- 专利标题: RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE
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申请号: US17784281申请日: 2020-12-09
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公开(公告)号: US20230066153A1公开(公告)日: 2023-03-02
- 发明人: Yune KUMAZAWA , Takuya SUZUKI , Seiji SHIKA , Shunsuke KATAGIRI
- 申请人: MITSUBISHI GAS CHEMICAL COMPANY, INC.
- 申请人地址: JP Tokyo
- 专利权人: MITSUBISHI GAS CHEMICAL COMPANY, INC.
- 当前专利权人: MITSUBISHI GAS CHEMICAL COMPANY, INC.
- 当前专利权人地址: JP Tokyo
- 优先权: JP2019-223947 20191211
- 国际申请: PCT/JP2020/045841 WO 20201209
- 主分类号: C08F234/00
- IPC分类号: C08F234/00
摘要:
Provided is a resin composition which has good solubility and photocurability, further has good alkaline-developability when containing a photo initiator and a compound containing one or more carboxyl groups, and in addition, is capable of providing a resin sheet having suppressed tackiness; and a resin sheet, multilayer printed wiring board, and semiconductor device using the same. The resin composition of the present invention contains a particular bismaleimide compound (A), and at least two maleimide compounds (B) selected from the group consisting of six kinds of particular compounds which are different from this bismaleimide compound (A).
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