摘要:
Steel sheets for hot stamping accommodated in a far-infrared radiation multi-stage type heating furnace are stably supported over a long period of time using steel sheet support members having a small projected area and inhibited from thermally deforming. The far-infrared radiation multi-stage type heating furnace includes: heating units and a ceiling unit arranged in a vertical direction with multiple stages to accommodate aluminum-coated steel sheets or zinc- coated steel sheets for hot stamping; and far-infrared radiation heaters disposed within the heating units and the ceiling unit to heat the steel sheets for hot stamping to a temperature ranging from the Ac3 transformation temperature to 950° C. Steel sheet support members are mounted to the heating units to support the steel sheets for hot stamping by point contact or line contact with the steel sheets for hot stamping.
摘要:
A heating section 20 having heating elements using carbon which generates heat when a high-frequency electric current is fed to a coil whose pitch can be adjusted as desired is arranged in a heating chamber 10. A cooling chamber 80 configured to cool metal is disposed below the heating chamber 10 in communication with the heating chamber 10 via a connection section 60. A water-cooled vertically movable shaft 90 which is capable of supporting the metal to be heat-treated and entering the heating chamber 10 is disposed so as to penetrate through the bottom portion of the cooling chamber 80. A gas introducing pipe 81 configured to introduce gas for cooling heated metal to be heat-treated supported by the water-cooled vertically movable shaft 90 and moved from the heating chamber 10 to the cooling chamber 80 is disposed in the cooling chamber 80.
摘要:
The heat treating furnace for the gas reaction includes an outer body, an inner body, a heating mechanism, gas supplying mechanism, and a controller. Using the controller to control the amount of gas supply effectively keeps the first pressure (P1) in the gas circulation chamber outside the inner body greater than the second pressure (P2) in the reaction chamber inside the inner body all the time. In this way, the flow rate of gas inlet, reaction rate, cooling rate can be facilitated, and the uniformity of the thin film and the operational safety can be improved.
摘要:
A vacuum oven for decontaminating items, a system incorporating multiple vacuum ovens and a method of operating such system are provided. The ovens are portable. They can have a vacuum drawn in them and can be heated by being coupled to a vacuum and a power source, respectively at a first location and then be decoupled from the vacuum and power sources and moved to a second location such as a glove box or clean room while still maintaining a vacuum.
摘要:
A muffle seal for a high temperature furnace in which a quartz or similar muffle is attached to an associated metal structure to provide substantial sealing of gas in the muffle even at extremely high operating temperatures. As employed in a multi-zone furnace having a high temperature quartz muffle section and a lower temperature metal muffle section joined thereto via a gas or gas and heat barrier, the quartz muffle is joined to the barrier by a peripheral chamber provided around the end of the quartz muffle confronting the barrier, the chamber being sealed to surfaces of the muffle and the barrier by porous gaskets. A sealing gas is introduced at above atmospheric pressure to the peripheral chamber, the gas being controllably transmitted through the porous gaskets to provide isolation against leakage of gas within the quartz muffle. The novel seal can also be employed to join quartz and metal muffle sections without a barrier therebetween.
摘要:
In some examples, a multilevel retort assembly. The assembly includes a base defining a base perimeter; and a plurality of shells. Each shell has a diffuser plate support and a perimeter with a substantially similar shape as the base perimeter. The plurality of shells are stacked on each other, mechanically supported by the base, and surround an inner retort volume. The at least one shell of the plurality of shells defines a removable window. The assembly also includes a plurality of diffuser plates, each diffuser plate supported by a corresponding diffuser plate support of the plurality of diffuser plate supports.
摘要:
A heat treatment system includes heating chambers configured to perform heat treatment on objects to be treated, and a conveyance device configured to load each of the objects to be treated into the heating chambers, unload the object to be treated from the heating chambers, and convey the object to be treated under an oxygen-free atmosphere, wherein the conveyance device includes a cooling device configured to perform cooling treatment on the object to be treated.
摘要:
A thermal treatment device includes a heating chamber which heats an object to be treated; and a moisture removal chamber which is provided adjacent to the heating chamber to put in and out of the object to be treated toward the heating chamber, and in which a vacuum atmosphere is created in the periphery of the object to be treated.
摘要:
An apparatus for heat treating metals includes a container configured for receiving a metal therein for heat treatment, a first power supply configured for generating a first electric field and applying a first voltage U1 represented by a following formula: U 1 = { u 1 cos ( 2 π f t ) ( ( 2 n + 1 / 2 ) π ≤ 2 π f t ≤ ( 2 n + 3 / 2 ) π ) - u 2 ( 2 n π
摘要:
A cantilever tube for carrying loaded wafer boats into a diffusion furnace and confining flow of gas through the wafers includes an elongated slot extending from an open end of the tube to a predetermined region in which the wafer boats are positioned, the wafer boats abutting each other and forming a sealing cover for the elongated slot. A narrow boat carrier supported on a carriage system extends through the elongated slot and carries a wafer boat loaded with wafers into the open end and to the predetermined region in the cantilever tube without allowing either the carrier, or the wafer boat, or the wafers to touch the cantilever tube. The carrier lowers the boat onto the bottom inner surface of the tube, causing the boat to cover a portion of the elongated slot. The procedure is repeated for subsequent wafer boats, each of which abuts the previous one, to effectively close and seal the elongated slot when all of the wafer boats are positioned inside the cantilever tube.