HIGH TEMPERATURE BENZOXAZINE RESINS, METHODS, AND USES THEREOF

    公开(公告)号:US20230365730A1

    公开(公告)日:2023-11-16

    申请号:US18026997

    申请日:2021-09-30

    发明人: Young Hoon Lim

    摘要: A benzoxazine resin composition is provided. The benzoxazine resin composition includes a benzoxazine resin that is a reaction product of an amine, a phenol, and an aldehyde. Either the amine is a diamine or the phenol is a bisphenol, and the benzoxazine resin has at least one nitrogen-containing crosslinking functional group or pyrocitric functional group. A method of preparing a benzoxazine resin composition is also provided. The method includes reacting an amine, a phenol, and an aldehyde at a temperature of above 60° C., for 1 h to 5 days to form a benzoxazine resin. The benzoxazine resin has at least one nitrogen-containing crosslinking functional group or pyrocitric functional group, and either the amine is a diamine or the phenol is a bisphenol. Also provided is a cured resin made from the benzoxazine resin composition.

    RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE

    公开(公告)号:US20230066153A1

    公开(公告)日:2023-03-02

    申请号:US17784281

    申请日:2020-12-09

    IPC分类号: C08F234/00

    摘要: Provided is a resin composition which has good solubility and photocurability, further has good alkaline-developability when containing a photo initiator and a compound containing one or more carboxyl groups, and in addition, is capable of providing a resin sheet having suppressed tackiness; and a resin sheet, multilayer printed wiring board, and semiconductor device using the same. The resin composition of the present invention contains a particular bismaleimide compound (A), and at least two maleimide compounds (B) selected from the group consisting of six kinds of particular compounds which are different from this bismaleimide compound (A).