Plasma enhanced ALD system
    1.
    发明授权

    公开(公告)号:US10351950B2

    公开(公告)日:2019-07-16

    申请号:US15033071

    申请日:2014-11-21

    申请人: Ultratech, Inc.

    摘要: An improved Plasma Enhanced Atomic Layer Deposition (PEALD) system and related operating methods are disclosed. A vacuum reaction chamber includes a vacuum system that separates a first outflow from the reaction chamber, comprising unreacted first precursor, from a second outflow from the reaction chamber, comprising second precursor and any reaction by products from the reaction of the second precursor with the coating surfaces. A trap, including trap material surfaces, is provided to remove first precursor from the first outflow when the first precursor reacts with the trap material surfaces. When the second precursor includes a plasma generated material, the second precursor is not passed through the trap. An alternate second precursor source injects a suitable second precursor into the trap to complete a material deposition layer onto the trap surfaces thereby preparing the trap material surfaces to react with the first precursor on the next material deposition cycle.

    ALD systems and methods
    4.
    发明授权

    公开(公告)号:US09777371B2

    公开(公告)日:2017-10-03

    申请号:US13203602

    申请日:2010-02-26

    IPC分类号: C23C16/455 C23C16/44

    摘要: A gas deposition system (1000) configured as a dual-chamber “tower” includes a frame (1140) for supporting two reaction chamber assemblies (3000), one vertically above the other. Each chamber assembly (3000) includes an outer wall assembly surrounding a hollow chamber (3070) sized to receive a single generation 4.5 (GEN 4.5) glass plate substrate through a load port. The substrate is disposed horizontally inside the hollow chamber (3070) and the chamber assembly (3000) includes removable and cleanable triangular shaped input (3150) and output (3250) plenums disposed external to the hollow chamber (3070) and configured to produce substantially horizontally directed laminar gas flow over a top surface of the substrate. Each chamber includes a cleanable and removable chamber liner assembly (6000) disposed inside the hollow chamber (3070) to contain precursor gases therein thereby preventing contamination of chamber outer walls (3010, 3020, 3030, 3040).

    Laser spike annealing using fiber lasers

    公开(公告)号:US09343307B2

    公开(公告)日:2016-05-17

    申请号:US14497006

    申请日:2014-09-25

    申请人: Ultratech, Inc.

    摘要: The disclosure is directed to laser spike annealing using fiber lasers. The method includes performing laser spike annealing of a surface of a wafer by: generating with a plurality of fiber laser systems respective CW output radiation beams that partially overlap at the wafer surface to form an elongate annealing image having a long axis and a length LA along the long axis; heating at least a region of the wafer to a pre-anneal temperature TPA; and scanning the elongate annealing image over the wafer surface and within the pre-heat region so that the annealing image has a dwell time tD in the range 30 ns≦tD≦10 ms and raises the wafer surface temperature to an annealing temperature TA.

    Atomic Layer Deposition Head
    9.
    发明申请
    Atomic Layer Deposition Head 有权
    原子层沉积头

    公开(公告)号:US20160115596A1

    公开(公告)日:2016-04-28

    申请号:US14957273

    申请日:2015-12-02

    申请人: Ultratech, Inc.

    IPC分类号: C23C16/455 C23C16/44

    摘要: An ALD coating method to provide a coating surface on a substrate is provided. The ALD coating method comprises: providing a deposition heading including a unit cell having a first precursor nozzle assembly and a second precursor nozzle assembly; emitting a first precursor from the first precursor nozzle assembly into chamber under atmospheric conditions in a direction substantially normal to the coating surface; emitting a second precursor from the first precursor nozzle assembly into chamber under atmospheric conditions in a direction substantially normal to the coating surface; removing moving the substrate under the deposition head such that the first precursor is directed onto a first area of the coating surface prior to the second precursor being directed onto the first area of the coating surface.

    摘要翻译: 提供了一种在基板上提供涂层表面的ALD涂覆方法。 ALD涂覆方法包括:提供包括具有第一前体喷嘴组件和第二前体喷嘴组件的单元的沉积标题; 在大气条件下沿基本上垂直于涂层表面的方向将第一前体从第一前体喷嘴组件发射到室中; 在大气条件下沿基本上垂直于涂层表面的方向将第二前体从第一前体喷嘴组件发射到室中; 去除在沉积头下方移动衬底,使得第一前体在第二前体被引导到涂层表面的第一区域之前被引导到涂层表面的第一区域上。