公开(公告)号：US12132032B2

公开(公告)日：2024-10-29

申请号：US17720674

申请日：2022-04-14

申请人： CHONGQING KONKA PHOTOELECTRIC TECHNOLOGY RESEARCH INSTITUTE CO., LTD.

发明人： Xia Deng ,  Chun-Lung Hsiao

IPC分类号： H01L33/00 ,  H01L25/075 ,  H01L27/15

CPC分类号： H01L25/0753 ,  H01L33/0093

摘要： The disclosure relates to a micro component structure and a manufacturing method thereof, and a transfer method for a light-emitting diode (LED) chip. The micro component structure includes a substrate (300), multiple stacked adhesive layer structures spaced on a first surface (300a) of the substrate (300), and multiple LED chips (20) correspondingly disposed on the multiple stacked adhesive layer structures. Each of the multiple LED chips (20) has two extraction electrodes (21) at a surface facing toward the multiple stacked adhesive layer structures. Each of the multiple stacked adhesive layer structures includes a photolysis adhesive layer (31′) and a pyrolysis adhesive layer (32′) that are stacked. The photolysis adhesive layer (31′) is in contact with the first surface (300a). The pyrolysis adhesive layer (32′) is located between the two extraction electrodes (21) and has a thickness greater than a height of each of the two extraction electrodes (21).