PARTICLE-CONTAINING ETCHING PASTES FOR SILICON SURFACES AND LAYERS
    2.
    发明申请
    PARTICLE-CONTAINING ETCHING PASTES FOR SILICON SURFACES AND LAYERS 审中-公开
    用于硅表面和层的颗粒含有蚀刻剂

    公开(公告)号:US20100068889A1

    公开(公告)日:2010-03-18

    申请号:US12447921

    申请日:2007-10-05

    IPC分类号: H01L21/306 C09K13/02

    摘要: The present invention relates to particle-containing etching media in the form of etching pastes which are suitable for the full-area or selective etching of extremely fine lines or structures in silicon surfaces and layers and in glass-like surfaces formed from suitable silicon compounds. The present invention also relates to the use of the pastes according to the invention in processes for etching surfaces of this type.

    摘要翻译: 本发明涉及蚀刻浆料形式的含微粒蚀刻介质,其适用于在硅表面和层中以及由合适的硅化合物形成的玻璃状表面中的极细线或结构的全面或选择性蚀刻。 本发明还涉及根据本发明的浆料在这种蚀刻表面的方法中的用途。