公开(公告)号：US20160233142A1

公开(公告)日：2016-08-11

申请号：US15011805

申请日：2016-02-01

申请人： II-VI INCORPORATED

发明人： Wen-Qing Xu ,  Chao Liu ,  Giovanni Barbarossa ,  Elgin E. Eissler ,  Thomas E. Anderson ,  Charles J. Kraisinger ,  Norbert Lichtenstein

IPC分类号： H01L23/373 ,  H01L23/498

CPC分类号： H01L23/3732 ,  H01L23/3736 ,  H01L23/49838 ,  H01L23/49866 ,  H01L23/49894 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/40 ,  H01L24/83 ,  H01L25/0655 ,  H01L33/641 ,  H01L33/642 ,  H01L2224/16227 ,  H01L2224/291 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/40139 ,  H01L2224/40151 ,  H01L2224/73263 ,  H01L2224/83424 ,  H01L2224/83438 ,  H01L2224/83439 ,  H01L2224/83444 ,  H01L2224/83447 ,  H01L2224/83455 ,  H01L2224/83463 ,  H01L2224/83466 ,  H01L2224/83469 ,  H01L2224/8347 ,  H01L2224/83471 ,  H01L2224/83479 ,  H01L2224/8348 ,  H01L2224/83484 ,  H01L2224/83493 ,  H01L2224/83801 ,  H01L2224/83851 ,  H01L2924/00014 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/014 ,  H01L2924/01006 ,  H01L2924/0781 ,  H01L2924/01014 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2224/37099

摘要： A composite substrate includes a submount substrate of an alternating pattern of electrically insulative portions, pieces, layers or segments and electrically conductive portions, pieces, layers or segments, and a shaft, back or plate for supporting the alternating pattern of electrically insulative portions and electrically conductive portions. An active device having a P—N junction can be mounted on the submount substrate. The electrically insulative portions, pieces, layers or segments can be formed from diamond while the electrically conductive portions, pieces, layers or segments can be formed from a metal or metal alloy.

摘要翻译： 复合基板包括电绝缘部分，片，层或片段和导电部分，片，层或片段的交替图案的副安装座基板，以及用于支撑电绝缘部分的交替图案和电绝缘部分的电极 导电部分。 具有P-N结的有源器件可以安装在副安装座基板上。 电绝缘部分，片，层或片段可以由金刚石形成，而导电部分，片，层或片段可以由金属或金属合金形成。

公开(公告)号：US09812375B2

公开(公告)日：2017-11-07

申请号：US15011805

申请日：2016-02-01

申请人： II-VI INCORPORATED

发明人： Wen-Qing Xu ,  Chao Liu ,  Giovanni Barbarossa ,  Elgin E. Eissler ,  Thomas E. Anderson ,  Charles J. Kraisinger ,  Norbert Lichtenstein

IPC分类号： H01L23/373 ,  H01L23/498 ,  H01L33/64 ,  H01L25/065 ,  H01L23/00

CPC分类号： H01L23/3732 ,  H01L23/3736 ,  H01L23/49838 ,  H01L23/49866 ,  H01L23/49894 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/40 ,  H01L24/83 ,  H01L25/0655 ,  H01L33/641 ,  H01L33/642 ,  H01L2224/16227 ,  H01L2224/291 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/40139 ,  H01L2224/40151 ,  H01L2224/73263 ,  H01L2224/83424 ,  H01L2224/83438 ,  H01L2224/83439 ,  H01L2224/83444 ,  H01L2224/83447 ,  H01L2224/83455 ,  H01L2224/83463 ,  H01L2224/83466 ,  H01L2224/83469 ,  H01L2224/8347 ,  H01L2224/83471 ,  H01L2224/83479 ,  H01L2224/8348 ,  H01L2224/83484 ,  H01L2224/83493 ,  H01L2224/83801 ,  H01L2224/83851 ,  H01L2924/00014 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/014 ,  H01L2924/01006 ,  H01L2924/0781 ,  H01L2924/01014 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2224/37099

摘要： A composite substrate includes a submount substrate of an alternating pattern of electrically insulative portions, pieces, layers or segments and electrically conductive portions, pieces, layers or segments, and a shaft, back or plate for supporting the alternating pattern of electrically insulative portions and electrically conductive portions. An active device having a P-N junction can be mounted on the submount substrate. The electrically insulative portions, pieces, layers or segments can be formed from diamond while the electrically conductive portions, pieces, layers or segments can be formed from a metal or metal alloy.