- 专利标题： PHOTOSENSITIVE RESIN COMPOSITION AND CURED PRODUCT
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申请号： US18297001申请日： 2023-04-07
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公开(公告)号： US20230323134A1公开(公告)日： 2023-10-12
- 发明人: Hsiao-Chi Chiu , Jui-Yu Hsu
- 申请人： eChem Solutions Corp.
- 申请人地址： TW Taoyuan
- 专利权人： eChem Solutions Corp.
- 当前专利权人： eChem Solutions Corp.
- 当前专利权人地址： TW Taoyuan
- 优先权： TW 1113395 2022.04.08
- 主分类号： C09D4/06
- IPC分类号： C09D4/06 ; C09D133/10 ; C09D7/48 ; C09D7/63 ; C09D7/45
摘要：
A photosensitive resin composition and a cured product are provided. The photosensitive resin composition includes an alkali-soluble resin (A), polymerizable monomer (B), an antioxidant (C), a photoinitiator (D) and a solvent (E). The weight average molecular weight of the alkali-soluble resin (A) is 5,000 to 40,000. The polymerizable monomer (B) includes an ethylenically unsaturated monomer (B1), an epoxy monomer (B2) or the combination thereof. The alkali-soluble resin (A) includes at least one of a structural unit represented by following Formula (A-1) to Formula (A-4).
In Formula (A-1) to Formula (A-4), the definition of R1 to R3, m, n and * are the same as defined in the detailed description.
In Formula (A-1) to Formula (A-4), the definition of R1 to R3, m, n and * are the same as defined in the detailed description.
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