoinitiator (D) and a solvent (E). The weight average molecular weight of the alkali-soluble resin (A) is 5,000 to 40,000. The polymerizable monomer (B) includes an ethylenically unsaturated monomer (B1), an epoxy monomer (B2) or the combination thereof. The alkali-soluble resin (A) includes at least one of a structural unit represented by following Formula (A-1) to Formula (A-4).




In Formula (A-1) to Formula (A-4), the definition of R1 to R3, m, n and * are the same as defined in the detailed description.

公开(公告)号：US20230324793A1

公开(公告)日：2023-10-12

申请号：US18297004

申请日：2023-04-07

申请人： eChem Solutions Corp.

发明人： Hsiao-Chi Chiu ,  Jui-Yu Hsu

IPC分类号： G03F7/029

CPC分类号： G03F7/029 ,  G03F7/0048

摘要： A photosensitive resin composition and a cured product are provided. The photosensitive resin composition includes an alkali-soluble resin (A), polymerizable monomer (B), a thermal acid generator (D), a photoinitiator (E) and a solvent (F). The weight average molecular weight of the alkali-soluble resin (A) is 5,000-40,000. The polymerizable monomer (B) includes an epoxy monomer (B1), ethylenically unsaturated monomer (B2) or the combination thereof. The thermal acid generator (D) includes hexafluoroonium salt. The epoxy monomer (B1) includes a compound represented by following Formula (B-1).




In Formula (B-1), the definition of X1 to X3 and Z4 to Z6 are the same as defined in the detailed description.