Abstract:
Methods, systems, and devices for techniques to mitigate asymmetric long delay stress are described. A memory device may activate a memory cell during a first phase of an access operation cycle. The memory device may write a first state or a second state to the memory cell during the first phase of the access operation cycle. The memory device may maintain the first state or the second state during a second phase of the access operation cycle after the first phase of the access operation cycle. The memory device may write, during a third phase of the access operation cycle after the second phase of the access operation cycle, the second state to the memory cell. The memory device may precharge the memory cell during the third phase of the access operation cycle based on writing the second state to the memory cell.
Abstract:
In embodiments of the present invention improved capabilities are described for emulating multiple-time programmable memory utilizing one-time programmable memory, the memory comprising a plurality of one time programmable (OTP) memory locations for storing information, the plurality of OTP memory locations configured to operate as a single emulated many time programmable (eMTP) memory location, wherein the plurality of OTP memory locations operating as an eMTP memory location are associated with one address, the one address readable and writable.
Abstract:
A media for an information storage device comprises a substrate of single-crystal silicon, a buffer layer of an epitaxial single crystal insulator formed over the substrate, a bottom electrode layer of an epitaxial single crystal conductor formed over the buffer layer, a ferroelectric layer of an epitaxial single crystal ferroelectric material formed over the bottom electrode layer, and an overlayer of an epitaxial single crystal material formed over the ferroelectric layer. Dipole charges generally having a first orientation exist at an interface between the bottom electrode layer and the ferroelectric layer includes, while dipole charges generally having a second orientation opposite the first orientation exist at an interface between the ferroelectric layer and the overlayer includes.
Abstract:
In a bistable magnetic element, a pulse current or a dc-biased high frequency current is supplied to a soft magnetic material which has a helical magnetic anisotropy. As a result, the magnitude of a voltage induced across the soft magnetic material abruptly changes with respect to variation in an external magnetic field.
Abstract:
Disclosed herein is a memory cell arrangement and method thereof for providing a reference read current for reading a plurality of memory cells. The memory cell arrangement includes a plurality of memory cells and one or more reference memory cells. The memory cell arrangement also includes a reference circuit that provides a reference read current for reading one or more of the plurality memory cells, wherein the reference circuit is connected to the one or more reference memory cells to generate the reference read current based on one or more reference currents from the one or more reference memory cells. The memory cell arrangement may also include a shifting circuit connected to the reference circuit, wherein the shifting circuit is configured to shift the reference read current.
Abstract:
Techniques, systems, and devices for time-resolved access of memory cells in a memory array are described herein. During a sense portion of a read operation, a selected memory cell may be charged to a predetermined voltage level. A logic state stored on the selected memory cell may be identified based on a duration between the beginning of the charging and when selected memory cell reaches the predetermined voltage level. In some examples, time-varying signals may be used to indicate the logic state based on the duration of the charging. In some examples, the duration of the charging may be based on a polarization state of the selected memory cell, a dielectric charge state of the selected state, or both a polarization state and a dielectric charge state of the selected memory cell.
Abstract:
Semiconductor memory contains memory cells having ferroelectric capacitors and cell transistors, bit lines connected to memory cells, word lines connected to gate electrodes of cell transistors, plate lines connected to one of two electrodes of ferroelectric capacitors, sense amplifiers connected between each pair of bit lines. Further, a test pad is provided in order to apply an external voltage to each of bit lines, test transistors are provided corresponding to bit lines respectively, each of test transistors is connected between the test pad and each of bit lines, a fatigue test bias circuit is connected to a first node located between the test pad and test transistors. Test transistors are shared in a first test to apply a first voltage to ferroelectric capacitors from an outside via the test pad and a second test to apply a second voltage to ferroelectric capacitors from the fatigue test bias circuit.