公开(公告)号：US06853057B2

公开(公告)日：2005-02-08

申请号：US10340644

申请日：2003-01-13

申请人： Yoshiki Yasuda ,  Hideya Takakura

发明人： Yoshiki Yasuda ,  Hideya Takakura

IPC分类号： H01L23/48 ,  H01L21/56 ,  H01L23/495 ,  H01L23/50 ,  H01L31/167

CPC分类号： H01L21/565 ,  H01L23/49541 ,  H01L24/48 ,  H01L31/167 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/85399 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012

摘要： In a lead frame which has second tie bars in the vicinity of plastic packages first notches are formed along first edges of the second tie bars (in areas defined on both sides of the inner leads and to come into contact with a punch during the tie bar cutting step). The first notches prevent troubles associated with close arrangement of the second tie bars and the plastic packages. In addition, second notches are provided along second edges of the second tie bars. These second notches are designed to receive the tips of outer leads which extend from neighboring plastic packages of the lead frames.

摘要翻译： 在塑料包装附近具有第二连接杆的引线框架中，第一切口沿着第二连接条的第一边缘（在内引线的两侧限定的区域中）形成，并且在连接条中与冲头接触 切割步骤）。 第一个缺口防止与第二连接条和塑料包装的紧密布置相关联的麻烦。 另外，沿着第二连接条的第二边缘提供第二切口。 这些第二凹口被设计成接收从引线框的相邻塑料封装延伸的外部引线的尖端。

公开(公告)号：US20050091842A1

公开(公告)日：2005-05-05

申请号：US10974910

申请日：2004-10-28

申请人： Hideya Takakura ,  Kazuo Kusuda ,  Hiroyuki Shoji

发明人： Hideya Takakura ,  Kazuo Kusuda ,  Hiroyuki Shoji

IPC分类号： H01L23/50 ,  H01L21/48 ,  H01L23/495 ,  H01L25/16 ,  H01L31/12 ,  H01L31/18 ,  H01R43/00

CPC分类号： H01L23/49565 ,  H01L21/4842 ,  H01L24/45 ,  H01L24/48 ,  H01L25/167 ,  H01L31/12 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/8592 ,  H01L2924/01038 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/181 ,  H01L2924/3025 ,  Y10T29/49117 ,  Y10T29/49121 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/5111 ,  H01L2924/00014 ,  H01L2924/00012

摘要： In a manufacturing method of a lead frame for an optical coupling device, the method includes the steps of preparing an elongated lead frame on which a plurality of tie bars are placed between a pair of side rails that are mutually in parallel with each other so as to orthogonally cross the bars, with a plurality of lead terminals being placed in a staggered form in a manner so as to orthogonally cross the tie bars, and laterally cutting the elongated lead frame to prepare a plurality of strap-shaped lead frames. Herein, the elongated lead frame is cut in such a manner that the length of protrusion of a cut end of each of the side rails from each of the tie bars is made longer than the length of protrusion of a lead terminal from each of the tie bars.

摘要翻译： 在一种用于光耦合装置的引线框架的制造方法中，该方法包括以下步骤：制备细长的引线框架，多个连接杆放置在彼此相互平行的一对侧轨之间，从而 以正交方式穿过杆，其中多个引线端子以交错的形式被放置成正交地穿过连接杆，并横向切割细长引线框架以制备多个带状引线框架。 这里，细长引线框架以这样的方式被切割，使得每个侧栏的每个侧轨的切割端的突出长度比每个连接条的引线端子的突出长度长 酒吧。

公开(公告)号：US20060060882A1

公开(公告)日：2006-03-23

申请号：US11230822

申请日：2005-09-21

申请人： Nobuyuki Ohe ,  Kazuhito Nagura ,  Hideya Takakura ,  Kazuo Kusuda ,  Hiroyuki Shoji

发明人： Nobuyuki Ohe ,  Kazuhito Nagura ,  Hideya Takakura ,  Kazuo Kusuda ,  Hiroyuki Shoji

IPC分类号： H01L33/00

CPC分类号： H01L31/0203 ,  G02B6/4212 ,  H01L33/56 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00011 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/01049

摘要： An optical semiconductor device has an optical semiconductor element (2) such as an LED or PD, and a light-permeable resin (4) encapsulating the optical semiconductor element. The light-permeable resin contains a base resin and filler. The light-permeable resin (4) has a characteristic that its transmittance increases with a temperature rise within an operating temperature range (e.g., −40° C.−+85° C.)

摘要翻译： 光学半导体器件具有诸如LED或PD的光学半导体元件（2）和封装光学半导体元件的透光树脂（4）。 透光树脂含有基础树脂和填料。 透光性树脂（4）具有其工作温度范围（例如-40℃〜+ 85℃）内的温度上升的透过率的特性，

公开(公告)号：US20060054901A1

公开(公告)日：2006-03-16

申请号：US11226434

申请日：2005-09-15

申请人： Hiroyuki Shoji ,  Hideya Takakura ,  Kazuo Kusuda

发明人： Hiroyuki Shoji ,  Hideya Takakura ,  Kazuo Kusuda

IPC分类号： H01L21/00 ,  H01L33/00

CPC分类号： H01L25/167 ,  H01L21/565 ,  H01L23/3135 ,  H01L23/49575 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L33/56 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/4809 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48247 ,  H01L2224/4846 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/48479 ,  H01L2224/48599 ,  H01L2224/73265 ,  H01L2224/85051 ,  H01L2224/8592 ,  H01L2224/85986 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01055 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12041 ,  H01L2924/12043 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3025 ,  H01L2924/351 ,  H01L2224/85186 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/48227 ,  H01L2224/4554 ,  H01L2224/85399 ,  H01L2224/05599

摘要： An optical semiconductor element 2 is mounted on a lead frame 1, the optical semiconductor element 2 is encapsulated with a mold resin portion 14 of a first layer that has light permeability, and the mold resin portion 14 of the first layer is encapsulated with a mold resin portion 15 of a second layer that has light permeability. Then, a coefficient of linear expansion of the mold resin portion 14 of the first layer is made smaller than a coefficient of linear expansion of the mold resin portion 15 of the second layer.

摘要翻译： 将光学半导体元件2安装在引线框架1上，用具有透光性的第一层的模制树脂部分14封装光学半导体元件2，并且用模具封装第一层的模制树脂部分14 具有透光性的第二层的树脂部分15。 然后，使第一层的模制树脂部分14的线膨胀系数小于第二层的模制树脂部分15的线性膨胀系数。

公开(公告)号：US08599170B2

公开(公告)日：2013-12-03

申请号：US12854271

申请日：2010-08-11

申请人： Hideya Takakura

发明人： Hideya Takakura

IPC分类号： G06F3/045 ,  H01H21/04 ,  F21V7/04

CPC分类号： G06F3/03547 ,  G06F3/042

摘要： Light emitted from a light source such as LED and reflected by a fingertip is guided by a cover member onto a light receiving surface of an imaging element. A second resin part is provided that is in contact with the cover member and a resin molded part sealing the imaging element. The reflected light guided by the cover member is made to reach the light receiving surface via the second resin part and the resin molded part, traveling along a path spaced apart from an air layer.

摘要翻译： 从诸如LED的光源发射并由指尖反射的光由盖构件引导到成像元件的光接收表面上。 提供与盖构件接触的第二树脂部件和密封成像元件的树脂模制部件。 由盖构件引导的反射光通过第二树脂部分和树脂模制部分沿着与空气层间隔开的路径行进到达光接收表面。

公开(公告)号：US20120188385A1

公开(公告)日：2012-07-26

申请号：US13499186

申请日：2010-09-29

申请人： Takahiro Miyake ,  Renzaburou Miki ,  Tetsushi Noro ,  Hideya Takakura

发明人： Takahiro Miyake ,  Renzaburou Miki ,  Tetsushi Noro ,  Hideya Takakura

IPC分类号： H04N5/225 ,  F21V7/04 ,  F21V7/00

CPC分类号： G02B6/43 ,  G02B6/4214 ,  G06F3/042 ,  G06F2203/04109

摘要： In order to reduce the number of components in the optical pointing device, and the number of steps for assembling, bonding, etc. the components, a light guide (24) according to the present invention for use in an optical pointing device (30) is configured to include a redirecting element (12) for receiving light from a touch surface (11) and reflecting the light so as to guide the light into a horizontal direction, and an image forming section (14) for receiving the reflected light and reflecting the reflected light to an opposite direction backward to the horizontal direction, so as to form an image of the light, the light guide (24) outputting the image of the light from a light output section.

摘要翻译： 为了减少光学指向装置中的部件的数量，以及用于组装，接合等部件的步骤的数量，根据本发明的用于光学指向装置（30）的光导（24） 被配置为包括用于从触摸表面（11）接收光并反射光以将光引导到水平方向的重定向元件（12），以及用于接收反射光并反射的图像形成部分 反射光向与水平方向相反的方向反射，从而形成光的图像，导光体（24）输出来自光输出部的光的图像。

公开(公告)号：US20090074352A1

公开(公告)日：2009-03-19

申请号：US12207268

申请日：2008-09-09

申请人： Ikuo KOHASHI ,  Hideya Takakura

发明人： Ikuo KOHASHI ,  Hideya Takakura

IPC分类号： G02B6/12

CPC分类号： G02B6/4246 ,  G02B6/4204 ,  H01L24/45 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2924/12043 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： In a bidirectional optical transmission device, a light-emitting element and a light-receiving element are mounted on one side of a base material and are sealed with an optically permeable resin section. The resin section includes a light emitting side resin section and a light receiving side resin section, and a slit is provided between these resin sections. The device further includes a light-blocking receptacle having a claw, and the claw of the receptacle is disposed in the slit between the light emitting side resin section and the light receiving side resin section. The claw of the receptacle prevents leakage of light from the light-emitting element between the light-emitting element and the light-receiving element.

摘要翻译： 在双向光传输装置中，发光元件和光接收元件安装在基材的一侧，并用光学透光树脂部分密封。 树脂部分包括发光侧树脂部分和光接收侧树脂部分，并且在这些树脂部分之间设置狭缝。 该装置还包括具有爪的遮光容器，并且插座的爪设置在发光侧树脂部和光接收侧树脂部之间的狭缝中。 容器的爪子防止发光元件和光接收元件之间的发光元件的光的泄漏。

公开(公告)号：US07425727B2

公开(公告)日：2008-09-16

申请号：US11226434

申请日：2005-09-15

申请人： Hiroyuki Shoji ,  Hideya Takakura ,  Kazuo Kusuda

发明人： Hiroyuki Shoji ,  Hideya Takakura ,  Kazuo Kusuda

IPC分类号： H01L21/00

CPC分类号： H01L25/167 ,  H01L21/565 ,  H01L23/3135 ,  H01L23/49575 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L33/56 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/4809 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48247 ,  H01L2224/4846 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/48479 ,  H01L2224/48599 ,  H01L2224/73265 ,  H01L2224/85051 ,  H01L2224/8592 ,  H01L2224/85986 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01055 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12041 ,  H01L2924/12043 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3025 ,  H01L2924/351 ,  H01L2224/85186 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/48227 ,  H01L2224/4554 ,  H01L2224/85399 ,  H01L2224/05599

摘要： An optical semiconductor element 2 is mounted on a lead frame 1, the optical semiconductor element 2 is encapsulated with a mold resin portion 14 of a first layer that has light permeability, and the mold resin portion 14 of the first layer is encapsulated with a mold resin portion 15 of a second layer that has light permeability. Then, a coefficient of linear expansion of the mold resin portion 14 of the first layer is made smaller than a coefficient of linear expansion of the mold resin portion 15 of the second layer.

摘要翻译： 将光学半导体元件2安装在引线框架1上，用具有透光性的第一层的模制树脂部分14封装光学半导体元件2，并且用模具封装第一层的模制树脂部分14 具有透光性的第二层的树脂部分15。 然后，使第一层的模制树脂部分14的线膨胀系数小于第二层的模制树脂部分15的线性膨胀系数。

公开(公告)号：US07835607B2

公开(公告)日：2010-11-16

申请号：US12349635

申请日：2009-01-07

申请人： Hideya Takakura

发明人： Hideya Takakura

IPC分类号： G02B6/44

CPC分类号： G02B6/4416 ,  G02B6/43

摘要： An optical-electrical composite cable as an example of an optical-electrical composite transmission device has a flexible board as an electrical signal transmission member having an electric wiring section, and an optical fiber as an optical signal transmission member. The optical fiber is passed through a plurality of holes formed in a resin base section of the flexible board so as to thread through the resin base section. The flexible board and the optical fiber are integrated so as not to be separated from each other, so that even when the characteristics (tensile strength, thermal expansion coefficient) of the transmission lines respectively embodied by the flexible board and the optical fiber are different, the optical-electrical composite cable has stable flexibility as a whole.

摘要翻译： 作为光电复合传输装置的实例的光电复合电缆具有作为具有电布线部分的电信号传输部件的柔性板，以及作为光信号传输部件的光纤。 光纤穿过形成在柔性板的树脂基部中的多个孔，以便穿过树脂基部。 柔性基板和光纤被集成为不会彼此分离，使得即使分别由柔性板和光纤实现的传输线的特性（拉伸强度，热膨胀系数）不同， 光电复合电缆整体上具有稳定的柔性。

公开(公告)号：US07234231B2

公开(公告)日：2007-06-26

申请号：US10974910

申请日：2004-10-28

申请人： Hideya Takakura ,  Kazuo Kusuda ,  Hiroyuki Shoji

发明人： Hideya Takakura ,  Kazuo Kusuda ,  Hiroyuki Shoji

IPC分类号： H01R43/00

CPC分类号： H01L23/49565 ,  H01L21/4842 ,  H01L24/45 ,  H01L24/48 ,  H01L25/167 ,  H01L31/12 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/8592 ,  H01L2924/01038 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/181 ,  H01L2924/3025 ,  Y10T29/49117 ,  Y10T29/49121 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/5111 ,  H01L2924/00014 ,  H01L2924/00012

摘要： A manufacturing method of an optical coupling device includes, preparing an elongated lead frame on which a plurality of tie bars are placed between a pair of side rails that are mutually in parallel with each other so as to orthogonally cross the tie bars, with a plurality of lead terminals being placed in a staggered form in a manner so as to orthogonally cross the tie bars, and laterally cutting the elongated lead frame to prepare a plurality of strap-shaped lead frames, in such a manner that the length of protrusion of a cut end of each of the side rails from each of the tie bars is made longer than the length of protrusion of a lead terminal from each of the tie bars.

摘要翻译： 光耦合装置的制造方法包括：准备细长的引线框架，多个连接杆放置在一对侧轨之间，所述多个连接杆彼此平行地彼此平行，以便与多个 的引线端子以交错的形式被放置成正交地穿过连接杆，并且横向地切割细长的引线框架以制备多个带状引线框架，使得一个 每个连接条的每个侧轨的切割端的长度大于从每个连接条引导端子的突出长度。