公开(公告)号：US20180143352A1

公开(公告)日：2018-05-24

申请号：US15325448

申请日：2016-12-28

Applicant: Wuhan China Star Optoelectronics Technology Co., Ltd.

Inventor： Guowei ZHA

IPC: G02B1/113 ,  C03C17/34 ,  C03C17/23 ,  C01B32/186 ,  C01B32/188 ,  B32B3/30 ,  B81C1/00 ,  B82B3/00

CPC classification number: G02B1/113 ,  B32B3/30 ,  B81C1/00555 ,  B81C2201/0177 ,  B82B3/0095 ,  C01B32/186 ,  C01B32/188 ,  C01B2204/20 ,  C03C17/23 ,  C03C17/3441 ,  C03C2217/734 ,  G02B1/118

Abstract: A manufacturing method of micro-nano structure antireflective coating layer and a display apparatus thereof are described. The method includes providing a substrate, forming a silicon oxide layer on the substrate, forming a graphene layer with a hexagonal honeycomb lattice on the silicon oxide layer, and forming a bottom surface of the antireflective coating layer in the nucleation points by serving the graphene layer as a growing base layer, wherein a diffusion length and an atomic mass of diffusion atoms of the antireflective coating layer are decreased with time by a gradient growing manner to form a upper surface of the antireflective coating layer.

公开(公告)号：US20160144365A1

公开(公告)日：2016-05-26

申请号：US14903960

申请日：2014-07-08

Applicant: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES

Inventor： Sebastien MERMOZ ,  Lea DI CIOCCIO ,  Thomas MAGIS ,  Loic SANCHEZ

IPC: B01L3/00 ,  B81B1/00 ,  B81C1/00

CPC classification number: B01L3/561 ,  B01L3/502 ,  B01L2200/12 ,  B01L2300/0838 ,  B81B1/002 ,  B81B2201/058 ,  B81C1/00555 ,  B81C1/00626 ,  B81C3/005 ,  B81C2201/0112 ,  H01L21/30655 ,  H01L23/13 ,  H01L2224/95146

Abstract: A method for capillary self-assembly of a plate and a carrier, including: forming an etching mask on a region of a substrate; reactive-ion etching the substrate, the etching using a series of cycles each including isotropic etching followed by surface passivation, wherein a duration of the isotropic etching for each cycle increases from one cycle to another, a ratio between durations of the passivation and etching of each cycle is lower than a ratio for carrying out a vertical anisotropic etching to form a carrier having an upper surface defined by the region and side walls defining an acute angle with the upper surface; removing the etching mask; placing a droplet on the upper surface of the carrier; and placing the plate on the droplet.

Abstract translation: 一种用于板和载体的毛细管自组装的方法，包括：在衬底的区域上形成蚀刻掩模; 反应离子蚀刻衬底，蚀刻使用一系列循环，每个循环包括各向同性蚀刻，然后进行表面钝化，其中每个循环的各向同性蚀刻的持续时间从一个循环增加到另一个周期，钝化和蚀刻的持续时间之间的比率 每个周期低于进行垂直各向异性蚀刻的比例，以形成具有由与上表面限定锐角的区域和侧壁限定的上表面的载体; 去除蚀刻掩模; 在载体的上表面上放置液滴; 并将板放在液滴上。

公开(公告)号：US11953675B2

公开(公告)日：2024-04-09

申请号：US18072227

申请日：2022-11-30

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Tatsuya Sugimoto ,  Tomofumi Suzuki ,  Kyosuke Kotani ,  Yutaka Kuramoto ,  Daiki Suzuki

IPC: B81B3/00 ,  B81C1/00 ,  G02B7/182 ,  G02B26/08 ,  G02B26/10 ,  H02N1/00

CPC classification number: G02B26/0841 ,  B81B3/0045 ,  B81C1/00555 ,  G02B7/1821 ,  G02B26/105 ,  H02N1/008 ,  B81B2201/042 ,  B81C2201/013 ,  B81C2201/0174 ,  B81C2201/0198

Abstract: An optical device includes a support portion a movable unit and a pair of torsion bars disposed on both sides of the movable unit on a first axis. The movable unit includes a main body portion, a ring-shaped portion surrounding the main body portion when viewed from a predetermined direction perpendicular to the first axis, two connection portions connecting the main body portion and the ring-shaped portion to each other, and a rib portion provided to the main body portion. Each of the two connection portions includes two connection regions that are separated from each other by a space and the each of the two connection region connects the main body portion and the ring-shaped portion to each other. The rib portion includes four extending portions radially extending between a center of the main body portion and the four connection regions respectively when viewed from the predetermined direction.

公开(公告)号：US20180016136A1

公开(公告)日：2018-01-18

申请号：US15546260

申请日：2016-01-21

Applicant: THE REGENTS OF THE UNIVERSITY OF CALIFORNIA

Inventor： Muchen Xu ,  Chang-Jin Kim

IPC: B81C1/00 ,  B29C33/64 ,  B29C33/42 ,  B29C33/44

CPC classification number: B81C1/00373 ,  B29C33/42 ,  B29C33/44 ,  B29C33/64 ,  B81B2207/056 ,  B81C1/00111 ,  B81C1/00357 ,  B81C1/00555 ,  B81C99/0085 ,  B81C2201/0198 ,  B81C2201/036 ,  B81C2203/0136 ,  B81C2203/036 ,  B81C2203/0757

Abstract: A method of making microstructures having re-entrant or doubly re-entrant topology includes forming a mold defining the negative surface features of the re-entrant or doubly re-entrant topology that is to be formed. In one embodiment, a soft or flowable material is formed on a first substrate and the mold is contacted with the same to form a solid, now positive surface having the re-entrant or doubly re-entrant topology. The mold is then released from the first substrate. The microstructures are secured to a second, different substrate, and the first substrate is removed. Any residual microstructure material located between adjacent microstructures may be removed to form the separate microstructures on the second substrate. The second substrate may be thin and flexible any manipulated into useful or desired shapes having the microstructures on one side thereof.

公开(公告)号：US11650411B2

公开(公告)日：2023-05-16

申请号：US16762174

申请日：2018-09-04

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Tatsuya Sugimoto ,  Tomofumi Suzuki ,  Kyosuke Kotani

IPC: G02B26/08 ,  G02B7/182 ,  H02N1/00 ,  G02B26/10 ,  B81C1/00

CPC classification number: G02B26/0841 ,  B81C1/00555 ,  G02B7/1821 ,  G02B26/105 ,  H02N1/008 ,  B81B2201/042 ,  B81C2201/013 ,  B81C2201/0174 ,  B81C2201/0198

Abstract: In an optical device, when viewed from a first direction, first, second, third, and fourth movable comb electrodes are respectively disposed between a first support portion and a first end of a movable unit, between a second support portion and a second end of the movable unit, between a third support portion and the first end, and between a fourth support portion and the second end of the movable unit. The first and second support portions respectively include first and second rib portions formed so that the thickness of each of the first and second support portions becomes greater than the thickness of the first torsion bar. The third and fourth support portions respectively include third and fourth rib portions formed so that the thickness of each of the third and fourth support portions becomes greater than the thickness of the second torsion bar.

公开(公告)号：US20180086631A1

公开(公告)日：2018-03-29

申请号：US15559407

申请日：2015-12-15

Applicant: Goertek, Inc.

Inventor： Mengjin Cai ,  Qinglin Song

IPC: B81C1/00

CPC classification number: B81C1/00047 ,  B81B2201/0264 ,  B81C1/00079 ,  B81C1/00158 ,  B81C1/00269 ,  B81C1/00555

Abstract: A method for forming a cavity of a sensor chip. The method comprises forming a first groove (a2) on a substrate (a1); bonding a covering layer (a4) onto the substrate (a1) to cover the first groove (a2), thereby forming a cavity; and etching the covering layer (a4) to decrease a thickness of the covering layer. The method can implement a thinner thickness of a film, thereby improving the sensitivity of a sensor.

公开(公告)号：US20240199413A1

公开(公告)日：2024-06-20

申请号：US18594647

申请日：2024-03-04

Applicant: X-Celprint Limited

Inventor： Pierluigi Rubino

IPC: B81C1/00

CPC classification number: B81C1/00039 ,  B81C1/00523 ,  B81C1/00555 ,  B81C2201/0105 ,  B81C2201/013

Abstract: A micro-device structure comprises a source substrate having a sacrificial layer comprising a sacrificial portion adjacent to an anchor portion, a micro-device disposed completely over the sacrificial portion, the micro-device having a top side opposite the sacrificial portion and a bottom side adjacent to the sacrificial portion and comprising an etch hole that extends through the micro-device from the top side to the bottom side, and a tether that physically connects the micro-device to the anchor portion. A micro-device structure comprises a micro-device disposed on a target substrate. Micro-devices can be 10 any one or more of an antenna, a micro-heater, a power device, a MEMs device, and a micro-fluidic reservoir.

公开(公告)号：US20240192483A1

公开(公告)日：2024-06-13

申请号：US18584740

申请日：2024-02-22

Applicant: Hamamatsu Photonics K.K.

Inventor： Tatsuya SUGIMOTO ,  Tomofumi SUZUKI ,  Kyosuke KOTANI ,  Yutaka KURAMOTO ,  Daiki SUZUKI

IPC: G02B26/08 ,  B81B3/00 ,  B81C1/00 ,  G02B7/182 ,  G02B26/10 ,  H02N1/00

CPC classification number: G02B26/0841 ,  B81B3/0045 ,  B81C1/00555 ,  G02B7/1821 ,  G02B26/105 ,  H02N1/008 ,  B81B2201/042 ,  B81C2201/013 ,  B81C2201/0174 ,  B81C2201/0198

Abstract: An optical device includes a support portion, a movable portion; and a pair of torsion bars. An optical function portion is provided on one surface of the movable portion and a rib portion is provided on the other surface of the movable portion. The rib portion includes eight extending portions of first to eighth extending portions. When setting directions in which the first to eighth extending portions extend as first to eighth extending directions respectively, and setting an angle between the first and second extending directions as a first angle, an angle between the third and fourth extending directions as a second angle, an angle between the fifth and sixth extending directions as a third angle, and an angle between the seventh and eighth extending directions as a fourth angle, each of the first and second angle is larger than each of the third and fourth angle.

公开(公告)号：US09586207B2

公开(公告)日：2017-03-07

申请号：US14903960

申请日：2014-07-08

Applicant: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES ,  STMICROELECTRONICS (CROLLES 2) SAS

Inventor： Sebastien Mermoz ,  Lea Di Cioccio ,  Thomas Magis ,  Loic Sanchez

IPC: B44C1/22 ,  C03C15/00 ,  C03C25/68 ,  C23F1/00 ,  B01L3/00 ,  B81C1/00 ,  B81C3/00 ,  B81B1/00 ,  H01L23/13 ,  H01L21/3065

CPC classification number: B01L3/561 ,  B01L3/502 ,  B01L2200/12 ,  B01L2300/0838 ,  B81B1/002 ,  B81B2201/058 ,  B81C1/00555 ,  B81C1/00626 ,  B81C3/005 ,  B81C2201/0112 ,  H01L21/30655 ,  H01L23/13 ,  H01L2224/95146

Abstract: A method for capillary self-assembly of a plate and a carrier, including: forming an etching mask on a region of a substrate; reactive-ion etching the substrate, the etching using a series of cycles each including isotropic etching followed by surface passivation, wherein a duration of the isotropic etching for each cycle increases from one cycle to another, a ratio between durations of the passivation and etching of each cycle is lower than a ratio for carrying out a vertical anisotropic etching to form a carrier having an upper surface defined by the region and side walls defining an acute angle with the upper surface; removing the etching mask; placing a droplet on the upper surface of the carrier; and placing the plate on the droplet.

Abstract translation: 一种用于板和载体的毛细管自组装的方法，包括：在衬底的区域上形成蚀刻掩模; 反应离子蚀刻衬底，蚀刻使用一系列循环，每个循环包括各向同性蚀刻，然后进行表面钝化，其中每个循环的各向同性蚀刻的持续时间从一个循环增加到另一个周期，钝化和蚀刻的持续时间之间的比率 每个周期低于进行垂直各向异性蚀刻的比例，以形成具有由与上表面限定锐角的区域和侧壁限定的上表面的载体; 去除蚀刻掩模; 在载体的上表面上放置液滴; 并将板放在液滴上。

公开(公告)号：US09452926B1

公开(公告)日：2016-09-27

申请号：US13561359

申请日：2012-07-30

Applicant: Robert Okojie

Inventor： Robert Okojie

IPC: B81C1/00

CPC classification number: B81C1/00531 ,  B81B2201/0264 ,  B81B2203/0109 ,  B81C1/0015 ,  B81C1/00555 ,  B81C1/00595 ,  B81C2201/0132 ,  B81C2201/0136

Abstract: A method for selectively etching a substrate is provided. In one embodiment, an epilayer is grown on top of the substrate. A resistive element may be defined and etched into the epilayer. On the other side of the substrate, the substrate is selectively etched up to the resistive element, leaving a suspended resistive element.

Abstract translation: 提供了一种用于选择性蚀刻衬底的方法。 在一个实施例中，在衬底的顶部上生长外延层。 可以限定电阻元件并蚀刻到外延层中。 在衬底的另一侧，衬底被选择性蚀刻到电阻元件上，留下一个悬置的电阻元件。