公开(公告)号：US12041724B2

公开(公告)日：2024-07-16

申请号：US17619957

申请日：2019-06-21

Applicant: FUJI CORPORATION

Inventor： Yuta Yokoi ,  Mitsutaka Inagaki ,  Kazuya Kotani ,  Keiichi Ono

IPC: H05K13/08

CPC classification number: H05K13/083

Abstract: An allowance setting system, a substrate inspection device, an allowance setting method, and a substrate inspection method that can set an appropriate inspection allowance are provided in which a normal mounting position of electronic component on a component mounting surface of substrate is defined as normal position. A deviation of an actual mounting position of electronic component in a surface direction of the component mounting surface with respect to the normal position is defined as surface direction deviation. A deviation of the actual mounting position of electronic component in a rotation direction within the component mounting surface with respect to normal position is defined as angular deviation. Allowance setting system sets multiple surface direction inspection allowances according to angular deviation for evaluating surface direction deviation in a substrate inspection before reflow.

公开(公告)号：US11930600B2

公开(公告)日：2024-03-12

申请号：US17523266

申请日：2021-11-10

Applicant: CKD CORPORATION

Inventor： Takayuki Shinyama ,  Tsuyoshi Ohyama ,  Norihiko Sakaida

IPC: G01B11/25 ,  G01B11/06 ,  G01N21/956 ,  H05K13/08 ,  G01B11/00

CPC classification number: H05K13/0817 ,  G01B11/0608 ,  G01B11/2513 ,  G01N21/95684 ,  H05K13/083 ,  G01B11/002 ,  G01N2021/95646

Abstract: A three-dimensional measurement apparatus measures measurement targets placed in a target measurement area on a measurement object. The apparatus includes: a measurement module that: is positioned with respect to the target measurement area, and includes: a first irradiator that irradiates the target measurement area with predetermined light for height measurement; a second irradiator that irradiates the target measurement area with predetermined patterned light for three-dimensional measurement; and an imaging device that takes an image of the target measurement area; and a control device that moves the measurement module in a height direction and successively positions the measurement module at a predetermined height position determined by mapping, and performs, based on image data taken by irradiating the target measurement area with predetermined patterned light, three-dimensional measurement to the measurement targets at the predetermined height position.

公开(公告)号：US11778799B2

公开(公告)日：2023-10-03

申请号：US16967536

申请日：2018-02-20

Applicant: FUJI CORPORATION

Inventor： Yamato Endo

IPC: H05K13/02 ,  H05K13/04 ,  H05K13/08 ,  G05B19/40 ,  G05B19/402

CPC classification number: H05K13/0812 ,  G05B19/402 ,  H05K13/0419 ,  H05K13/083 ,  H05K13/02 ,  H05K13/04

Abstract: A support plate, which is configured to support a component supply tape, is provided on a bottom face section of a tape passage, through which the component supply tape passes, of a tape feeder. A computer acquires information on a type of the support plate provided in the tape feeder and also acquires information on a type of components of the component supply tape. Further, the computer determines the appropriateness of a combination of the type of the support plate and the type of the components of the component supply tape so acquired by referring to a database accumulating therein data on appropriate combinations of types of support plates and types of components of component supply tapes and outputs a message corresponding to a determination result of the appropriateness of the combination to at least one of a display device, an audio device, and a mobile terminal.

公开(公告)号：US20180192558A1

公开(公告)日：2018-07-05

申请号：US15740074

申请日：2015-07-23

Applicant: FUJI MACHINE MFG. CO., LTD.

Inventor： Yusuke YAMAKAGE ,  Yoshiyuki FUKAYA

IPC: H05K13/04 ,  H05K13/00 ,  H05K13/02 ,  G06T7/73 ,  H05K13/08

CPC classification number: H05K13/0413 ,  G06T7/74 ,  H05K13/0409 ,  H05K13/083

Abstract: There is provided a component mounting machine in which when detecting a lowermost end position of a component sucked by a suction nozzle, a lower edge position of the component is detected at predetermined intervals from a left side and a right side using the lowermost end position as a reference. The component mounting machine derives an approximate straight line obtained by approximating multiple lower edge positions detected from the side having a larger detection number and the lowermost end position and an angle of the approximate straight line is detected as the suction angle of the component. Accordingly, the component mounting machine can appropriately detect the suction angle of the component with a simple process and correctly determine the suction posture of the component.

公开(公告)号：US20170010187A1

公开(公告)日：2017-01-12

申请号：US15114285

申请日：2014-02-03

Applicant: FUJI MACHINE MFG. CO., LTD.

Inventor： Yukitoshi MORITA

IPC: G01M99/00 ,  H05K13/08

CPC classification number: G01M99/008 ,  G05B19/41875 ,  H05K13/08 ,  H05K13/083 ,  Y02P90/22

Abstract: A board production monitoring device for monitoring a production state of a board production device, including: a database section which consecutively obtains and stores production state data from the board production device; a transition graph display section which displays a transition graph showing a time-series change at least at a part of the production state data; a condition change input section which inputs condition change data which shows a change point of a production condition of the board production device and includes generation time information of the change point; and a condition change display section which displays at least the generation time information of the change point of the condition change data, at a time-series corresponding position in the transition graph, is provided.

Abstract translation: 一种用于监视板生产装置的生产状态的板生产监控装置，包括：数据库部分，连续地从板生产装置获取并存储生产状态数据; 转移图形显示部分，显示至少在生产状态数据的一部分处显示时间序列变化的转换图; 条件变更输入部，其输入表示所述板生产装置的生产条件的变化点的条件变化数据，并且包括所述变更点的生成时间信息; 以及条件变更显示部，至少在转换图中的时间序列对应位置显示状态变化数据的变化点的生成时间信息。

公开(公告)号：US20150296670A1

公开(公告)日：2015-10-15

申请号：US14443451

申请日：2013-11-15

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Katsuhiko Itoh ,  Mitsuo Nakamura ,  Daisuke Nagai ,  Kenji Okamoto

IPC: H05K13/04 ,  H05K3/34 ,  H05K3/30 ,  H05K13/08

CPC classification number: H05K13/0465 ,  B23K3/0638 ,  B23K37/04 ,  H05K3/303 ,  H05K3/341 ,  H05K13/08 ,  H05K13/0817 ,  H05K13/083 ,  H05K2203/04 ,  H05K2203/166 ,  Y02P70/613

Abstract: An electronic component is mounted on a substrate according to a mounting mode which is set in advance in the following mounting information when component mounting work is performed. In the mounting information, any one of a first mounting mode in which an electronic component is transferred and mounted to a mounting position which is corrected based on a positional-shift amount between a position of printed solder and a position of an electrode and a second mounting mode in which the electronic component is transferred and mounted to the mounting position by considering only the position of the electrode as a reference, is set as a mounting mode for performance for each electronic component.

Abstract translation: 根据在执行部件安装工作时预先设置在以下安装信息中的安装模式，将电子部件安装在基板上。 在安装信息中，第一安装模式中的任何一个，其中电子部件被传送并安装到基于印刷焊料的位置和电极的位置之间的位置偏移量被校正的安装位置和第二安装模式 设置电子部件通过仅考虑电极的位置作为参考而被传送并安装到安装位置的安装模式被设置为用于每个电子部件的性能的安装模式。

公开(公告)号：US20150296629A1

公开(公告)日：2015-10-15

申请号：US14439912

申请日：2013-11-01

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Takuya Yamazaki ,  Hiraki Sagara ,  Hirokazu Takehara

IPC: H05K3/30

CPC classification number: H05K3/303 ,  H05K13/08 ,  H05K13/083 ,  H05K2203/0195 ,  H05K2203/16

Abstract: Component information including operating parameters for numerical determination of an operation mode of an electronic component mounting operation unit and a change history of the component information are stored in a component information change history storage unit. A mounting error occurring during an electronic component mounting operation is detected, mounting error information relating to an occurrence situation of the mounting error is recorded, and a transition of the mounting error is displayed on a display unit. When the component information is changed, the past mounting error information in which the mounting error information relating to the mounting error occurring during the electronic component mounting operation for the electronic component as changed is associated with the past component information immediately before the change is stored in the past mounting error storage unit and displayed on a display screen.

Abstract translation: 包括用于数字确定电子部件安装操作单元的操作模式的操作参数的组件信息和组件信息的改变历史被存储在组件信息改变历史存储单元中。 检测到在电子部件安装操作期间发生的安装错误，记录与安装错误的发生情况相关的安装错误信息，并且在显示单元上显示安装错误的转变。 当组件信息改变时，过去的安装错误信息被存储在与在更改前的电子部件的电子部件安装操作期间发生的与安装错误有关的安装错误信息与过去的部件信息相关联 过去的安装错误存储单元并显示在显示屏上。

公开(公告)号：US20150286202A1

公开(公告)日：2015-10-08

申请号：US14441694

申请日：2012-11-13

Applicant: FUJI MACHINE MFG. CO., LTD.

Inventor： Masafumi Amano ,  Hirotake Esaki ,  Mitsutaka Inagaki ,  Ken Morikami

IPC: G05B19/042 ,  G05B11/01

CPC classification number: G05B19/0428 ,  G05B11/011 ,  G05B2219/24012 ,  G05B2219/24015 ,  G05B2219/24033 ,  H05K13/08 ,  H05K13/0812 ,  H05K13/0815 ,  H05K13/083

Abstract: A board production state monitoring system including a camera unit that is disposed in a board work machine which carries out predetermined work for a board, that images a progress of the work by using a moving image, and that outputs moving image data; a data operation unit that receives, stores, and displays the moving image data; a trigger factor detection unit that detects at least one of a change factor in which working conditions of the work are changed inside the board work machine and a sign of error occurrence which shows that a working error may occur in the work, as a trigger factor; and an imaging start device for causing the camera unit to start moving image capturing if the trigger factor detection unit detects the trigger factor, and for causing the data operation unit to temporarily store the moving image data, is provided.

Abstract translation: 一种板生产状态监视系统，包括：设置在板工作机中的摄像机单元，其对板进行预定的工作，通过使用运动图像对工作的进度进行成像，并输出运动图像数据; 数据操作单元，其接收，存储和显示所述运动图像数据; 触发因素检测单元，其检测在工作机床内改变作业的工作状态的变化因素和表示工作中可能发生工作错误的错误发生的符号中的至少一个作为触发因素 ; 以及成像启动装置，用于如果触发因素检测单元检测到触发因素并且使数据操作单元临时存储运动图像数据，则使相机单元开始运动图像捕获。

公开(公告)号：US20140125375A1

公开(公告)日：2014-05-08

申请号：US14072178

申请日：2013-11-05

Applicant: KOH YOUNG TECHNOLOGY INC.

Inventor： Seung-Jun LEE ,  Moon-Young JEON ,  Nam Ho LEE

IPC: G01R31/28

CPC classification number: G01R31/2805 ,  G05B19/41875 ,  G05B2219/37217 ,  G05B2219/45026 ,  H05K13/08 ,  H05K13/0817 ,  H05K13/083

Abstract: A board inspection apparatus system includes a first apparatus, a second apparatus, a third apparatus and an information transfer section. The first apparatus acquires first three-dimensional information of a solder paste on a board, and inspects whether the solder paste is formed good by a first tolerance based on the first three-dimensional information. The second apparatus mounts an electronic component on the board to join the electronic component and the solder paste. The third apparatus acquires second three-dimensional information of a solder joint, and inspects whether the electronic component is mounted good by a second tolerance based on the second three-dimensional information. The information transfer section transfers the first three-dimensional information to the third apparatus, or transfers the second three-dimensional information to the first apparatus. Thus, a more effective inspection condition may be established, and a rate of defect for each apparatus may be greatly reduced.

Abstract translation: 板检查装置系统包括第一装置，第二装置，第三装置和信息传送部。 第一装置获取板上的焊膏的第一三维信息，并且基于第一三维信息检查焊膏是否通过第一公差形成良好。 第二装置将电子部件安装在电路板上以连接电子部件和焊膏。 第三装置获取焊点的第二三维信息，并且基于第二三维信息检查电子部件是否良好地被安装好第二公差。 信息传送部将第一三维信息传送到第三装置，或将第二三维信息传送到第一装置。 因此，可以建立更有效的检查条件，并且可以大大降低每个装置的缺陷率。

公开(公告)号：US20120317804A1

公开(公告)日：2012-12-20

申请号：US13581845

申请日：2011-07-27

Applicant: Tadashi Endo ,  Hiroshi Ogata ,  Tomohiro Kimura ,  Takaaki Yokoi

Inventor： Tadashi Endo ,  Hiroshi Ogata ,  Tomohiro Kimura ,  Takaaki Yokoi

IPC: H05K13/04 ,  H05K3/30

CPC classification number: H05K13/0452 ,  H01L2224/81 ,  H05K13/0413 ,  H05K13/0812 ,  H05K13/083 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49904 ,  Y10T29/53013 ,  Y10T29/53174 ,  Y10T29/53178

Abstract: It is intended to provide an electronic component mounting device and an operation performing method for mounting electronic components so that both the operation quality and the productivity can be improved. Height precision division information that divide the height precision required for up and down movements of operating heads into the first division which indicates a normal height precision and the second division which indicates that a high height precision is required based on the type of electronic components are stored as operation data beforehand. In operation performing procedures, when an electronic component belongs to the first division, an operating head is made to move up and down based on an approximate operation position height derived from an approximate curved surface of the top surface of a board which is calculated by using the height measurement result obtained by measuring a plurality of height measuring points on the surface of the board, and when the electronic component belongs to the second division, the operating head is made to move up and down based on an individual operation position height obtained by individually measuring the board height at the operation position.

Abstract translation: 旨在提供一种电子部件安装装置和用于安装电子部件的操作执行方法，从而可以提高操作质量和生产率。 存储高精度分割信息，其将操作头的上下运动所需的高度精度分成表示正常高度精度的第一分区，以及基于电子部件的类型指示需要高高度精度的第二分割 作为操作数据。 在操作执行过程中，当电子部件属于第一分割时，操作头基于从通过使用计算出的板的顶面的大致曲面导出的近似操作位置高度而上下移动 通过测量板的表面上的多个高度测量点而获得的高度测量结果，并且当电子部件属于第二分割时，操作头基于通过以下获得的各个操作位置高度而上下移动： 单独测量操作位置的板高度。