Method for coating substrates
    1.
    发明授权
    Method for coating substrates 有权
    涂布基材的方法

    公开(公告)号:US07867565B2

    公开(公告)日:2011-01-11

    申请号:US10883420

    申请日:2004-06-30

    IPC分类号: B05D5/12

    摘要: A method for depositing a coating layer on at least a part of a surface of a substrate is described. The method includes supplying a coating substance to at least part of a surface of a substrate. The substrate is subjected to a relative movement with respect to a source of the coating substance. The surface tension of the coating substance is modified, at least locally, at least part of the time while the at least part of the substrate is subjected to the movement. A thickness of the coating layer is influenced by modifying the surface tension of the coating substance.

    摘要翻译: 描述了在基板表面的至少一部分上沉积涂层的方法。 该方法包括向基材表面的至少一部分提供涂层物质。 基底相对于涂层物质的来源进行相对运动。 至少部分时间,至少局部地改变涂层物质的表面张力,同时至少部分基底经受运动。 通过改变涂层物质的表面张力来影响涂层的厚度。

    Method and apparatus for immersion lithography
    2.
    发明授权
    Method and apparatus for immersion lithography 有权
    浸渍光刻的方法和装置

    公开(公告)号:US07224433B2

    公开(公告)日:2007-05-29

    申请号:US11174103

    申请日:2005-07-01

    申请人: Paul Mertens Wim Fyen

    发明人: Paul Mertens Wim Fyen

    摘要: A method and apparatus for immersion lithography is described. The method includes positioning a semiconductor substrate under an optical immersion head assembly, providing an immersion liquid between the substrate and the optical immersion head assembly, and supplying a tensio-active gaseous substance along the perimeter of the contact area of the immersion liquid and the substrate. The immersion liquid contacts at least an area of the substrate. The tensio-active gaseous substance is chosen such that, when at least partially mixed with the immersion liquid, the mixture has a lower surface tension than the immersion liquid, thereby creating a surface tension gradient pulling the immersion liquid from the perimeter towards an inside portion of the contact area.

    摘要翻译: 描述浸没式光刻的方法和装置。 该方法包括将半导体衬底定位在光浸入头组件下方,在衬底和光浸入头组件之间提供浸没液体,并沿着浸液和衬底的接触区域的周边提供张力活性气态物质 。 浸没液体接触基板的至少一个区域。 选择张力活性气体物质,使得当与浸没液体至少部分混合时,混合物具有比浸没液体更低的表面张力,从而产生将浸渍液体从周边拉向内部的表面张力梯度 的接触面积。

    Method and apparatus for immersion lithography
    3.
    发明申请
    Method and apparatus for immersion lithography 有权
    浸渍光刻的方法和装置

    公开(公告)号:US20060000381A1

    公开(公告)日:2006-01-05

    申请号:US11174103

    申请日:2005-07-01

    申请人: Paul Mertens Wim Fyen

    发明人: Paul Mertens Wim Fyen

    IPC分类号: G03G15/32

    摘要: A method and apparatus for immersion lithography is described. The method includes positioning a semiconductor substrate under an optical immersion head assembly, providing an immersion liquid between the substrate and the optical immersion head assembly, and supplying a tensio-active gaseous substance along the perimeter of the contact area of the immersion liquid and the substrate. The immersion liquid contacts at least an area of the substrate. The tensio-active gaseous substance is chosen such that, when at least partially mixed with the immersion liquid, the mixture has a lower surface tension than the immersion liquid, thereby creating a surface tension gradient pulling the immersion liquid from the perimeter towards an inside portion of the contact area.

    摘要翻译: 描述浸没式光刻的方法和装置。 该方法包括将半导体衬底定位在光浸入头组件下方,在衬底和光浸入头组件之间提供浸没液体,并沿着浸液和衬底的接触区域的周边提供张力活性气体物质 。 浸没液体接触基板的至少一个区域。 选择张力活性气体物质,使得当与浸没液体至少部分混合时,混合物具有比浸没液体更低的表面张力,从而产生将浸渍液体从周边拉向内部的表面张力梯度 的接触面积。