公开(公告)号：US10163762B2

公开(公告)日：2018-12-25

申请号：US14735229

申请日：2015-06-10

申请人： Vishay General Semiconductor LLC

发明人： Hui-Ying Ding ,  Pengnian Wang ,  Tao Yu ,  Jun-Feng Liu ,  Jun-Kai Bai ,  Chih-Ping Peng

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L23/495 ,  H01L21/52 ,  H01L21/56 ,  H01L23/31 ,  H01L21/60

摘要： A semiconductor assembly includes a semiconductor die comprising lower and upper electrical contacts. A lead frame having a lower die pad is electrically and mechanically connected to the lower electrical contact of the die. An upper conductive member has a first portion electrically and mechanically connected to the upper electrical contact of the die. A lead terminal has a surface portion electrically and mechanically connected to a second portion of the conductive member. The surface portion of the lead terminal and/or the second portion of the conductive member has a series of grooves disposed therein. Packaging material encapsulates the semiconductor die, at least a portion of the lead frame, at least a portion of the upper conducive member and at least a portion of the lead terminal.

公开(公告)号：US20160365305A1

公开(公告)日：2016-12-15

申请号：US14735229

申请日：2015-06-10

申请人： Vishay General Semiconductor LLC

发明人： Hui-Ying Ding ,  Pengnian Wang ,  Tao Yu ,  Jun-Feng Liu ,  Jun-Kai Bai ,  Chih-Ping Peng

IPC分类号： H01L23/495 ,  H01L21/56 ,  H01L21/52 ,  H01L23/31

CPC分类号： H01L23/49575 ,  H01L21/52 ,  H01L21/56 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/49513 ,  H01L23/49517 ,  H01L23/49524 ,  H01L23/49562 ,  H01L24/05 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/37 ,  H01L24/40 ,  H01L24/83 ,  H01L24/84 ,  H01L24/92 ,  H01L2021/6027 ,  H01L2021/60277 ,  H01L2224/04026 ,  H01L2224/05644 ,  H01L2224/291 ,  H01L2224/32145 ,  H01L2224/33 ,  H01L2224/33181 ,  H01L2224/37012 ,  H01L2224/37013 ,  H01L2224/37124 ,  H01L2224/37147 ,  H01L2224/37155 ,  H01L2224/37166 ,  H01L2224/40105 ,  H01L2224/40245 ,  H01L2224/40499 ,  H01L2224/73263 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83424 ,  H01L2224/83447 ,  H01L2224/83455 ,  H01L2224/83466 ,  H01L2224/83815 ,  H01L2224/84345 ,  H01L2224/84385 ,  H01L2224/92246 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2924/00014

摘要： A semiconductor assembly includes a semiconductor die comprising lower and upper electrical contacts. A lead frame having a lower die pad is electrically and mechanically connected to the lower electrical contact of the die. An upper conductive member has a first portion electrically and mechanically connected to the upper electrical contact of the die. A lead terminal has a surface portion electrically and mechanically connected to a second portion of the conductive member. The surface portion of the lead terminal and/or the second portion of the conductive member has a series of grooves disposed therein. Packaging material encapsulates the semiconductor die, at least a portion of the lead frame, at least a portion of the upper conducive member and at least a portion of the lead terminal.

摘要翻译： 半导体组件包括包括下电极和上电触头的半导体管芯。 具有下管芯焊盘的引线框架电连接和机械连接到管芯的下电触头。 上导电构件具有电和机械地连接到管芯的上电接触件的第一部分。 引线端子具有电气和机械连接到导电构件的第二部分的表面部分。 引线端子的表面部分和/或导电部件的第二部分具有设置在其中的一系列凹槽。 包装材料封装半导体管芯，引线框架的至少一部分，上部导电构件的至少一部分和引线端子的至少一部分。