公开(公告)号：US06781093B2

公开(公告)日：2004-08-24

申请号：US10060414

申请日：2002-02-01

申请人： Peter Conlon ,  James Mahon ,  Adrian Boyle ,  Mark Owen

发明人： Peter Conlon ,  James Mahon ,  Adrian Boyle ,  Mark Owen

IPC分类号： B23K2636

CPC分类号： H05K3/0032 ,  B23K26/40 ,  B23K2101/40 ,  B23K2103/50 ,  H01L21/481 ,  H01L21/67092 ,  H01L24/97 ,  H01L2221/68313 ,  H01L2223/54486 ,  H01L2224/16 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01052 ,  H01L2924/01058 ,  H01L2924/0106 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/18161 ,  H05K1/0269 ,  H05K3/0008 ,  H05K3/0038 ,  H05K3/0052 ,  H05K2201/09918 ,  H01L2224/81 ,  H01L2924/00

摘要： Electronic circuits such as IC packages, circuit boards, of flex circuits are singulated by laser cutting of adjoining laminated material. The laser beam has a wavelength of less than 400 nm, and either a minimum energy density of 100 J/cm2 or a minimum power density of 1GW/cm2. The method avoids the need for cleaning and intermediate handling, and there is a greatly improved throughput.

摘要翻译： 诸如IC封装的电子电路，柔性电路的电路板通过相邻的层压材料的激光切割来分割。 激光束的波长小于400nm，最小能量密度为100J / cm 2或最小功率密度为1GW / cm 2。 该方法避免了清洁和中间处理的需要，并且大大提高了生产量。

公开(公告)号：US06710280B2

公开(公告)日：2004-03-23

申请号：US10152762

申请日：2002-05-22

申请人： Jyoti Mazumder ,  Timothy Skszek ,  Dwight Morgan

发明人： Jyoti Mazumder ,  Timothy Skszek ,  Dwight Morgan

IPC分类号： B23K2636

CPC分类号： B23K26/06 ,  B23K26/064 ,  B23K26/0643 ,  B23K26/0732 ,  B23K26/0738 ,  B23K26/32 ,  B23K26/34 ,  B23K2101/006 ,  B23K2103/50 ,  B29C64/00 ,  B33Y50/02 ,  C23C24/10 ,  C23C26/02

摘要： Continuously adjustable focusing optics for use in laser-assisted direct metal deposition (DMD™) processes provide for adaptive deposition width to increase deposition rate while maintaining the dimensional tolerances. The focusing optics and method may be adapted for variable deposition road width under closed-loop feedback, so that complicated features may be fabricated with close tolerance, stress and microstructure control to improve the lead-time and design flexibility. The preferred embodiment uses adaptive mirror arrangements and beam movement for variable deposition width and geometry. Conceptually, an infinite number of mirror arrangements can be made to adapt to a particular deposit shape.

摘要翻译： 用于激光辅助直接金属沉积（DMD（TM））工艺的连续可调节的聚焦光学器件提供适应性沉积宽度以增加沉积速率同时保持尺寸公差。 聚焦光学元件和方法可适用于闭环反馈下的可变沉积道路宽度，从而可以采用紧公差，应力和微结构控制来制造复杂的特征，从而提高交货时间和设计灵活性。 优选实施例使用自适应反射镜布置和光束移动来实现可变沉积宽度和几何形状。 在概念上，可以制造无限数量的镜子布置以适应特定的沉积形状。

公开(公告)号：US06696665B2

公开(公告)日：2004-02-24

申请号：US09954410

申请日：2001-09-17

申请人： Marcel Heerman

发明人： Marcel Heerman

IPC分类号： B23K2636

CPC分类号： H05K3/061 ,  B23K26/389 ,  H05K3/0032 ,  H05K3/0035 ,  H05K3/0041 ,  H05K3/027 ,  H05K3/062 ,  H05K3/427 ,  H05K2201/0305 ,  H05K2201/0394 ,  H05K2203/0554 ,  H05K2203/107 ,  H05K2203/135

摘要： A method for introducing plated-through holes into an electrically insulating base material includes steps of: providing an electrically insulating base material having a first surface with a first metal layer and a second surface with a second metal layer; applying an etching resist layer at least to the first metal layer; using electromagnetic radiation to remove the etching resist layer and to thereby uncover the first metal layer in regions where plated-through holes are to be produced; etching away the uncovered regions of the first metal layer as far as the first surface of the base material; and using a laser beam to produce the plated-through holes in the base material.

摘要翻译： 将电镀通孔插入电绝缘基材的方法包括以下步骤：提供具有第一表面的第一金属层和具有第二金属层的第二表面的电绝缘基材; 至少对第一金属层施加抗蚀剂层; 使用电磁辐射去除蚀刻抗蚀剂层，从而在要产生电镀通孔的区域中露出第一金属层; 蚀刻掉第一金属层的未覆盖区域至基底材料的第一表面; 并使用激光束在基材中产生电镀通孔。

公开(公告)号：US06664499B1

公开(公告)日：2003-12-16

申请号：US10194800

申请日：2002-07-11

申请人： Steve A. Brink ,  Noel A. Spishak ,  Daniel L. Nydegger ,  Stephen L. Sembritzky ,  William R. Schell ,  David M. Kozy ,  Steven R. Walton ,  Ray Henderson

发明人： Steve A. Brink ,  Noel A. Spishak ,  Daniel L. Nydegger ,  Stephen L. Sembritzky ,  William R. Schell ,  David M. Kozy ,  Steven R. Walton ,  Ray Henderson

IPC分类号： B23K2636

CPC分类号： B23K26/0823 ,  B23K26/032 ,  B23K26/361 ,  B23K2101/06

摘要： An apparatus and method is provided for cutting curved tube and duct assemblies using a high-powered laser, which locates, measures and follows a scribe line. The invention generally is comprised of a multi-axis laser-based machine tool to cut formed (i.e., curved) welded tube and duct detailed parts to a planar scribe line. It is further comprised of a laser focusing head positioned on a rotating and tilting platform; fixturing aids to position and hold the tubes or ducts to be cut; a machine vision system to locate and measure a scribe line in a plane on the tube or duct, thus determining its orientation; and a controller that tilts the turntable to a co-planar position, and then operates a high-powered laser to cut the duct at the scribe line.

摘要翻译： 提供一种用于使用高功率激光器切割弯曲管和管道组件的装置和方法，该激光器定位，测量和跟随划线。 本发明通常由基于多轴激光的机床组成，用于将形成（即弯曲的）焊接管和管道的详细部分切割成平面划线。 它还包括位于旋转和倾斜平台上的激光聚焦头; 固定助剂以定位和保持待切割的管或管道; 机器视觉系统，用于在管或管道上的平面中定位和测量划线，从而确定其取向; 以及将转台倾斜到共面位置的控制器，然后操作大功率激光器以切割划线处的管道。

公开(公告)号：US06635850B2

公开(公告)日：2003-10-21

申请号：US10047952

申请日：2002-01-15

申请人： Jun Amako ,  Masami Murai ,  Tsutomu Ota ,  Tomio Sonehara

发明人： Jun Amako ,  Masami Murai ,  Tsutomu Ota ,  Tomio Sonehara

IPC分类号： B23K2636

CPC分类号： B23K26/0676 ,  B23K26/0622 ,  B23K26/066 ,  B23K26/067 ,  G02F1/13439

摘要： A laser machining method and apparatus performs high-speed and high-precision machining on a thin film and a liquid crystal panel. The apparatus includes: a plurality of pulse laser generators, drivers for alternately driving a plurality of pulse laser generators to generate laser beams delayed in phase between each other; collimators for making the generated laser beams equal in quality; a wave plate for converting the laser beams into elliptically polarized laser beams; and a phase grating for dividing each laser beam emitted by each of the plurality of laser beam generators into a plurality of laser beams; such that an object to be processed is selectively illuminated with the plurality of laser beams produced by the phase grating. The phase grating has structure on its surface for dividing each of the laser beams into equal intensity beams. Open grooves are formed having uniform shape and quality.

摘要翻译： 激光加工方法和装置在薄膜和液晶面板上进行高速高精度加工。 该装置包括：多个脉冲激光发生器，用于交替驱动多个脉冲激光发生器以产生彼此相位延迟的激光束的驱动器; 用于使所生成的激光束的质量相等的准直器; 用于将激光束转换成椭圆偏振激光束的波片; 以及相位光栅，用于将由所述多个激光束发生器中的每一个发射的每个激光束分成多个激光束; 使得由相位光栅产生的多个激光束选择性地照射被处理物体。 相位光栅在其表面上具有用于将每个激光束分成相等强度光束的结构。 形成具有均匀形状和质量的开放凹槽。

公开(公告)号：US06479788B1

公开(公告)日：2002-11-12

申请号：US09577888

申请日：2000-05-25

申请人： Kunio Arai ,  Hiroshi Aoyama ,  Hideo Ueno

发明人： Kunio Arai ,  Hiroshi Aoyama ,  Hideo Ueno

IPC分类号： B23K2636

CPC分类号： H05K3/0035 ,  B23K26/0622 ,  B23K26/384 ,  B23K26/389

摘要： The invention provides a method and an apparatus of making a hole in a printed circuit board, which improve the quality of a hole shape and the processing speed. In accordance with the invention, a control apparatus controls a laser oscillator and a galvano mirrors so as to form a hole while gradually reducing a pulse width in each step with respect to one hole. As a result of this, no insulating material is left on the bottom portion of the hole, and it is possible to make a hole having an intended shape, particularly, having a desired diameter of the hole bottom.

摘要翻译： 本发明提供一种在印刷电路板上形成孔的方法和装置，其提高了孔形状和加工速度。 根据本发明，控制装置控制激光振荡器和电流镜以形成孔，同时相对于一个孔逐渐减小每个步骤中的脉冲宽度。 其结果是，孔的底部没有绝缘材料残留，并且可以形成具有期望形状的孔，特别是具有所希望的孔底直径的孔。

公开(公告)号：US06822189B2

公开(公告)日：2004-11-23

申请号：US10090409

申请日：2002-03-04

申请人： Minghui Hong ,  Yongfeng Lu

发明人： Minghui Hong ,  Yongfeng Lu

IPC分类号： B23K2636

CPC分类号： B41M5/24 ,  B23K26/08 ,  B23K26/082 ,  B23K26/361 ,  B23K26/40 ,  B23K2103/42 ,  B23K2103/50 ,  B23K2103/52 ,  B41M5/26 ,  B41M5/38221 ,  C03C17/002 ,  C03C17/09 ,  C03C23/0025 ,  C03C2218/32 ,  C23C14/048 ,  C23C14/28

摘要： A method of laser marking, suitable for the marking of hard transparent materials without causing microcracking, includes arranging a sample of target material and a sample of markable material such that they are spaced apart; directing irradiation having an energy fluence above the ablation threshold of the target material onto the target material so that some of it is ablated and thrown onto a surface of the markable material; and subjecting the surface of the markable material to irradiation having an energy fluence below the ablation threshold of the markable material to induce an interaction between the ablated material and the surface which marks the surface of the ablated material. Different colours of mark can be obtained by using different target materials, and the tone of the mark can be controlled as desired. Apparatus for implementing the method permits control of the method in real time.

摘要翻译： 一种适用于标记硬质透明材料而不引起显微裂纹的激光标记方法包括：将目标材料样品和可标记材料样品排列成间距; 将具有高于目标材料的消融阈值的能量注量的照射引导到目标材料上，使得其中的一些被烧蚀并投掷到可标记材料的表面上; 并且将可标记材料的表面经受低于可标记材料的消融阈值的能量注入的照射，以引起消融材料和标记烧蚀材料表面的表面之间的相互作用。 可以通过使用不同的目标材料获得不同颜色的标记，并且可以根据需要控制标记的色调。 用于实现该方法的装置允许实时地控制该方法。

公开(公告)号：US06809291B1

公开(公告)日：2004-10-26

申请号：US10231580

申请日：2002-08-30

申请人： George R. Neil ,  Michelle D. Shinn

发明人： George R. Neil ,  Michelle D. Shinn

IPC分类号： B23K2636

CPC分类号： B23K26/0613 ,  B23K26/0624 ,  B23K26/705

摘要： An improved method and apparatus increasing the accuracy and reducing the time required to machine materials, surface treat materials, and allow better control of defects such as particulates in pulsed laser deposition. The speed and quality of machining is improved by combining an ultrashort pulsed laser at high average power with a continuous wave laser. The ultrashort pulsed laser provides an initial ultrashort pulse, on the order of several hundred femtoseconds, to stimulate an electron avalanche in the target material. Coincident with the ultrashort pulse or shortly after it, a pulse from a continuous wave laser is applied to the target. The micromachining method and apparatus creates an initial ultrashort laser pulse to ignite the ablation followed by a longer laser pulse to sustain and enlarge on the ablation effect launched in the initial pulse. The pulse pairs are repeated at a high pulse repetition frequency and as often as desired to produce the desired micromachining effect. The micromachining method enables a lower threshold for ablation, provides more deterministic damage, minimizes the heat affected zone, minimizes cracking or melting, and reduces the time involved to create the desired machining effect.

摘要翻译： 改进的方法和设备提高了加工材料，表面处理材料以及更好地控制诸如脉冲激光沉积中的微粒的缺陷所需的精度和时间。 通过将高平均功率的超短脉冲激光与连续波激光器组合，可以提高加工速度和质量。 超短脉冲激光器提供大约数百飞秒的初始超短脉冲，以刺激目标材料中的电子雪崩。 与超短脉冲重合或不久之后，来自连续波激光的脉冲施加于靶。 微加工方法和装置创建一个初始的超短激光脉冲来点燃消融，随后是较长的激光脉冲，以维持和扩大在初始脉冲中发射的消融效应。 脉冲对以高脉冲重复频率重复，并且经常根据需要重复，以产生所需的微机械加工效果。 微加工方法能够实现更低的消融阈值，提供更多的确定性损伤，最大限度地减少热影响区域，最大限度地减少裂纹或熔化，并减少创建所需加工效果所需的时间。

公开(公告)号：US06605799B2

公开(公告)日：2003-08-12

申请号：US09865936

申请日：2001-05-25

申请人： Jay J. Brandinger ,  Brian D. Hoffman ,  Edward T. Polkowski

发明人： Jay J. Brandinger ,  Brian D. Hoffman ,  Edward T. Polkowski

IPC分类号： B23K2636

CPC分类号： B23K26/0608 ,  B23K26/0604 ,  B23K26/067 ,  B23K26/0732 ,  B23K26/702

摘要： A laser machining device is capable of simultaneously machining two- or three dimentional patterns on the surface of a workpiece. A micromirror array positioned within a laser cavity generates a patterned plurality of laser beamlets which can be homogenized and deflected by a second micromirror array onto the surface of a workpiece to create a two-dimensional pattern. Alternatively, the second micromirror array can deflect laser beamlets of unequal energy density to produce a three-dimensional pattern.

摘要翻译： 激光加工装置能够同时在工件表面上加工二维或三维图案。 定位在激光腔内的微镜阵列产生图案化的多个激光束，其可被均匀化并被第二微镜阵列偏转到工件的表面上以产生二维图案。 或者，第二微镜阵列可偏转不等能量密度的激光束以产生三维图案。

公开(公告)号：US06600132B2

公开(公告)日：2003-07-29

申请号：US09917918

申请日：2001-07-31

申请人： John James Horsting ,  Mool Chand Gupta

发明人： John James Horsting ,  Mool Chand Gupta

IPC分类号： B23K2636

CPC分类号： B23K26/0613 ,  B23K26/0604 ,  B23K26/067 ,  B23K26/384

摘要： A method of and apparatus for forming chamfers in an orifice of a workpiece. The orifice has an axis, which extends between a first surface and second surface of the workpiece, where the first and second surfaces are parallel to each other. The chamfers are disposed between the first surface and the second surface. The method includes forming an orifice in a workpiece with a source of non-collimated light directed at the workpiece at a predetermined first time interval, and forming a chamfer with a source of collimated light at a second time interval simultaneously with the first time interval. The apparatus includes at least a source of collimated and non-collimated light, a collimated light filter, and a non-collimated light generating arrangement, and at least one shutter and at least one iris that direct collimated and non-collimated light at the workpiece to form the orifice. The apparatus is configured such that the orifice has a surface roughness of between approximately 0.05 micron and approximately 0.13 micron and an orifice coefficient of greater than approximately 0.6.

摘要翻译： 一种用于在工件的孔中形成倒角的方法和装置。 孔口具有在工件的第一表面和第二表面之间延伸的轴线，其中第一和第二表面彼此平行。 倒角设置在第一表面和第二表面之间。 该方法包括在预定的第一时间间隔内以工件的非准直光源形成工作孔，并且在第一时间间隔内与第二时间间隔的准直光源形成倒角。 该装置至少包括准直光源和非准直光源，准直光滤光器和非准直光产生装置，以及至少一个快门和至少一个可在工件处直接准直和非准直光的光圈 以形成孔口。 该设备被配置为使得孔口具有介于约0.05微米和约0.13微米之间的表面粗糙度以及大于约0.6的孔口系数。