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公开(公告)号：US10165719B2
公开(公告)日：2018-12-25
申请号：US14655206
申请日：2013-12-19
Inventor： Katsuhiko Itoh , Daisuke Nagai , Mitsuo Nakamura
Abstract: An electronic component mounting system includes: a printing apparatus; an electronic component mounting apparatus; and a mounting information storage unit which stores mounting information. The mounting information includes execution mode information in which one of a first mounting mode and a second mounting mode is set for each of electronic components. In the first mounting mode, the electronic component is placed at a mounting position corrected on the basis of a recognition result of a first recognition mark formed on a board. In the second mounting mode, the electronic component is placed at a mounting position corrected on the basis of a recognition result of a second recognition mark formed by paste printed on the board. The electronic components are mounted on the board according to mounting modes set for the respective electronic components by referring to the mounting information.
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Patent Agency Ranking
公开(公告)号：US09661793B2
公开(公告)日：2017-05-23
申请号：US14443691
申请日：2013-11-15
Inventor： Katsuhiko Itoh , Mitsuo Nakamura , Daisuke Nagai , Kenji Okamoto
IPC: B23K31/02 , H05K13/00 , H05K13/08 , B23K1/00 , B23K1/20 , B23K31/12 , B23K37/04 , H05K3/34 , B23K1/008 , B23K3/06 , B23K3/08 , H05K13/04 , H05K3/30 , B23K101/42
CPC classification number: H05K13/0015 , B23K1/0016 , B23K1/008 , B23K1/20 , B23K3/0638 , B23K3/087 , B23K31/12 , B23K37/04 , B23K2101/42 , H05K3/303 , H05K3/34 , H05K13/0465 , H05K13/08 , H05K13/0812 , H05K13/0817 , H05K2201/10636 , H05K2203/04 , H05K2203/163 , H05K2203/166 , Y02P70/611
Abstract: In mounting position correction of detecting a position of printed solder, calculating a positional-shift amount between a position of an electrode and the position of the printed solder, and correcting a mounting position based on the calculated positional-shift amount, when a correction amount based on the calculated positional-shift amount exceeds a limit value which indicates an upper limit of the correction amount which is defined and allowed in mounting information, the electronic component is mounted on the mounting position which is corrected by considering the limit value as the correction amount. Accordingly, it is possible to appropriately employ mounting position correction by considering a solder printing position as a reference in accordance with the degree of printing position shift, and to obtain an expected joint quality improvement effect.
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公开(公告)号：US20190228520A1
公开(公告)日：2019-07-25
申请号：US16243153
申请日：2019-01-09
Inventor： Mitsuo Nakamura , Syoichi Nishi , Noboru Higashi
Abstract: A component mounting system includes a component mounter, and a server. The component mounter includes a component information recognizer, and a data output unit. The component information recognizer recognizes component information by imaging a character of the component information printed on a surface of a component. The data output unit outputs the component information together with board information to the server, the component information being recognized by the component information recognizer, the board information being information of a board on which the component is installed.
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公开(公告)号：US09629292B2
公开(公告)日：2017-04-18
申请号：US14443451
申请日：2013-11-15
Inventor： Katsuhiko Itoh , Mitsuo Nakamura , Daisuke Nagai , Kenji Okamoto
CPC classification number: H05K13/0465 , B23K3/0638 , B23K37/04 , H05K3/303 , H05K3/341 , H05K13/08 , H05K13/0817 , H05K13/083 , H05K2203/04 , H05K2203/166 , Y02P70/613
Abstract: An electronic component is mounted on a substrate according to a mounting mode which is set in advance in the following mounting information when component mounting work is performed. In the mounting information, any one of a first mounting mode in which an electronic component is transferred and mounted to a mounting position which is corrected based on a positional-shift amount between a position of printed solder and a position of an electrode and a second mounting mode in which the electronic component is transferred and mounted to the mounting position by considering only the position of the electrode as a reference, is set as a mounting mode for performance for each electronic component.
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公开(公告)号：US10929970B2
公开(公告)日：2021-02-23
申请号：US16243153
申请日：2019-01-09
Inventor： Mitsuo Nakamura , Syoichi Nishi , Noboru Higashi
Abstract: A component mounting system includes a component mounter, and a server. The component mounter includes a component information recognizer, and a data output unit. The component information recognizer recognizes component information by imaging a character of the component information printed on a surface of a component. The data output unit outputs the component information together with board information to the server, the component information being recognized by the component information recognizer, the board information being information of a board on which the component is installed.
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6.发明申请公开(公告)号：US20150296670A1
公开(公告)日：2015-10-15
申请号：US14443451
申请日：2013-11-15
Inventor： Katsuhiko Itoh , Mitsuo Nakamura , Daisuke Nagai , Kenji Okamoto
CPC classification number: H05K13/0465 , B23K3/0638 , B23K37/04 , H05K3/303 , H05K3/341 , H05K13/08 , H05K13/0817 , H05K13/083 , H05K2203/04 , H05K2203/166 , Y02P70/613
Abstract: An electronic component is mounted on a substrate according to a mounting mode which is set in advance in the following mounting information when component mounting work is performed. In the mounting information, any one of a first mounting mode in which an electronic component is transferred and mounted to a mounting position which is corrected based on a positional-shift amount between a position of printed solder and a position of an electrode and a second mounting mode in which the electronic component is transferred and mounted to the mounting position by considering only the position of the electrode as a reference, is set as a mounting mode for performance for each electronic component.
Abstract translation: 根据在执行部件安装工作时预先设置在以下安装信息中的安装模式，将电子部件安装在基板上。 在安装信息中，第一安装模式中的任何一个，其中电子部件被传送并安装到基于印刷焊料的位置和电极的位置之间的位置偏移量被校正的安装位置和第二安装模式 设置电子部件通过仅考虑电极的位置作为参考而被传送并安装到安装位置的安装模式被设置为用于每个电子部件的性能的安装模式。
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