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    Method for inspecting localized image and system thereof
    1.
    发明授权
    Method for inspecting localized image and system thereof 有权
    检查本地化图像的方法及其系统

    公开(公告)号：US08606017B1

    公开(公告)日：2013-12-10

    申请号：US13073161

    申请日：2011-03-28

    申请人： Wei Fang ,  Jack Jau ,  Zhao-Li Zhang

    发明人： Wei Fang ,  Jack Jau ,  Zhao-Li Zhang

    IPC分类号： G06K9/46 ,  G06K9/50

    CPC分类号： G06K9/628 ,  G06K9/3216

    摘要： A plurality of points with identical geometric feature is compared with their SEM characteristic features to inspect defect in a localized image. Original design information is included in the geometric feature such that absolute compare can be performed in this inspection method. Further, this method can also be applied to the localized image with or without repeated or redundant pattern.

    摘要翻译： 将具有相同几何特征的多个点与其SEM特征相比较以检查局部图像中的缺陷。 原始设计信息包含在几何特征中，使得可以在该检查方法中进行绝对比较。 此外，该方法也可以应用于具有或不具有重复或冗余模式的局部图像。

    METHOD AND SYSTEM OF CLASSIFYING DEFECTS ON A WAFER
    2.
    发明申请
    METHOD AND SYSTEM OF CLASSIFYING DEFECTS ON A WAFER 有权
    在WAFER上分类缺陷的方法和系统

    公开(公告)号：US20120027287A1

    公开(公告)日：2012-02-02

    申请号：US13269038

    申请日：2011-10-07

    申请人： Wei FANG ,  Zhao-Li Zhang ,  Jack Jau

    发明人： Wei FANG ,  Zhao-Li Zhang ,  Jack Jau

    IPC分类号： G06K9/00

    CPC分类号： G06T7/0008 ,  G06T7/001 ,  G06T2207/20081 ,  G06T2207/30148

    摘要： A method of classifying the defects on a wafer having some same chips and corresponding system is provided. After receiving images formed by scanning the wafer using a charged particle beam, these images are examined such that both defective images and defect-free images are found. Then, the defect-free images are translated into a simulated layout of the chip, or a database is used to provide the simulated layout of the chip. Finally, the defects on the defective images are classified by comparing the images with the simulated layout of the chip. The system has some modules separately corresponds to the steps of the method.

    摘要翻译： 提供了在具有相同芯片和相应系统的晶片上分类缺陷的方法。 在接收到通过使用带电粒子束扫描晶片形成的图像之后，检查这些图像，使得发现缺陷图像和无缺陷图像。 然后，将无缺陷图像转换为芯片的模拟布局，或者使用数据库来提供芯片的模拟布局。 最后，通过将图像与芯片的模拟布局进行比较来分类缺陷图像上的缺陷。 系统有一些模块分别对应于该方法的步骤。

    Method and system for determining a defect during charged particle beam inspection of a sample
    3.
    发明授权
    Method and system for determining a defect during charged particle beam inspection of a sample 有权
    用于确定样品的带电粒子束检查期间的缺陷的方法和系统

    公开(公告)号：US08068662B2

    公开(公告)日：2011-11-29

    申请号：US12414130

    申请日：2009-03-30

    申请人： Zhao-Li Zhang ,  Wei Fang ,  Jack Jau

    发明人： Zhao-Li Zhang ,  Wei Fang ,  Jack Jau

    IPC分类号： G06K9/00

    CPC分类号： G06T7/001 ,  G06T2207/30148

    摘要： A method for determining a defect during charged particle beam inspection of a sample locates at least one examination region within a charged particle microscopic image of the sample by making reference to a database graphic of the sample corresponding to the charged particle microscopic image. Each located examination region concerns at least one element of the sample, and each element has at least one characteristic in common. At least one point response value is then generated for each point in the located examination regions. The presence of a defect at the location of the concerned point is then determined by applying at least one decision tree operator to the generated point response values of the concerned point. Applications of the proposed method as a computing agent and a charged particle beam inspection system are also disclosed.

    摘要翻译： 用于在样品的带电粒子束检查期间确定缺陷的方法通过参考对应于带电粒子显微镜图像的样品的数据库图形来定位样品的带电粒子微观图像内的至少一个检查区域。 每个位置的检查区域涉及样品的至少一个元件，并且每个元件具有至少一个共同的特征。 然后为定位的检查区域中的每个点生成至少一个点响应值。 然后通过将至少一个决策树运算符应用于相关点的生成点响应值来确定在相关点的位置处的缺陷的存在。 还公开了所提出的方法作为计算代理和带电粒子束检查系统的应用。

    Method and system of classifying defects on a wafer
    4.
    发明授权
    Method and system of classifying defects on a wafer 有权
    在晶片上分类缺陷的方法和系统

    公开(公告)号：US08805054B2

    公开(公告)日：2014-08-12

    申请号：US13269038

    申请日：2011-10-07

    申请人： Wei Fang ,  Zhao-Li Zhang ,  Jack Jau

    发明人： Wei Fang ,  Zhao-Li Zhang ,  Jack Jau

    IPC分类号： G06K9/00

    CPC分类号： G06T7/0008 ,  G06T7/001 ,  G06T2207/20081 ,  G06T2207/30148

    摘要： A method of classifying the defects on a wafer having some same chips and corresponding system is provided. After receiving images formed by scanning the wafer using a charged particle beam, these images are examined such that both defective images and defect-free images are found. Then, the defect-free images are translated into a simulated layout of the chip, or a database is used to provide the simulated layout of the chip. Finally, the defects on the defective images are classified by comparing the images with the simulated layout of the chip. The system has some modules separately corresponds to the steps of the method.

    摘要翻译： 提供了在具有相同芯片和相应系统的晶片上分类缺陷的方法。 在接收到通过使用带电粒子束扫描晶片形成的图像之后，检查这些图像，使得发现缺陷图像和无缺陷图像。 然后，将无缺陷图像转换为芯片的模拟布局，或者使用数据库来提供芯片的模拟布局。 最后，通过将图像与芯片的模拟布局进行比较来分类缺陷图像上的缺陷。 系统有一些模块分别对应于该方法的步骤。

    METHOD AND SYSTEM OF CLASSIFYING DEFECTS ON A WAFER
    6.
    发明申请
    METHOD AND SYSTEM OF CLASSIFYING DEFECTS ON A WAFER 审中-公开
    在WAFER上分类缺陷的方法和系统

    公开(公告)号：US20100158346A1

    公开(公告)日：2010-06-24

    申请号：US12343201

    申请日：2008-12-23

    申请人： Wei FANG ,  Zhao-Li Zhang ,  Jack Jau

    发明人： Wei FANG ,  Zhao-Li Zhang ,  Jack Jau

    IPC分类号： G06K9/00

    CPC分类号： G06T7/001 ,  G06T2207/30148

    摘要： Method of classifying the defects on a wafer having some same chips and corresponding system. After receiving images formed by scanning the wafer using a charged particle beam, these images are examined such that both defective images and defect-free images are found. Then, the defect-free images are translated into a simulated layout of the chip, or a database is used to provide the simulated layout of the chip. Finally, the defects on the defective images are classified by comparing the images with the simulated layout of the chip. The system has some modules separately corresponds to the steps of the method.

    摘要翻译： 对具有相同芯片和相应系统的晶片上的缺陷进行分类的方法。 在接收到通过使用带电粒子束扫描晶片形成的图像之后，检查这些图像，使得发现缺陷图像和无缺陷图像。 然后，将无缺陷图像转换为芯片的模拟布局，或者使用数据库来提供芯片的模拟布局。 最后，通过将图像与芯片的模拟布局进行比较来分类缺陷图像上的缺陷。 系统有一些模块分别对应于该方法的步骤。