公开(公告)号：US11692263B2

公开(公告)日：2023-07-04

申请号：US16619840

申请日：2018-09-28

Applicant: VIAVI Solutions Inc.

Inventor： Zhao Yuan ,  Markus K. Tilsch ,  Georg J. Ockenfuss ,  Marius Grigonis ,  Andrew Clark ,  Donggong Peng ,  Yinxiang Xia ,  Eric Nybank ,  Neil Pinkerton

IPC: H01J37/34 ,  C23C14/54 ,  C23C14/35 ,  C23C14/00 ,  C23C14/52

CPC classification number: C23C14/547 ,  C23C14/0042 ,  C23C14/35 ,  C23C14/52 ,  C23C14/54 ,  H01J37/3464 ,  H01J37/3476

Abstract: A device may include one or more memories and one or more processors, communicatively coupled to the one or more memories, to receive design information, wherein the design information identifies desired values for a set of layers of an optical element to be generated during one or more runs; receive or obtain historic information identifying a relationship between a parameter for the one or more runs and an observed value relating to the one or more runs or the optical element; determine layer information for the one or more runs based on the historic information, wherein the layer information identifies run parameters, for the set of layers, to achieve the desired values; and cause the one or more runs to be performed based on the layer information.

公开(公告)号：US11486042B2

公开(公告)日：2022-11-01

申请号：US16250842

申请日：2019-01-17

Applicant: VIAVI SOLUTIONS INC.

Inventor： Adam Andrew Preuss ,  Richard A. Bradley, Jr. ,  Georg J. Ockenfuss ,  Markus K. Tilsch ,  Andrew Clark ,  Marius Grigonis ,  Andy Shkabko ,  Nicolas Alexander Davis ,  Anthony Jay Kemp Cottrell

IPC: C23C28/00 ,  C23C4/131 ,  C23C4/08 ,  C23C4/134 ,  C23C4/067 ,  C23C14/16 ,  C23C14/34 ,  C23C4/06 ,  C23C16/02 ,  H01J37/32 ,  C23C16/24 ,  C23C28/02 ,  C23C16/513 ,  B32B15/04 ,  H01J37/34 ,  H01L23/552 ,  C23C30/00 ,  C23C4/10 ,  B32B15/18 ,  B32B15/01 ,  B32B15/20 ,  C23C16/12 ,  C23C4/04

Abstract: A device including a hard shield material; a layer including aluminum or copper; and a silicon layer having a first thickness is disclosed. The device can also include a silicon layer having a second thickness. A method of making the device is also disclosed.

公开(公告)号：US11131018B2

公开(公告)日：2021-09-28

申请号：US16103632

申请日：2018-08-14

Applicant: VIAVI Solutions Inc.

Inventor： Andrew Clark ,  Georg J. Ockenfuss

IPC: C23C14/34 ,  C23C14/35 ,  C23C14/00 ,  C23C14/10 ,  C23C14/14

Abstract: A sputtering system may include a substrate. The sputtering system may include at least one target. The at least one target may include at least one coating material to coat at least one layer onto the substrate. The at least one coating material may be sputtered onto the substrate in a presence of an inert gas. The inert gas may include argon gas and helium gas.