Abstract:
A semiconductor device, in particular a target and a camera tube, respectively, for color video signals, comprising a semiconductor body having a radiation-sensitive layer, a dielectric layer and indicator members to obtain an indexing signal. According to the invention, the indicator members comprise a surface region on which thickness of the dielectric layer is different from that on the adjoining parts of the surface.
Abstract:
A semiconductor structure having a surface insulating layer formed as a grid with charges implanted in the insulating material to prevent inversion and, hence, channeling between adjacent semiconductor regions, preferably for use in nonblooming vidicon. The method of manufacturing such a structure uses ion implantation to create immobile positive charges in a grid pattern in an insulating layer in regions spaced from the interface between the insulating layer and the semiconductor body. The insulating layer is of sufficient thickness that substantially all of the charge sites in the insulating layer are separated from the outer surface of the insulator by a sufficient distance to effectively prevent a negative electric field from reaching into the silicon.
Abstract:
A radiation resistance PN junction diode with a radiation shield which is attached to the semiconductor device and extends over, but is separated from, portions of the device which it is desired to have shielded from radiation. The purpose of the shield is to provide a radiation resistant semiconductor target for use in planar electron bombarded semiconductor devices, electron beam recorders, and other devices requiring periodic or continuous electron beam or other low energy radiation monitoring. In accordance with a preferred method of the invention, the electron beam shield is fabricated simultaneously on each of a plurality of PN junction diodes in an array on a semiconductor wafer.
Abstract:
IN MAKING A TARGET FOR A TELEVISION CAMERA TUBE, IT IS NECESSARY TO THIN THE BACKSIDE OF A SEMICONDUCTIVE SUBSTRATE, WHICH IS OPPOSITE A FACE HAVING A DIODE ARRAY THEREON. TO THIN THE SUBSTRATE, IT IS POSITIONED FACE DOWN ON A FLLUID NONDELETERIOUS TO THE SUBSTRATE AND DIOD ARRAY. THE FLUID IS CONTAINED IN A CAVITY OF A HOLDING DEVICE. THE POSITIONING IS SUCH THAT THERE IS NO SPACE BETWEEN THE FLUID AND THE SUBSTRATE. AN APERTURED TOP MEMBER IS THEN MOUNTED ON THE SUBSTRATE AND THE HOLDING DEVICE TO RETAIN THE SUBSTRATE ON THE FLUID. THE ASSEMBLY OF THE HOLDING DEVICE AND TOP MEMBER WITH THE SUBSTRATE THEREBETWEEN IS IMMERSED AND ROATED IN AN ETCHANT TO THIN THE BBACKSIDE OF THE SUBSTRATE THROUGH THE APERTURE OF THE TOP MEMBER. THE FLUID PROVIDES A TIGHT SEAL ON THE FACE OF THE SUBSTRATE TO PREVENT THE ETCHANT FROM DAMAGING SUCH FACE AND THE DIODE ARRAYL THEREON A VENT EXTENDING FROM THE CAVITY OF THE HOLDING DEVICE TO ITS OUTER EDGE ASSIST IN THE SUBSEQUENT REMOVAL OF THE SUBSTRATE FROM THE CAVITY.
Abstract:
In color camera tubes having capacitance compensated indexing strips, two sets of interdigitated conductive indexing strips are placed on the cathode side of a camera tube target onto which the scene is focused. These conducting strips, which enable referencing of the electron beam position, are formed in a highly precise pattern by means of conductivity type zones formed within the semiconductor target itself. Typically, they may be fabricated by solid state diffusion or by ion implantation of a significant impurity in the same manner as is used to form the pn junction diodes which comprise the imaging means of the target. Advantageously, the conductivity type zones are covered by means of selective electrodeposition with a thin metallic plating to enhance their performance.
Abstract:
A target using a diode array for pickup tubes which consists of a semiconductor substrate including on one surface thereof an array of regions, defining PN junctions with the major portion of the substrate formed from a vapor-deposited layer of the same conductivity type as the substrate and having a plurality of polycrystalline regions of low resistivity of conductivity type opposite to the substrate.
Abstract:
THE STABILITY AND LIFETIME OF A DEVICE COMPRISING A SEMICONDUCTOR BODY COVERED BY N INSULATING LAYER IS IMPROVED BY THERMALLY GROWING AT LEAST PART OF THE INSULATING LAYER IN AN ATMOSPHERE COMPRISING OXYGEN AND HYDROGEN CHLORIDE, AND SUBSTANTIALLY FREE OF WATER VAPOR. THE DEVICE IS HEATED IN THIS ATMOSPHERE TO ESTABLISH A GRADIENT FOR OUT-DIFFUSION OF CERTAIN DELETERIOUS METALS FROM THE DEVICE.
Abstract:
A semiconductor arrangement comprises a region of a second type of conductivity formed in a semiconductor body of a first type of conductivity from one surface thereof, an insulating layer on this surface defining an opening above the said region and a resistance layer covering the opening in the insulating layer and comprising a metal silicide compound of silicon with a metal from the subgroups of groups V or VI of the periodic system which contain tungsten, molybdenum or tantalum.
Abstract:
A solid state sensing retina for infrared vidicon television camera tubes using a low voltage electron beam, consisting of a monolithic silicon wafer having an n-type substrate and two dimensional array of p-type islands, each island has a Schottky electrode photoemitter and substrate contact buss, an ohmic contact pad allows charging of the p-type region beneath the Schottky electrode.