知搜-全球专利检索

  1. 登录
  2. 注册

搜索结果

94 条记录 (耗时 0.015 秒)

    APPARATUS AND COMPOSITION FOR SHARPENING A PAPER SHREDDER BLADE, AND PREPARATION PROCESS THEREFOR
    2.
    发明申请
    APPARATUS AND COMPOSITION FOR SHARPENING A PAPER SHREDDER BLADE, AND PREPARATION PROCESS THEREFOR 审中-公开
    用于收缩纸屑叶片的装置和组合物及其制备方法

    公开(公告)号：US20130227894A1

    公开(公告)日：2013-09-05

    申请号：US13862255

    申请日：2013-04-12

    申请人： AURORA OFFICE EQUIPMENT CO., LTD, SHANGHAI

    发明人： Hsin-Hsiung Chen

    IPC分类号： C09K3/14

    CPC分类号： B24D3/20 ,  B24D3/34 ,  B24D11/001 ,  B24D99/00 ,  C09K3/1481

    摘要： Composition, apparatus, and methods of composition and apparatus manufacture, for sharpening a paper shredder blade. Composition includes grinding powder, thickening agent, and additive. The thickening agent may be a white oil, an animal oil, an vegetable oil, or a stearine wax. The additive may be an antirust powder, an antiwear powder, an antistatic powder, or an antioxidation powder. The grinding composition is dispensed into a polyethylene film, and sealed to form the grinding apparatus, as a grinding sheet or a grinding packet. A method for forming a grinding sheet includes selecting the constituent materials for a grinding composition; stirring the constituent grinding composition materials; heating the constituent materials to melting; mixing the constituent materials, while melting and intermixing; cooling and packaging the grinding composition to form a grinding sheet or packet.

    摘要翻译： 用于磨碎碎纸机刀片的组成和装置制造的组成，装置和方法。 组合物包括研磨粉，增稠剂和添加剂。 增稠剂可以是白油，动物油，植物油或硬脂蜡。 添加剂可以是防锈粉末，抗磨粉末，抗静电粉末或抗氧化粉末。 将研磨组合物分配到聚乙烯膜中，并密封以形成研磨装置，作为研磨片或研磨包。 用于形成研磨片的方法包括：选择研磨组合物的构成材料; 搅拌组分研磨组合物材料; 加热构成材料进行熔化; 混合构成材料，同时融化和混合; 冷却和包装研磨组合物以形成研磨片或包装。

    Chemical Mechanical Polishing Composition for Copper Comprising Zeolite
    3.
    发明申请
    Chemical Mechanical Polishing Composition for Copper Comprising Zeolite 审中-公开
    包含沸石的铜的化学机械抛光组合物

    公开(公告)号：US20100015807A1

    公开(公告)日：2010-01-21

    申请号：US12519940

    申请日：2007-12-20

    申请人： Seok-Ju Kim ,  Hyu-Bum Park ,  Eun-Il Jeong

    发明人： Seok-Ju Kim ,  Hyu-Bum Park ,  Eun-Il Jeong

    IPC分类号： H01L21/302

    CPC分类号： C09K3/1481 ,  C09G1/02 ,  H01L21/3212

    摘要： The present invention relates to a CMP slurry composition for polishing a copper film in a semiconductor device fabricating process. The CMP composition for polishing a substrate comprising copper comprises zeolite, an oxidizer and a complexing agent and a content of the complexing agent is 0.01˜0.8 weight % with respect to an entire weight of the polishing composition.

    摘要翻译： 本发明涉及一种用于在半导体器件制造工艺中抛光铜膜的CMP浆料组合物。 用于研磨包含铜的基材的CMP组合物包括沸石，氧化剂和络合剂，并且络合剂的含量相对于抛光组合物的整个重量为0.01〜0.8重量％。