COOLING DEVICE AND MULTI-CHAMBER HEAT TREATMENT DEVICE
    5.
    发明申请
    COOLING DEVICE AND MULTI-CHAMBER HEAT TREATMENT DEVICE 审中-公开
    冷却装置和多室热处理装置

    公开(公告)号:US20170022579A1

    公开(公告)日:2017-01-26

    申请号:US15285026

    申请日:2016-10-04

    IPC分类号: C21D1/667

    摘要: A cooling device configured to cool an article to be treated by immersing the article to be treated in coolant includes a cooling chamber configured to accommodate the article to be treated and store the coolant therein, a supply nozzle configured to supply the coolant into the cooling chamber from below the article to be treated, a recovery pipeline configured to collect the coolant stored in the cooling chamber from above the article to be treated, and a pump configured to pump the coolant collected by the recovery pipeline to the supply nozzle.

    摘要翻译: 构造成通过将被处理物浸渍在冷却剂中来冷却待处理物品的冷却装置包括:冷却室,其构造成容纳待处理物品并将冷却剂储存在其中;供给喷嘴,其构造成将冷却剂供应到冷却室 从待处理物品的下方,配置成从待处理物品的上方收集储存在冷却室中的冷却剂的回收管道,以及将由回收管道收集的冷却剂泵送到供给喷嘴的泵。

    HEAT TREATMENT DEVICE
    6.
    发明申请
    HEAT TREATMENT DEVICE 审中-公开
    热处理装置

    公开(公告)号:US20160348969A1

    公开(公告)日:2016-12-01

    申请号:US15234518

    申请日:2016-08-11

    摘要: A heat treatment device which performs vacuum carburizing treatment by heating a workpiece is presented. The heat treatment device includes: a heater chamber in which a heater is provided; a heat treatment chamber in which the workpiece is heated and vacuum carburizing treatment is performed on the workpiece and is disposed so as to be adjacent to the heater chamber in the heat treatment device; and a muffle plate which partitions a portion between the heater chamber and the heat treatment chamber. A gas introduction portion through which burnout gas is introduced is independently provided in each of the heater chamber and the heat treatment chamber.

    摘要翻译: 提出了一种通过加热工件进行真空渗碳处理的热处理装置。 热处理装置包括:加热室,其中设置有加热器; 热处理室,其中对工件进行加热并对工件进行真空渗碳处理,并且设置成与热处理装置中的加热室相邻; 以及分隔加热器室和热处理室之间的部分的马弗板。 在每个加热室和热处理室中独立地设置引入燃烧气体的气体导入部。

    HEAT TREATMENT DEVICE
    9.
    发明申请

    公开(公告)号:US20180010854A1

    公开(公告)日:2018-01-11

    申请号:US15677100

    申请日:2017-08-15

    摘要: A heat treatment device includes: a heat treatment chamber which accommodates an object to be treated; a cooling gas supply unit which supplies a cooling gas into the heat treatment chamber; a cooling gas circulation unit which circulates the cooling gas in the heat treatment chamber; and a gas purge unit which gas-purges, with an inert gas, a portion in which there is a possibility of mixing of the cooling gas supplied into the heat treatment chamber and an oxygen gas, in which the cooling gas supply unit supplies a hydrogen gas into the heat treatment chamber as the cooling gas.