Abstract:
A method (and structure) of making an electronic interconnection, includes, for a signal line to be interconnected, using a plurality of bonding wires configured to provide a controlled impedance effect.
Abstract:
A method and device for crosstalk compensation includes evaluating skew for lengths of the two electrical paths. An integrated circuit is coupled to the two electrical paths, and the integrated circuit includes a global crosstalk compensation element integrated therewith which globally compensates for crosstalk on all lengths of portions of the two electrical paths.
Abstract:
A method (and structure) of making an electronic interconnection, includes, for a signal line to be interconnected, using a plurality of bonding wires configured to provide a controlled impedance effect.
Abstract:
A coplanar waveguide (CPW) probe includes at least one center probe element, each having a respective center probe contact point and at least one peripheral probe element, each having a respective peripheral contact point. The pitch between the at least one center contact point and the at least one peripheral contact point is adjustable.
Abstract:
A system and method for measuring circuits on an integrated circuit substrate includes a measurement circuit formed on the integrated circuit substrate that measures at least one characteristic of an integrated circuit. The measurement circuit has a power transfer device including a power transfer component, which receives energy from a source where the source does not make physical contact with the integrated circuit substrate to transfer power to the measurement circuit. Measurements are taken to provide feedback for in-situ adjustments to circuit parameters and responses.
Abstract:
Testing is performed on an amplifier wafer housing a transimpedance amplifier prior to packaging the transimpedance amplifier with an external photodetector, wherein the transimpedance amplifier includes a small, auxiliary, integrated silicon photodetector provided at the input of the transimpedance, in parallel with external photodetector attachment points. The small auxiliary photodetector does not significantly affect the high speed performance of the transimpedance amplifier. The small auxiliary photodetector is provided to facilitate wafer-level testing at the transimpedance amplifier input. To test the transimpedance amplifier, the transimpedance amplifier is stimulated by optically exciting the small auxiliary photodetector, wherein the small auxiliary photodetector is excited using short wavelength light, whereby advantages such as higher efficiency may be obtained. The testing method includes placing the amplifier wafer in a testing system, probing the power and ground connections on the amplifier wafer, illuminating the small auxiliary photodetector on the amplifier wafer, and detecting the output of the transimpedance amplifier housed on the amplifier wafer. The output of the transimpedance amplifier may detected by probing the supply voltage and detecting the switching currents passing through a bias tee using a spectrum analyzer, using a high gain antenna and a sensitive narrow band receiver, or using a high speed electrical probe.
Abstract:
The invention relates to an apparatus and method to determine contact dynamics between conductive surfaces, and more particularly to determine the dynamics of contact closure in mechanical switches and analysis of the dynamics of other mechanical systems, in general. A log amp is in electrical communication with the RF synthesizer via a transmission line. The log amp outputs a voltage converted from an envelope of an RF waveform to determine a capacitance between at least two conductive surfaces.
Abstract:
An electrical circuit device that includes a circuit board with an integrated circuit chip in a cavity that extends from a surface of the circuit board to an embedded conductor, and an electrical connection between the integrated circuit chip and the embedded conductor.
Abstract:
A mapping system and method. The mapping system comprises an electromagnetic field generator, a layer of electromagnetic field absorbing material over an object, and an infrared camera. The electromagnetic field generator is adapted to generate an electromagnetic field and expose the electromagnetic field absorbing material and object to the electromagnetic field. The layer of electromagnetic field absorbing material is adapted to absorb the electromagnetic field and generate areas of thermal differences within the electromagnetic field absorbing material. The infrared camera is adapted to detect the areas of thermal differences.
Abstract:
A coplanar waveguide (CPW) probe includes at least one center probe element, each having a respective center probe contact point and at least one peripheral probe element, each having a respective peripheral contact point. The pitch between the at least one center contact point and the at least one peripheral contact point is adjustable.