Low-k dielectric aerogel and preparation method therefor

    公开(公告)号:US12054585B2

    公开(公告)日:2024-08-06

    申请号:US17488666

    申请日:2021-09-29

    Abstract: Manufacturing a low-K dielectric organic/inorganic aerogel composite material and its application are provided. The manufacturing method comprises: (1) mixing; (2) hydrolysis; (3) condensation; (4) aging; (5) drying; (6) impregnating polymer solution; (7) phase separation and drying; and (8) cross-linking and curing. The manufacturing method can produce a low-K dielectric organic/inorganic aerogel composite material having a high strength. The low-K dielectric aerogel is in a porous structure, and its porosity is higher than 70% and its density is from 0.12 g/cm3 to 0.45 g/cm3. The dielectric property of the low-K dielectric aerogel decreases along with an increase of its porosity, wherein a dielectric constant thereof is from 1.28 to 1.89, and a dielectric loss thereof is from 0.052 to 0.023. The low-k dielectric aerogel can be used for a dielectric layer in a high-frequency circuit, an insulation layer in a semiconductor device or a microwave circuit in a communication integrated circuit.

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