公开(公告)号：US06351996B1

公开(公告)日：2002-03-05

申请号：US09191718

申请日：1998-11-12

申请人： Steven S. Nasiri ,  David W. Burns ,  Janusz Bryzek ,  Sean S. Cahill

发明人： Steven S. Nasiri ,  David W. Burns ,  Janusz Bryzek ,  Sean S. Cahill

IPC分类号： G01L904

CPC分类号： G01L19/147 ,  G01L19/0038 ,  G01L19/0084

摘要： A hermetic media interface for a sensor package is disclosed. Preferably, the hermetic media interface is incorporated into a pressure sensor package for interfacing directly to fluid and/or gaseous media. In one embodiment, the pressure sensor package includes a semiconductor die and a pressure port that are housed in a pre-molded plastic package. A eutectic solder is coupled between the semiconductor die and the pressure port to solder the same to the semiconductor die. The semiconductor die may be metallized to enhance solderability. In an alternative embodiment, the pressure port is made from one or more plastic materials and the pressure port is attached to the semiconductor die with an adhesive. An integral stress-isolation region may optionally be incorporated on the semiconductor die.

摘要翻译： 公开了一种用于传感器封装的密封介质接口。 优选地，密封介质界面结合到压力传感器封装中，用于直接与流体和/或气体介质接合。 在一个实施例中，压力传感器封装包括容纳在预模制塑料封装中的半导体管芯和压力端口。 共晶焊料耦合在半导体管芯和压力端口之间以将其焊接到半导体管芯。 半导体管芯可以被金属化以增强可焊性。 在替代实施例中，压力端口由一种或多种塑料材料制成，并且压力端口用粘合剂附接到半导体管芯。 整体应力隔离区可任选地并入半导体管芯上。

公开(公告)号：US06568276B1

公开(公告)日：2003-05-27

申请号：US09633177

申请日：2000-08-04

申请人： Mario J. Ciminelli

发明人： Mario J. Ciminelli

IPC分类号： G01L904

CPC分类号： G01L9/0051 ,  G01L23/18

摘要： A strain gauge based sensor for use in relatively high pressure applications has a diaphram frame with an active diaphragm portion having a high t/D ratio, or t2/A ratio, and an annular groove provided in at least a portion of a periphery of the diaphram frame which alters the strain field on the surface of the active diaphram, causing the radial stresses to be primarily bending stresses and minimizing shear stresses, thus bringing the &egr;t/&egr;c ratio closer to one and increasing the linearity of the output of strain gauges affixed to the top of the diaphram.

摘要翻译： 用于相对较高压力应用的应变仪传感器具有带有具有高t / D比或t2 / A比的活动隔膜部分的腹膜框架，以及环形槽，其设置在至少一部分周边 改变框架，其改变活性层的表面上的应变场，导致径向应力主要是弯曲应力并最小化剪切应力，从而使得epsit / epsic比接近于1，并增加了应变片输出的线性 到最顶层的diaphram。

公开(公告)号：US06427539B1

公开(公告)日：2002-08-06

申请号：US09629270

申请日：2000-07-31

申请人： Shiuh-Hui Steven Chen ,  Yanling Kang ,  Sut-Mui Tang ,  Joe P. Wang

发明人： Shiuh-Hui Steven Chen ,  Yanling Kang ,  Sut-Mui Tang ,  Joe P. Wang

IPC分类号： G01L904

CPC分类号： G01L19/04 ,  G01L9/0064 ,  G01L23/18

摘要： A reliable sensor provides a user-friendly semiconductor sensing device and transducer which accurately detects the characteristics of a fluid, such as pressure and strain, at high temperature operating conditions. The high performance sensor is particularly useful for use with diesel engines and internal combustion engines in vehicles. The sensor can comprise a single die with a transverse strain gauge or a group of strain gauges which are located at a position on the die to help minimize electric effects of thermal stress on the gauges during pressure detection and operation of the vehicle. The die can be glass fused, such as by glass frit, to a diaphragm, such as a stainless steel diaphragm, so as not to readily corrode in the fluid.

摘要翻译： 可靠的传感器提供了一种用户友好的半导体感测装置和换能器，其在高温操作条件下精确地检测流体的特性，例如压力和应变。 高性能传感器特别适用于车辆中的柴油发动机和内燃机。 传感器可以包括具有横向应变计的单个模具或位于模具上的位置处的一组应变计，以帮助在压力检测和车辆操作期间最小化热应力对计量器的电效应。 模具可以例如通过玻璃料玻璃熔合到诸如不锈钢隔膜的隔膜上，以便不容易腐蚀流体。

公开(公告)号：US06615668B2

公开(公告)日：2003-09-09

申请号：US09920831

申请日：2001-08-03

申请人： Inao Toyoda ,  Yasutoshi Suzuki

发明人： Inao Toyoda ,  Yasutoshi Suzuki

IPC分类号： G01L904

CPC分类号： G01L9/0051 ,  G01L9/0054 ,  G01L19/14

摘要： A diaphragm that distorts according to pressure applied thereon and a signal processor circuit are formed on a semiconductor substrate having an (110)-surface-orientation. Stain gauges converting the diaphragm distortion into an electric signal and forming a bridge circuit are formed on the diaphragm. The electric signal from the bridge circuit is processed by the signal processor circuit. A pair of transistors constituting an input circuit of an amplifier in the signal processor circuit are positioned on the substrate to equalize their source-drain current directions. Thermal stress influence on the sensor outputs is minimized since sensor components are formed on the substrate having the (110)-surface orientation, and thereby the pressure applied to the diaphragm is accurately detected.

公开(公告)号：US06578426B2

公开(公告)日：2003-06-17

申请号：US09987349

申请日：2001-11-14

申请人： Masahito Imai ,  Takeshi Shinoda ,  Yasutoshi Suzuki ,  Hiroaki Tanaka

发明人： Masahito Imai ,  Takeshi Shinoda ,  Yasutoshi Suzuki ,  Hiroaki Tanaka

IPC分类号： G01L904

CPC分类号： G01L19/0084 ,  G01L9/0042 ,  G01L9/04 ,  G01L19/147

摘要： A semiconductor sensor chip mounted on a thin diaphragm of a cylindrical metallic stem via an insulation layer is hermetically contained in a housing of a pressure sensor. The sensor chip includes a strain gage for outputting an electrical signal according to distortion of the diaphragm caused by pressure to be measured. A shield layer is interposed between the insulation layer and the sensor chip, and the shield layer is grounded. Influence of outside noises on the sensor outputs is eliminated or suppressed by the grounded shield layer even if the outside noises are in a high frequency region.

公开(公告)号：US06619133B1

公开(公告)日：2003-09-16

申请号：US09622271

申请日：2000-10-01

申请人： Yasuhiro Goshoo ,  Hirofumi Toujou ,  Masayuki Yoneda ,  Takeshi Fukiura

发明人： Yasuhiro Goshoo ,  Hirofumi Toujou ,  Masayuki Yoneda ,  Takeshi Fukiura

IPC分类号： G01L904

CPC分类号： G01L9/0042 ,  G01L9/0055

摘要： That portion of an n-type single-crystal Si layer 1 which corresponds to a pressure-sensitive region is etched to an SiO2 layer 2 by using the SiO2 layer 2 as an etching stopper layer. The SiO2 layer 2 exposed by this etching is removed. The pressure-sensitive region of the n-type single-crystal Si layer 3 is etched by a predetermined amount to form a diaphragm 4. Thus, the SiO2 layer 2 is removed from the diaphragm 4 and a diaphragm edge portion 6.

摘要翻译： 通过使用SiO 2层2作为蚀刻停止层，将对应于压敏区域的n型单晶Si层1的该部分蚀刻到SiO 2层2。 去除通过该蚀刻暴露的SiO 2层2。 n型单晶Si层3的压敏区域被蚀刻预定量以形成隔膜4.因此，SiO 2层2从膜片4和膜片边缘部分6中去除。

公开(公告)号：US06595065B2

公开(公告)日：2003-07-22

申请号：US09492605

申请日：2000-01-27

申请人： Yukihiko Tanizawa ,  Kazuaki Hamamoto ,  Inao Toyoda ,  Hiroaki Tanaka ,  Yasutoshi Suzuki

发明人： Yukihiko Tanizawa ,  Kazuaki Hamamoto ,  Inao Toyoda ,  Hiroaki Tanaka ,  Yasutoshi Suzuki

IPC分类号： G01L904

CPC分类号： G01L9/0055

摘要： A pressure detecting apparatus has a single-crystal semiconductor sensor chip disposed on a metallic diaphragm through a low melting point glass. The sensor chip has a planar shape selected from a circular shape, a first polygonal shape having more than five sides and having interior angles all less than 180°, and a second polygonal shape having a ratio of a circumscribed circle diameter relative to an inscribed circle diameter being less than 1.2. Four strain gauge resistors are disposed on X, Y axes passing through a center point O of the sensor chip in parallel with directions. Accordingly, thermal stress is reduced not to adversely affect a detection error and simultaneously high sensitivity is provided.

摘要翻译： 压力检测装置具有通过低熔点玻璃设置在金属隔膜上的单晶半导体传感器芯片。 传感器芯片具有选自圆形，多于五边的第一多边形和内角全部小于180°的平面形状，以及具有相对于内切圆的外接圆直径的比率的第二多边形 直径小于1.2。 四个应变计电阻器设置在X，Y轴上，与<110>方向平行地穿过传感器芯片的中心点O。 因此，热应力降低，不会不利地影响检测误差，同时提供高灵敏度。

公开(公告)号：US06450038B1

公开(公告)日：2002-09-17

申请号：US09690091

申请日：2000-10-17

申请人： Giosuè Iseni ,  Giovanbattista Preve ,  Sergio Doneda ,  Ernst Obermeier

发明人： Giosuè Iseni ,  Giovanbattista Preve ,  Sergio Doneda ,  Ernst Obermeier

IPC分类号： G01L904

CPC分类号： G01L9/0052 ,  G01L1/18 ,  G01L1/20

摘要： A pressure sensor, particularly for use in extruders of plastic materials, having an outer enclosure containing a supporting element for a semiconductor chip which is provided with a strain-gauge on one of opposite faces of the chip, a covering element in order to close the enclosure, a mechanical transmission element accommodated in the covering element, directed toward the semiconductor chip and in contact with the chip, the semiconductor chip being accommodated so as to float in the supporting element.

摘要翻译： 一种特别用于塑料材料挤出机的压力传感器，其具有外壳，该外壳包含用于半导体芯片的支撑元件，该半导体芯片的支撑元件在芯片的相对面之一上设置有应变计，以便封闭 壳体，容纳在覆盖元件中的机械传动元件，指向半导体芯片并与芯片接触，半导体芯片被容纳以便浮动在支撑元件中。

公开(公告)号：US06247369B1

公开(公告)日：2001-06-19

申请号：US09229931

申请日：1999-01-13

申请人： John J. Chapman ,  Purnell Hopson, Jr. ,  Nancy M. Holloway

发明人： John J. Chapman ,  Purnell Hopson, Jr. ,  Nancy M. Holloway

IPC分类号： G01L904

CPC分类号： G01L19/04 ,  G01L9/0054 ,  G01L9/065

摘要： A miniature, multi-channel, electronically scanned pressure measuring device uses electrostatically bonded silicon dies in a multi-element array. These dies are bonded at specific sites on a glass, pre-patterned substrate. Thermal data is multiplexed and recorded on each individual pressure measuring diaphragm. The device functions in a cryogenic environment without the need of heaters to keep the sensor at constant temperatures.

摘要翻译： 微型多通道电子扫描压力测量装置在多元件阵列中使用静电键合的硅模具。 这些模具在玻璃上预定图案化的基底上的特定部位结合。 热量数据被复用并记录在每个单独的压力测量膜片上。 该器件在低温环境中起作用，无需加热器将传感器保持在恒定温度。