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公开(公告)号：US12051887B2
公开(公告)日：2024-07-30
申请号：US17984263
申请日：2022-11-10
发明人： Chien-Shou Liao
IPC分类号： H01S5/22 , B23K1/005 , F21V19/00 , H01L23/00 , F21Y115/10 , H01L25/075 , H01L33/00 , H01L33/06
CPC分类号： H01S5/2228 , B23K1/0056 , F21V19/0015 , H01L24/16 , H01L24/75 , H01S5/2216 , F21Y2115/10 , H01L25/0753 , H01L33/0008 , H01L33/06 , H01L2224/16227 , H01L2224/75261
摘要： A method for soldering electronic components includes providing a circuit substrate; providing a plurality of electronic components; placing the plurality of electronic components onto the circuit substrate; applying a conductor between the plurality of electronic components and the circuit substrate; providing an energy source which projects an energy beam with a first coverage; enlarging the energy beam and projecting the energy beam onto the circuit substrate with a second coverage; and melting the conductor within the second coverage via the energy beam and fixing the corresponding electronic components on the circuit substrate through the melted conductor. Besides, a method for manufacturing a LED display is disclosed.
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公开(公告)号：US20240246162A1
公开(公告)日：2024-07-25
申请号：US18157443
申请日：2023-01-20
CPC分类号： B23K1/005 , B23K1/008 , B23K3/0653 , B23K3/08 , B23K2101/42
摘要： A wave soldering machine includes a housing, a conveyor that is movable with respect to the housing, a preheat module positioned along the conveyor, and a curtain module positioned at an entrance of the housing, the curtain module including at least one curtain and a heating element. A curtain module for a wave soldering machine or a reflow oven includes at least one curtain and a heating element. A method of containing an inert gas around a conveyor in a tunnel of a wave soldering machine or a reflow oven. In some embodiments, the method includes providing a curtain module at an end of the tunnel, the curtain module including at least one curtain and at least one heating element; and controlling a temperature of the heating element.
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公开(公告)号：US20240145618A1
公开(公告)日：2024-05-02
申请号：US18529581
申请日：2023-12-05
发明人： Zhiqiu GUO , Yidong HU , Yichao YAO
IPC分类号： H01L31/18 , B23K1/005 , H01L31/02 , H01L31/042
CPC分类号： H01L31/186 , B23K1/0056 , H01L31/02021 , H01L31/042
摘要： A photovoltaic module, including a laminate including a solder strip; and a junction box arranged on a surface of the laminate and including a plate connected to the solder strip by laser soldering. The plate has a first region and a second region, in which a region covered by the solder strip on the plate is the first region, and a region not covered by the solder strip on the plate is the second region. A soldering seam formed by laser soldering includes a first soldering seam and a second soldering seam. The first soldering seam is located in the first region, and the first soldering seam extends through the solder strip into the plate along a thickness direction of the laminate. The second soldering seam is located in the second region, and the second soldering seam extends directly into the plate along the thickness direction of the laminate.
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公开(公告)号：US20240071992A1
公开(公告)日：2024-02-29
申请号：US17950106
申请日：2022-09-22
发明人： Yen-Mu Chen
IPC分类号： H01L23/00 , B23K1/005 , B23K26/06 , B23K26/0622 , B23K26/351 , H01L25/065 , H01L25/075
CPC分类号： H01L24/98 , B23K1/0056 , B23K26/0608 , B23K26/0622 , B23K26/351 , H01L24/13 , H01L24/16 , H01L24/799 , H01L24/81 , H01L25/0655 , H01L25/0753 , H01L22/22 , H01L2224/13111 , H01L2224/16227 , H01L2224/7999 , H01L2224/98
摘要： A method for trimming a micro electronic element includes: providing a substrate, wherein at least one micro electronic element is disposed on the substrate, heating an interface of the substrate and the micro electronic element by a first pulse laser beam to reduce a bonding force between the micro electronic element and the substrate, and irradiating a surface layer of the micro electronic element by a second pulse laser beam to generate a shock wave due to plasma on the surface layer of the micro electronic element. The shock wave removes the micro electronic element away from the substrate. An apparatus for trimming a micro electronic element is also provided.
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公开(公告)号：US11908971B1
公开(公告)日：2024-02-20
申请号：US18078676
申请日：2022-12-09
发明人： Zhiqiu Guo , Yidong Hu , Yichao Yao
IPC分类号： H01L31/18 , H01L31/042 , H01L31/02 , B23K1/005
CPC分类号： H01L31/186 , B23K1/0056 , H01L31/02021 , H01L31/042
摘要： A photovoltaic module, including a laminate including a solder strip; and a junction box arranged on a surface of the laminate and including a plate connected to the solder strip by laser soldering. The plate has a first region and a second region, in which a region covered by the solder strip on the plate is the first region, and a region not covered by the solder strip on the plate is the second region. A soldering seam formed by laser soldering includes a first soldering seam and a second soldering seam. The first soldering seam is located in the first region, and the first soldering seam extends through the solder strip into the plate along a thickness direction of the laminate. The second soldering seam is located in the second region, and the second soldering seam extends directly into the plate along the thickness direction of the laminate.
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公开(公告)号：US20230411342A1
公开(公告)日：2023-12-21
申请号：US18240966
申请日：2023-08-31
发明人： Dong Hyeon Park , Min Ho Kim , Dong Su Ryu , Seok Ho Na , Choong Hoe Kim , Yun Seok Song , Woo Kyung Ju , Dong Joo Park
IPC分类号： H01L23/00 , B23K1/005 , B23K26/067 , B23K26/06
CPC分类号： H01L24/75 , H01L24/81 , B23K1/0056 , B23K26/067 , B23K26/0604 , B23K2101/40
摘要： In one example, a system comprises a laser assisted bonding (LAB) tool. The LAB tool comprises a stage block and a first lateral laser source facing the stage block from a lateral side of the stage block. The stage block is configured to support a substrate and a first electronic component coupled with the substrate, and the first electronic component comprises a first interconnect. The first lateral laser source is configured to emit a first lateral laser beam laterally toward the stage block to induce a first heat on the first interconnect to bond the first interconnect with the substrate. Other examples and related methods are also disclosed herein.
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公开(公告)号：US11827282B2
公开(公告)日：2023-11-28
申请号：US16931647
申请日：2020-07-17
发明人： Ki Eun Kim
IPC分类号： B62D33/023 , B23K26/323 , B23K26/242 , B23K3/08 , B23K1/005 , B23K101/00 , B23K103/10
CPC分类号： B62D33/023 , B23K1/0056 , B23K3/08 , B23K26/242 , B23K26/323 , B23K2101/006 , B23K2103/10
摘要： A component includes a first part in which a first junction part is configured, a second part in which a second junction part and a cross junction part intersecting the second junction part are configured. The second junction part and the first junction part are welded at a preceding weld. The component also includes a third part in which a third junction part is configured. A part of the third junction part is overlapped with an opposite part of the first junction part, a remaining part of the third junction part is overlapped with the cross junction part, and the first part and the second part are welded to the third part at a following weld at each of the overlapped parts.
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公开(公告)号：US11794265B2
公开(公告)日：2023-10-24
申请号：US16778189
申请日：2020-01-31
CPC分类号： B23K1/0056 , B23K1/0006 , B23K26/0093 , B23K35/282 , B23K1/19 , B23K2103/20
摘要： A method for providing a welded joint includes: providing a first metal sheet having a first melting point; providing a second metal sheet having a second melting point, the second melting point being lower than the first melting point; providing a weld material; and joining the first metal sheet and the second metal sheet together by means of the weld material, thus defining a first joining interface between the first metal sheet and the weld material and a second joining interface between the second metal sheet and the weld material. The joining includes heating the second metal sheet at the second joining interface to a temperature higher than the second melting point, but lower than the first melting point.
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公开(公告)号：US20230327395A1
公开(公告)日：2023-10-12
申请号：US18210770
申请日：2023-06-16
申请人： Aeva, Inc.
发明人： Zhizhong Tang , Pradeep Srinivasan , Kevin Masuda , Wenjing Liang
IPC分类号： H01S5/0237 , B23K1/005 , H01S5/40
CPC分类号： H01S5/0237 , B23K1/0056 , H01S5/4025 , B23K2101/40
摘要： Embodiments of the present disclosure include method for sequentially mounting multiple semiconductor devices onto a substrate having a composite metal structure on both the semiconductor devices and the substrate for improved process tolerance and reduced device distances without thermal interference. The mounting process causes “selective” intermixing between the metal layers on the devices and the substrate and increases the melting point of the resulting alloy materials.
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公开(公告)号：US20230264283A1
公开(公告)日：2023-08-24
申请号：US18006866
申请日：2021-07-27
申请人： FANUC CORPORATION
CPC分类号： B23K1/0056 , B23K26/0884
摘要： Provided is a laser brazing system that can collectively control a robot and devices such as a laser oscillator and a wire feeding device and that can also collectively display the state of the robot and the state of the devices. A laser brazing system 1 that comprises a gas supply device 16, a wire feeding device 17, a laser oscillator 15, a robot 12 that supports a wire feeding nozzle 14 and a laser processing head 13 on the tip of an arm 121, and a robot control device 10 that controls the robot 12. In addition to the robot 12, the robot control device 10 of the laser brazing system 1 controls the wire feeding device 17, the gas supply device 16, and the laser oscillator 15 and has an operation panel 11 that includes a display unit 112 that can display the state of at least one of the wire feeding device 17, the gas supply device 16, and the laser oscillator 15.
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