- 专利标题: HEAT TREATMENT DEVICE AND COOLING DEVICE
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申请号: US15446251申请日: 2017-03-01
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公开(公告)号: US20170175214A1公开(公告)日: 2017-06-22
- 发明人: Kazuhiko KATSUMATA , Kaoru ISOMOTO , Gen NISHITANI , Akira NAKAYAMA , Takahiro NAGATA , Yuusuke SHIMIZU
- 申请人: IHI Corporation , IHI Machinery and Furnace Co., Ltd.
- 申请人地址: JP Tokyo JP Tokyo
- 专利权人: IHI Corporation,IHI Machinery and Furnace Co., Ltd.
- 当前专利权人: IHI Corporation,IHI Machinery and Furnace Co., Ltd.
- 当前专利权人地址: JP Tokyo JP Tokyo
- 优先权: JP2014-235441 20141120
- 主分类号: C21D9/00
- IPC分类号: C21D9/00 ; C21D1/60 ; C21D1/667
摘要:
A heat treatment device includes: a heating device that heats a treatment object; a cooling device including a cooling room that accommodates the treatment object heated by the heating device and into which a cooling medium used for cooling the treatment object is supplied; a pressurized gas supplier that supplies pressurized gas into the cooling room; a pressure relief valve that communicates internal and external areas of the cooling room with each other when the pressure relief valve is opened; a pressure sensor that measures the pressure inside the cooling room; and a controller that controls the pressure relief valve such that the pressure relief valve is opened when a measurement result of the pressure sensor is higher than or equal to a threshold value.
公开/授权文献
- US10392676B2 Heat treatment device and cooling device 公开/授权日:2019-08-27
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