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公开(公告)号：US12132032B2
公开(公告)日：2024-10-29
申请号：US17720674
申请日：2022-04-14
发明人： Xia Deng , Chun-Lung Hsiao
IPC分类号： H01L33/00 , H01L25/075 , H01L27/15
CPC分类号： H01L25/0753 , H01L33/0093
摘要： The disclosure relates to a micro component structure and a manufacturing method thereof, and a transfer method for a light-emitting diode (LED) chip. The micro component structure includes a substrate (300), multiple stacked adhesive layer structures spaced on a first surface (300a) of the substrate (300), and multiple LED chips (20) correspondingly disposed on the multiple stacked adhesive layer structures. Each of the multiple LED chips (20) has two extraction electrodes (21) at a surface facing toward the multiple stacked adhesive layer structures. Each of the multiple stacked adhesive layer structures includes a photolysis adhesive layer (31′) and a pyrolysis adhesive layer (32′) that are stacked. The photolysis adhesive layer (31′) is in contact with the first surface (300a). The pyrolysis adhesive layer (32′) is located between the two extraction electrodes (21) and has a thickness greater than a height of each of the two extraction electrodes (21).
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公开(公告)号：US12062555B2
公开(公告)日：2024-08-13
申请号：US17383464
申请日：2021-07-23
发明人： Qiang Li
IPC分类号： H01L21/67 , H01L25/075 , H01L33/62
CPC分类号： H01L21/67121 , H01L25/0753 , H01L33/62 , H01L2933/0066
摘要： The disclosure provides a micro light-emitting diode mass transfer apparatus and method. The micro light-emitting diode mass transfer apparatus includes a solution container, display backplanes, a solution drive assembly and a liquid level control assembly. The solution container contains a transfer solution, and micro light-emitting diodes to be transferred float on the liquid surface of the transfer solution. The display backplanes are submerged in the transfer solution and each provided with a plurality of chip mounting cells; mounting cell opening directions of the plurality of chip mounting cells face toward the micro light-emitting diodes; and at least one of the chip mounting cells is exposed on the liquid surface. The solution drive assembly is disposed in the solution container. The liquid level control assembly is configured to control a liquid level of the transfer solution in the solution container. The liquid level control assembly controls the liquid level of the transfer solution, the solution drive assembly provides a centrifugal force to the transfer solution, and the micro light-emitting diodes are precisely transferred into the corresponding chip mounting cells through the centrifugal force.
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公开(公告)号：US12015113B2
公开(公告)日：2024-06-18
申请号：US17424173
申请日：2020-04-30
发明人： Shoujun Xiao , Tzu-ping Lin , Shan-Fu Yuan , Liu-chung Lee , Chung-yu Chou
IPC分类号： H01L33/62 , H01L25/075 , H01L25/16 , H01L33/00 , H01L33/38
CPC分类号： H01L33/62 , H01L25/0753 , H01L25/167 , H01L33/005 , H01L33/38 , H01L2224/11001 , H01L2224/11002 , H01L2224/11003 , H01L2933/0016 , H01L2933/0066
摘要： The application discloses a bonding method, a display backplane and a system for manufacturing the display backplane. The method includes: providing a substrate, and forming a plurality of first metal bumps on the substrate; providing a transfer device to transfer the plurality of the first metal bumps to a TFT substrate to form a plurality of pairs of metal pads on the TFT substrate, wherein each pair of the metal pads include two of the first metal bumps; and providing a plurality of LED flip chips, and transferring the plurality of LED flip chips to the TFT substrate by using the transfer device to bond electrodes of each of the LED flip chips to one pair of the metal pads respectively.
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公开(公告)号：US11847963B2
公开(公告)日：2023-12-19
申请号：US17263905
申请日：2020-01-20
发明人： Shisong Zheng
IPC分类号： G09G3/3225
CPC分类号： G09G3/3225 , G09G2300/0852 , G09G2310/061 , G09G2320/0233
摘要： The disclosure discloses a driving circuit and a display apparatus, wherein the driving circuit includes a substrate circuit and at least one standby circuit, and the at least one standby circuit is connected with the substrate circuit; the substrate circuit includes a first light-emitting device, a first driving unit and a first capacitor unit; the first driving unit is respectively connected with the first light-emitting device and the first capacitor unit; the first capacitor unit is charged through the first driving unit until a voltage value of the first capacitor unit meets a compensation voltage value of the first driving unit; after the charging of the first capacitor unit is completed, a first reference potential is coupled with the first capacitor unit to enable the first driving unit to obtain an adjustable trans-voltage, and the first driving unit outputs a stable current according to the adjustable trans-voltage to drive the first light-emitting device to work. The disclosure improves the brightness uniformity problem caused by voltage drop, thereby improving the picture quality of the display.
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公开(公告)号：US11784159B2
公开(公告)日：2023-10-10
申请号：US17315279
申请日：2021-05-08
发明人： Jan-hsiang Yang , Kai-yi Wu , Chia-hui Shen , Jen-chieh Chiang
IPC分类号： H01L23/00 , H01L33/00 , H01L25/075 , H01L33/32
CPC分类号： H01L24/75 , H01L24/83 , H01L24/97 , H01L25/0753 , H01L33/0093 , H01L33/32 , H01L2224/75724 , H01L2224/75744 , H01L2224/75754 , H01L2224/83005 , H01L2224/83136 , H01L2224/83192 , H01L2224/95001 , H01L2224/951 , H01L2224/95136
摘要： Provided are a mass transfer device and a mass transfer method. The mass transfer device is provided with multiple channels, a first opening of each channel is arranged on a first surface of the mass transfer device, a second opening of each channel is arranged on a second surface of the mass transfer device, and the distances between the channels are gradually increased along a direction from the first surface to the second surface. In the provided mass transfer method, through a laser irradiation mode, the Micro-LEDs are separated from the first substrate and enter the channels of the mass transfer device through the first openings, and falling into Micro-LED to-be-installed positions on a second substrate through the second openings of the channels, thereby transferring the Micro-LEDs from the first substrate to the second substrate.
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公开(公告)号：US20230238473A1
公开(公告)日：2023-07-27
申请号：US17611914
申请日：2020-10-12
发明人： Tao WANG , Yuanyuan CHAI , Kai-yi WU
IPC分类号： H01L33/00
CPC分类号： H01L33/0062
摘要： Related are a transfer member, a preparation method thereof and a transfer head having the same. The preparation method thereof includes the following operations: an inorganic substrate is provided, and a material for forming the inorganic substrate is selected from any one or more of a silicon-containing inorganic material, an III-V group compound semiconductor material, an II-VI group compound semiconductor material, and a metal material, herein, the hardness of metal is less than that of sapphire; a dry etching process is used to form a first microstructure on the surface of the inorganic substrate, to obtain a patterned substrate; an elastic glue layer is formed on a patterned surface of the patterned substrate, and the elastic glue layer has a second microstructure complementary to the first microstructure; the patterned substrate is removed, to obtain the transfer member.
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7.发明公开公开(公告)号：US20230145250A1
公开(公告)日：2023-05-11
申请号：US17433614
申请日：2020-07-30
发明人： Chunlin FAN , Bin WANG , Qing WANG
CPC分类号： H01L33/20 , H01L33/382 , H01L33/32 , H01L33/007 , H01L33/62 , H01L2933/0016 , H01L2933/0066
摘要： The application relates to a substrate structure, an on-chip structure, and a method for manufacturing the on-chip structure. The substrate structure includes a substrate body and an electrothermal layer. The electrothermal layer is arranged on a surface of the substrate body for growing an epitaxial layer. In an actual lift off process of the epitaxial layer, only the electrothermal layer is electrically conducted to an external power supply via an electrode, and heating of the electrothermal layer is utilized to heat the epitaxial layer, therefore, a part of the epitaxial layer in contact with the substrate structure can be thermally decomposed and separated from the substrate structure.
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公开(公告)号：US11621371B2
公开(公告)日：2023-04-04
申请号：US17055887
申请日：2019-09-30
发明人： Shungui Yang
摘要： An epitaxial structure, a preparation method thereof, and a light-emitting diode (LED) are provided. The epitaxial structure includes a sapphire substrate, a GaN layer, a defect exposure layer, and a defect termination layer stacked in sequence.
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公开(公告)号：US20230061742A1
公开(公告)日：2023-03-02
申请号：US17881033
申请日：2022-08-04
发明人： Fei PAN , CHENG-MING LIU
IPC分类号： H01L33/08 , H01L25/075 , H01L23/00 , H01L33/00 , H01L33/60 , H01L27/15 , H01L33/62 , H01L25/065
摘要： A method for light-emitting element transferring includes: providing multiple light-emitting elements, each light-emitting element includes a first light-emitting unit, a substrate, and a second light-emitting unit sequentially stacked, the first light-emitting unit includes a first epitaxial structure and a first electrode group stacked on a side of the substrate, the second light-emitting unit includes a second epitaxial structure and a second electrode group stacked on another side of the substrate, and the first light-emitting unit and the second light-emitting unit have different light-emitting colors; providing a display backplane, multiple grooves are defined on the display backplane, a first pad group and a second pad group are provided on side walls of each groove; and embedding the multiple light-emitting elements into the multiple grooves in one-to-one correspondence, where the first electrode group is bonded with the first pad group, and the second electrode group is bonded with the second pad group.
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公开(公告)号：US20230043726A1
公开(公告)日：2023-02-09
申请号：US17424173
申请日：2020-04-30
发明人： Shoujun XIAO , Tzu-ping LIN , Shan-Fu YUAN , Liu-chung LEE , Chung-yu CHOU
IPC分类号： H01L33/62 , H01L25/075 , H01L33/00 , H01L33/38
摘要： The application discloses a bonding method, a display backplane and a system for manufacturing the display backplane. The method includes: providing a substrate, and forming a plurality of first metal bumps on the substrate; providing a transfer device to transfer the plurality of the first metal bumps to a TFT substrate to form a plurality of pairs of metal pads on the TFT substrate, wherein each pair of the metal pads include two of the first metal bumps; and providing a plurality of LED flip chips, and transferring the plurality of LED flip chips to the TFT substrate by using the transfer device to bond electrodes of each of the LED flip chips to one pair of the metal pads respectively.
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