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公开(公告)号：US20230043726A1
公开(公告)日：2023-02-09
申请号：US17424173
申请日：2020-04-30
发明人： Shoujun XIAO , Tzu-ping LIN , Shan-Fu YUAN , Liu-chung LEE , Chung-yu CHOU
IPC分类号： H01L33/62 , H01L25/075 , H01L33/00 , H01L33/38
摘要： The application discloses a bonding method, a display backplane and a system for manufacturing the display backplane. The method includes: providing a substrate, and forming a plurality of first metal bumps on the substrate; providing a transfer device to transfer the plurality of the first metal bumps to a TFT substrate to form a plurality of pairs of metal pads on the TFT substrate, wherein each pair of the metal pads include two of the first metal bumps; and providing a plurality of LED flip chips, and transferring the plurality of LED flip chips to the TFT substrate by using the transfer device to bond electrodes of each of the LED flip chips to one pair of the metal pads respectively.
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公开(公告)号：US20230162694A1
公开(公告)日：2023-05-25
申请号：US17436069
申请日：2020-08-13
发明人： Xiaojiao WEI , Shan-Fu YUAN , Liu-Chung LEE , Tzu-Ping LIN
CPC分类号： G09G3/3406 , G09G3/36 , H01L25/167 , G09G2320/068 , G09G2358/00 , G09G2300/0452 , G09G2300/0426 , G09G2320/0626
摘要： The present disclosure relates to a display panel and an electronic device. The display panel includes a driving array; first light-emitting deices electrically connected with the driving array; and second light-emitting devices located between at least two of the first light-emitting devices and electrically connected with the driving array. In a case where the first light-emitting devices are in a working state and the second light-emitting devices are in a first state, the display panel is in a first mode; and in a case where the first light-emitting devices are in a working state and the second light-emitting devices are in a second state, the display panel is in a second mode, wherein a visual angle of the display panel in the first mode is greater than 0 and smaller than a visual angle of the display panel in the second mode.
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