摘要:
In a substrate processing apparatus, a storage device, an indexer block, a processing block and an interface block are arranged to line up in this order. The storage device includes a plurality of openers on which a carrier storing a plurality of substrates can be placed. The carrier is carried in the storage device. In the storage device, the carrier is transported among the plurality of openers by a transport device. The transport device includes first and second hands configured to be able to hold the carrier and move in a horizontal direction and a vertical direction. The second hand is provided below the first hand.
摘要:
In a substrate processing apparatus, a storage device, an indexer block, a processing block and an interface block are arranged to line up in this order. The storage device includes a plurality of openers on which a carrier storing a plurality of substrates can be placed. The carrier is carried in the storage device. In the storage device, the carrier is transported among the plurality of openers by a transport device. The transport device includes first and second hands configured to be able to hold the carrier and move in a horizontal direction and a vertical direction. The second hand is provided below the first hand.
摘要:
One processing block is arranged between an indexer block and another processing block. One substrate is transported to a main transport mechanism in the one processing block by a main transport mechanism in the indexer block, transported to a first processing section and a thermal processing section by the main transport mechanism in the one processing block and processing is performed on the substrate. The substrate after the processing is transported to the main transport mechanism in the indexer block by the main transport mechanism in the one processing block. Another substrate is transported to a sub-transport mechanism in a sub-transport chamber by the main transport mechanism in the indexer block, and is transported to a main transport mechanism in another processing block by the sub-transport mechanism in the sub-transport chamber. The substrate is transported to the sub-transport mechanism in the sub-transport chamber by the main transport mechanism in another processing block, and is transported to the main transport mechanism in the indexer block by the sub-transport mechanism in the sub-transport chamber.
摘要:
An edge exposure unit includes a projector, a projector holding unit, a substrate rotating unit, an outer edge detecting unit and a surface inspection processing unit. Each component of the projector holding unit operates to move the projector in an X direction and a Y direction. The projector irradiates a peripheral portion of a substrate with light transmitted from a light source for exposure through a light guide. Edge sampling processing is performed based on distribution of an amount of light received in a CCD line sensor of the outer edge detecting unit. Surface inspection processing is performed based on distribution of an amount of light received in a CCD line sensor of the surface inspection processing unit.
摘要:
A coating head is constructed of a solvent feed mechanism connected to a forward side in a direction of movement of a coating solution feed mechanism, and a gas jet mechanism connected to a rearward side in the direction of movement. While moving the coating head relative to a substrate, a solvent is supplied onto the substrate from the solvent feed mechanism, then a coating solution is supplied onto a film of the solvent from the coating solution feed mechanism, and finally a gas is jetted to an uneven surface of the coating solution from the gas jet mechanism to smooth a thin film surface of the coating solution.
摘要:
A coating method includes a step of forming a film of a coating solution having a larger thickness in a central region of a substrate than in an edge region of the substrate by discharging droplets of the coating solution from a plurality of nozzles formed on an inkjet head to the substrate, and a step of moving the coating solution in the film from the central region toward the edge region of the substrate by rotating the substrate. This reduces a difference in thickness of the film between the central region and the edge region of the substrate, thereby to make the film thickness substantially uniform. At the same time, the movement of the coating solution in the film can make the surface of the film smoother.
摘要:
An underlayer is formed to cover the upper surface of a substrate and a guide pattern is formed on the underlayer. A DSA film constituted by two types of polymers is formed in a region on the underlayer where the guide pattern is not formed. Thermal processing is performed while a solvent is supplied to the DSA film on the substrate. Thus, a microphase separation of the DSA film occurs. As a result, patterns made of the one polymer and patterns made of another polymer are formed. Exposure processing and development processing are performed in this order on the DSA film after the microphase separation such that the patterns made of another polymer are removed.
摘要:
In an entire region exposure unit, a platform section and a local transfer mechanism are arranged in one direction. The local transfer mechanism is provided with a local transfer hand. A substrate on which a resist film having a predetermined pattern is formed is held by the local transfer hand. A light-emitting device is attached to the upper portion of the local transfer mechanism. Strip-shaped light is emitted from the light-emitting device toward below. The local transfer mechanism operates such that the local transfer hand is moved relative to the light-emitting device. At this time, the light-emitting device irradiates one surface of the substrate that is moving horizontally with the strip-shaped light. The resist film is modified by the light.