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1.
公开(公告)号:US20240174857A1
公开(公告)日:2024-05-30
申请号:US18419778
申请日:2024-01-23
Applicant: Eastman Chemical Company
Inventor: Emmett Dudley Crawford , Scott Ellery George , Kaan Gunes , Paul Hastings , Aristotelis Karagiannis , Aireal Denise Pressley , Pinguan Zheng
IPC: C08L77/12 , B32B17/10 , B32B27/08 , B32B27/36 , C08G69/44 , C08G73/10 , C08G73/16 , C08J5/18 , C08K3/34 , C08K5/053 , C08K5/092 , C08K5/17 , C08K5/5435 , C08K5/5465
CPC classification number: C08L77/12 , B32B17/10036 , B32B17/10724 , B32B17/10779 , B32B27/08 , B32B27/36 , C08G69/44 , C08G73/1003 , C08G73/16 , C08J5/18 , C08K3/34 , C08K5/053 , C08K5/092 , C08K5/17 , C08K5/5435 , C08K5/5465 , B32B2250/03 , B32B2250/24 , B32B2250/40 , B32B2307/412 , B32B2313/00 , B32B2367/00 , B32B2377/00
Abstract: The present application discloses novel polyesteramides comprising cycloalkyl diols and/or cycloalkyl dialkanols with tunable properties based on the monomers and monomerratios used to prepare the polyesteramides and varying the reaction conditions. The present application also discloses compositions and articles.
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公开(公告)号:US20230287240A1
公开(公告)日:2023-09-14
申请号:US18319779
申请日:2023-05-18
Applicant: PPG Industries Ohio, Inc.
Inventor: Christelle Witt-Sanson , Grzegorz Kondziolka , Nigel Francis Masters
IPC: C09D179/08 , C08K5/5419 , C09D183/06 , B65D83/14 , C08G73/16
CPC classification number: C09D179/08 , C08K5/5419 , C09D183/06 , B65D83/14 , C08G73/16 , Y10T428/1355 , Y10T428/31663 , Y10T428/31681
Abstract: A coating composition comprising
a resin material comprising polyester imide polymer
one or more titanate material; and
one or more OH reactive cross linking material.-
公开(公告)号:US20230192592A1
公开(公告)日:2023-06-22
申请号:US18062340
申请日:2022-12-06
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Dmitry ANDROSOV , Hyunseok CHOI , Kalinina FEDOSYA
IPC: C07C219/34 , C08G73/10 , G02B5/30 , G02B1/04 , C07C229/60 , C07C235/42 , C08G73/16 , C09D179/08 , C07D277/64 , C08G73/14
CPC classification number: C07C219/34 , C07C229/60 , C07C235/42 , C07D277/64 , C08G73/14 , C08G73/16 , C08G73/1007 , C08G73/1039 , C08G73/1042 , C08G73/1067 , C09D179/08 , G02B1/04 , G02B5/3083 , G02B5/3025
Abstract: A monomer represented by Chemical Formula 1:
wherein, in Chemical Formula 1, R1, R2, A1, A2, L1, L2, o, p, q, and r are the same as defined in the detailed description.-
公开(公告)号:US11242456B2
公开(公告)日:2022-02-08
申请号:US15733380
申请日:2019-01-23
Applicant: Solutia Inc.
Inventor: Aristotelis Karagiannis , Paul Hastings , Pu Zhang , Pinguan Zheng , Emmett Dudley Crawford , Scott Ellery George , Aireal Denise Pressley , Khanh Duc Tran
IPC: C08L77/12 , C08G69/44 , C08K5/053 , C08K5/092 , C08K5/17 , C08G73/10 , C08G73/16 , C08K5/5435 , C08K5/5465 , B32B27/08 , B32B27/36 , C08K3/34 , B32B17/10 , C08J5/18
Abstract: The present application discloses interlayers comprising novel polyesteramides comprising diols with tunable properties based on the monomers and monomer ratios used to prepare the polyesteramides and varying the reaction conditions. The interlayers have improved properties and can be used in many different applications.
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5.
公开(公告)号:US10793717B2
公开(公告)日:2020-10-06
申请号:US15544472
申请日:2016-01-20
Applicant: JNC CORPORATION
Inventor: Atsushi Murotani , Takayuki Hirota , Katsuyuki Sugihara , Yoshihiro Deyama , Shinta Morokoshi , Setsuo Itami , Toshiyuki Takahashi
IPC: C08L77/12 , C08L63/00 , C08G73/10 , C08G73/16 , C09D179/08 , C09D7/61 , C08G59/24 , C08G59/42 , C09D163/00 , C09D177/12 , C08K3/22 , C08K5/1539 , C08K3/013
Abstract: Provided are a thermosetting resin composition containing polyester amide acid (A), epoxy compound (B) having a fluorene skeleton, epoxy curing agent (C) and colorant (D), and the thermosetting resin composition capable of forming a cured film having an excellent balance of satisfactory hardness and adhesion to glass under high-temperature conditions, and also an application of the thermosetting resin composition.
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公开(公告)号:US10781288B2
公开(公告)日:2020-09-22
申请号:US14402553
申请日:2013-03-15
Applicant: Ube Industries, Ltd.
Inventor: Takuya Oka , Yukinori Kohama , Yoshiyuki Watanabe , Nobuharu Hisano
IPC: C07D407/08 , C08G73/10 , C09D179/08 , C08G73/14 , C08J5/18 , C08G73/16 , C07C69/757 , C07C235/82
Abstract: A polyimide precursor including at least one repeating unit represented by the following chemical formula (1): in which A is an arylene group; and X1 and X2 are each independently hydrogen, an alkyl group having 1 to 6 carbon atoms, or an alkylsilyl group having 3 to 9 carbon atoms, and a polyimide obtained from the polyimide precursor has a coefficient of linear thermal expansion from 50° C. to 400° C. of 100 ppm/K or less.
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公开(公告)号:US10450411B2
公开(公告)日:2019-10-22
申请号:US15315567
申请日:2015-06-19
Applicant: DUPONT TEIJIN FILMS U.S. LIMITED PARTNERSHIP
Inventor: Stephen William Sankey , David Turner , Howard Colquhoun , Stephen Jones
IPC: C08G63/685 , C07D209/48 , C08G73/10 , C08G73/16 , D01F6/84 , C08J5/18
Abstract: Disclosed herein are film, fiber, molding composition and molded article including copolyesters that exhibit improved heat-resistance and thermo-mechanical stability. The copolyester is derived from an aliphatic glycol, an aromatic dicarboxylic acid selected from naphthalene dicarboxylic acid and terephthalic acid, and 5-50 mol % (based on 100 mole % of all glycols) of an additional monomer, bis(2-hydroxyalkyl)-2,2′-(1,4-phenylene)bis(1,3-dioxoisoindoline-5-carboxylate). The aromatic dicarboxylic acid is at least one of naphthalene dicarboxylic acid and terephthalic acid and the aliphatic glycol is selected from C2, C3 or C4 aliphatic diols. Furthermore, the copolyesters have crystallinity of at least 10%.
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公开(公告)号:US20190161642A1
公开(公告)日:2019-05-30
申请号:US16263561
申请日:2019-01-31
Applicant: PPG Industries Ohio, Inc.
Inventor: Christelle Witt-Sanson , Grzegorz Kondziolka , Nigel Francis Masters
IPC: C09D179/08 , C08G73/16 , C09D183/06 , B65D83/14 , C08K5/5419
Abstract: A coating composition comprising a resin material comprising polyester imide polymer one or more titanate material; and one or more OH reactive cross linking material.
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公开(公告)号:US20180127600A1
公开(公告)日:2018-05-10
申请号:US15574972
申请日:2016-05-17
Applicant: MITSUBISHI MATERIALS CORPORATION
Inventor: Shintaro IIDA , Hideaki SAKURAI
Abstract: A water-dispersed electrodeposition solution (11) for forming an insulating film includes: polymer particles; an organic solvent; a basic compound; and water. The polymer particles are made of: any one of; or both of polyamide-imide and polyester-imide, main chains thereof being free of an anionic group, a number-based median diameter D50 of the polymer particles is 0.05 μm to 0.5 μm, and polymer particles having a particle size within −30% to +30% of the number-based median diameter D50 are 50% or more of all of the polymer particles on a number basis.
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10.
公开(公告)号:US20180066111A1
公开(公告)日:2018-03-08
申请号:US15812208
申请日:2017-11-14
Applicant: DuPont Teijin Films U.S. Limited Partnership
Inventor: STEPHEN WILLIAM SANKEY , DAVID TURNER , HOWARD COLQUHOUN , STEPHEN JONES
CPC classification number: C08G73/16 , C08G63/6856 , C08G63/88 , C08G73/1082 , C08J5/18 , C08J2367/02 , C08J2379/08 , C08L79/08 , D01F6/84
Abstract: A copolyester includes repeating units derived from an aliphatic glycol, terephthalic acid, and the monomer of formula (I): wherein n=2, 3 or 4; Z is C═O, comonomer (I) constitutes a proportion of the glycol fraction of the copolyester and is present in a range of from about 5 to about 15 mol % of the glycol fraction of the copolyester; wherein said copolyester is semi-crystalline. A process tor making the copolyester includes annealing a copolyester of formula (I) at 20-80° C. below the crystalline melting point (Tm) and above the glass transition temperature (Tg).
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