摘要:
An acetylide-form propargyl-containing resin composition for cationic electrocoating, which comprises a resin having a skeleton of epoxy resin and has a number average molecular weight of 500 to 20,000, and which contains, per 100 grams of the resin composition solids, 5 to 400 millimoles of sulfonium group and 10 to 495 millimoles of propargyl group, the total content of the sulfonium and propargyl groups being not more than 500 millimoles per 100 grams of the resin composition solids, said propargyl group being partly in the form of an acetylide. This resin composition may further contain unsaturated double bonds.
摘要:
Water-soluble sulfonium salts are converted, without the elimination of odorous volatile by-products, to water-insoluble products useful as binders in coating formulations by heating a water-soluble cyclic sulfonium salt in which the sulfonium sulfur is bonded only to aliphatic carbons.
摘要:
A protective film-forming composition including good mask (protection) function against a wet etching liquid and a high dry etching rate during processing of semiconductor substrates, including good coverage even in stepped substrates, and from which flat films can be formed due to a small difference in film thickness after embedding; a protective film produced using said composition; a substrate with a resist pattern; and a method for manufacturing a semiconductor device. A protective film-forming composition which protects against a semiconductor wet etching liquid, wherein a reaction product (P) of a diepoxy compound (B) and an bifunctional proton-generating compound (C) contains a structure represented by formula (1) (in formula (1), Ar represents a C6-40 aryl group, n represents an integer of 2-10, —Y— represents—OCO—, —O— or —S—, and * represents the bonding site with the reaction product (P) molecule terminal). The protective film-forming composition further includes an organic solvent (S).
摘要:
A process for converting epoxy resin to episulfide resin through reactive melt extrusion of a solid epoxy resin with a sulfur donating compound. The resulting resin provides for an application that utilizes the resulting extruded episulfide resin as a low application temperature resin for powder coatings applications.
摘要:
Disclosed herein are a resin composition for a printed circuit board, an insulating film, a prepreg, and a printed circuit board, the resin composition including: a composite epoxy resin containing a bisphenol A type epoxy resin, a cresol novolac epoxy resin, a rubber-modified epoxy resin, a phosphorus based epoxy resin, and an alkyl sulfonated tetrazole-modified epoxy resin; and a curing agent. The insulating film and the prepreg according to the present invention may have basically low coefficient of thermal expansion, excellent heat resistance, a high glass transition temperature, and excellent adhesion force with the metal.
摘要:
A curable resin composition which has excellent curability and storage stability, and in particular, which has improved storage stability under the condition where the resin composition only contains the resin component and the latent curing agent. A curable resin composition having a resin component having oxirane ring and thiirane ring at a ratio (oxirane ring/thiirane ring) of 95/5 to 1/100; and an oxazolidine compound represented by the following formula (1): 1 wherein R1 represents a hydrocarbon group having 1 to 6 carbon atoms, and R2 and R3 independently represent hydrogen atom or a monovalent hydrocarbon group having 1 to 15 carbon atoms, or together form an alicyclic ring or an aromatic ring.
摘要:
An acetylide-form propargyl-containing resin composition for cationic electrocoating, which comprises a resin having a skeleton of epoxy resin and has a number average molecular weight of 500 to 20,000, and which contains, per 100 grams of the resin composition solids, 5 to 400 millimoles of sulfonium group and 10 to 495 millimoles of propargyl group, the total content of the sulfonium and propargyl groups being not more than 500 millimoles per 100 grams of the resin composition solids, said propargyl group being partly in the form of an acetylide. This resin composition may further contain unsaturated double bond.
摘要:
The invention relates to a cathodic electrocoating process, which uses electrocoating baths which contain a cationc amine-modified epoxy resin otainable by reacting(A) a diepoxy compound of an epoxy equivalent weight below 2000B) a compound monofunctionally reactive toward the epoxide groups and containign an alcoholic OH group, a phenolic OH group or an SH group, and(C) an amine,the components (A) and (B) being used in molar ratio of 10:1 to 1:1, preferably 4:1 to 1.5:1 and the positive charges being introduced by protonization of the reaction product and/or by use of amine salts as the component (C). The electrocoating baths used are distinguished by containing at least 7.5% by weight of a polyoxyalkylenepolyamine, the percentage by weight referring to the total amount of binders contained in the electrocoating bath.
摘要:
A protective film-forming composition including good mask (protection) function against a wet etching liquid and a high dry etching rate during processing of semiconductor substrates, including good coverage even in stepped substrates, and from which flat films can be formed due to a small difference in film thickness after embedding; a protective film produced using said composition; a substrate with a resist pattern; and a method for manufacturing a semiconductor device. A protective film-forming composition which protects against a semiconductor wet etching liquid, wherein a reaction product (P) of a diepoxy compound (B) and an bifunctional proton-generating compound (C) contains a structure represented by formula (1) (in formula (1), Ar represents a C6-40 aryl group, n represents an integer of 2-10, —Y— represents —OCO—, —O— or —S—, and * represents the bonding site with the reaction product (P) molecule terminal). The protective film-forming composition further includes an organic solvent (S).