摘要:
A resin composition for sealing an electronic device and other things being capable of suppressing the permeation of water vapor is provided. The present invention includes a polybutadiene polymer represented by chemical formula (1) and having a (meth)acryloyl group at a terminal end; and a photopolymerization initiator, and does not include a thermoplastic resin having a mass-average molecular weight of 50,000 or more: wherein R1 and R2 each represent a hydroxyl group or H2C═C(R7)—COO—; R3 and R4 each represent a C1-C16 substituted or unsubstituted divalent organic group; R5, R6 and R7 each represent a hydrogen atom or a C1-C10 alkyl group, and at least one organic group represented by chemical formula (2) is included within chemical formula (1); l and m each represent 0 or 1; n represents an integer of 15-150; and x:y=0 to 100:100 to 0; R1 and R2 are never both a hydroxyl group.
摘要:
A method of applying a coating of a hot-melt adhesive to a substrate which comprises applying as the adhesive coating a composition which comprises (A) about 1 to 99 percent by weight of thermoplastic segmented copolyester elastomer consisting essentially of a multiplicity of recurring short chain ester units and long chain ester units joined through ester linkages, said short chain ester units amounting to about 15 to 75 percent by weight of said copolyester and being derived from aromatic dicarboxylic acid such as terephthalic acid, or a mixture of terephthalic and isophthalic acids, and an organic diol such as butanediol, and said long chain ester units amounting to about 25 to 85 percent by weight of said copolyester and being derived from aromatic dicarboxylic acid such as terephthalic acid, or a mixture of terephthalic and isophthalic acids, and a long chain glycol such as polytetramethylene ether glycol, said copolyester having a melt index of less than about 150 and a melting point of at least about 125.degree.C., and (B) about 1 to 99 percent by weight of one or more low molecular weight thermoplastic resins including hydrocarbon resins such as coumarone-indene resins, petroleum resins, styrene polymers, cyclopentadiene resins and terpene resins, bituminous asphalts, coal tar pitches, rosins, phenolic resins, chlorinated aliphatic hydrocarbon waxes, and chlorinated polynuclear aromatic hydrocarbons, can be applied to various substrates such as films, furniture, tiles, labels, tapes, decorative molding of wood or plastic, etc.
摘要:
A hot-melt composition comprising a hydrogenated aromatic petroleum resin and an ethylene-unsaturated ester copolymer, said hydrogenated aromatic petroleum resin being prepared by polymerizing a cracked petroleum fraction boiling between -10* and 280*C and containing unsaturated hydrocarbons at least 50 percent by weight of which is polymerizable aromatic hydrocarbon and hydrogenating the resulting aromatic hydrocarbon resin to a hydrogenation degree of aromatic ring of 5 to 80 percent.
摘要:
A process for producing an aromatic hydrocarbon resin having excellent weather resistance and heat resistance which comprises separating a fraction containing a certain amount of conjugated diolefin and indene and indene alkyl derivatives from a hydrocarbon fraction having a boiling point of 140.degree.220.degree. C. obtained from thermal cracking of petroleum, then adding Friedel-Crafts type catalysts to said fraction, subjecting to polymerization reaction at -30.degree.-+60.degree. C. for 10 minutes to 15 hours, thereafter decomposing and removing said catalyst and separating unreacted oils and low polymers from the reaction products by evaporation or distillation.
摘要:
This invention relates to hot-melt compositions for adhesives and coating agents which comprise a polyolefin selected from the group consisting of ethylene-vinyl acetate copolymers and amorphous polypropylenes and a petroleum resin which is produced from fractions selected from C4-C5 fractions having a -15* to 45*C boiling point obtained by cracking or reforming, in combination with an aromatic hydrocarbon fraction having a high degree of unsaturation and a boiling point in the range of 145* to 280*C.