公开(公告)号：US20170084577A1

公开(公告)日：2017-03-23

申请号：US15364715

申请日：2016-11-30

申请人： SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

发明人： Francis J. CARNEY ,  Michael J. SEDDON

IPC分类号： H01L25/065 ,  H01L21/768 ,  H01L21/48 ,  H01L25/00

CPC分类号： H01L25/0652 ,  H01L21/486 ,  H01L21/76877 ,  H01L23/13 ,  H01L23/49805 ,  H01L24/05 ,  H01L24/08 ,  H01L24/16 ,  H01L24/24 ,  H01L24/25 ,  H01L24/73 ,  H01L24/80 ,  H01L24/81 ,  H01L24/82 ,  H01L24/83 ,  H01L24/92 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/18 ,  H01L25/50 ,  H01L29/0657 ,  H01L2224/0345 ,  H01L2224/03452 ,  H01L2224/03462 ,  H01L2224/03464 ,  H01L2224/0401 ,  H01L2224/05552 ,  H01L2224/05557 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05572 ,  H01L2224/05573 ,  H01L2224/0558 ,  H01L2224/05611 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05666 ,  H01L2224/06181 ,  H01L2224/06183 ,  H01L2224/08137 ,  H01L2224/11002 ,  H01L2224/14181 ,  H01L2224/14183 ,  H01L2224/16137 ,  H01L2224/16147 ,  H01L2224/24051 ,  H01L2224/24101 ,  H01L2224/24137 ,  H01L2224/244 ,  H01L2224/245 ,  H01L2224/25175 ,  H01L2224/29019 ,  H01L2224/29021 ,  H01L2224/291 ,  H01L2224/29111 ,  H01L2224/29113 ,  H01L2224/29116 ,  H01L2224/29124 ,  H01L2224/29139 ,  H01L2224/29144 ,  H01L2224/29147 ,  H01L2224/29155 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/30151 ,  H01L2224/32137 ,  H01L2224/73251 ,  H01L2224/73267 ,  H01L2224/80897 ,  H01L2224/809 ,  H01L2224/81005 ,  H01L2224/81815 ,  H01L2224/81897 ,  H01L2224/821 ,  H01L2224/82121 ,  H01L2224/82138 ,  H01L2224/82203 ,  H01L2224/82815 ,  H01L2224/82862 ,  H01L2224/82874 ,  H01L2224/83141 ,  H01L2224/83203 ,  H01L2224/839 ,  H01L2224/9222 ,  H01L2224/94 ,  H01L2225/06506 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06548 ,  H01L2225/06551 ,  H01L2225/06572 ,  H01L2225/06589 ,  H01L2924/10156 ,  H01L2924/10252 ,  H01L2924/10253 ,  H01L2924/10272 ,  H01L2924/10322 ,  H01L2924/10329 ,  H01L2924/1033 ,  H01L2924/10335 ,  H01L2924/141 ,  H01L2924/1421 ,  H01L2924/143 ,  H01L2924/1431 ,  H01L2924/1433 ,  H01L2924/14335 ,  H01L2924/15159 ,  H01L2924/19104 ,  H01L2924/3511 ,  H01L2924/3512 ,  H01L2924/35121 ,  H01L2224/03 ,  H05K3/4661 ,  H05K3/4664 ,  H01L2924/00014 ,  H01L2224/80001 ,  H01L2224/82 ,  H01L2924/00012 ,  H01L2224/08 ,  H01L2224/24 ,  H01L2224/83 ,  H01L2924/014

摘要： A semiconductor device has a plurality of interconnected modular units to form a 3D semiconductor package. Each modular unit is implemented as a vertical component or a horizontal component. The modular units are interconnected through a vertical conduction path and lateral conduction path within the vertical component or horizontal component. The vertical component and horizontal component each have an interconnect interposer or semiconductor die. A first conductive via is formed vertically through the interconnect interposer. A second conductive via is formed laterally through the interconnect interposer. The interconnect interposer can be programmable. A plurality of protrusions and recesses are formed on the vertical component or horizontal component, and a plurality of recesses on the vertical component or horizontal component. The protrusions are inserted into the recesses to interlock the vertical component and horizontal component. The 3D semiconductor package can be formed with multiple tiers of vertical components and horizontal components.