公开(公告)号：US11486042B2

公开(公告)日：2022-11-01

申请号：US16250842

申请日：2019-01-17

Applicant: VIAVI SOLUTIONS INC.

Inventor： Adam Andrew Preuss ,  Richard A. Bradley, Jr. ,  Georg J. Ockenfuss ,  Markus K. Tilsch ,  Andrew Clark ,  Marius Grigonis ,  Andy Shkabko ,  Nicolas Alexander Davis ,  Anthony Jay Kemp Cottrell

IPC: C23C28/00 ,  C23C4/131 ,  C23C4/08 ,  C23C4/134 ,  C23C4/067 ,  C23C14/16 ,  C23C14/34 ,  C23C4/06 ,  C23C16/02 ,  H01J37/32 ,  C23C16/24 ,  C23C28/02 ,  C23C16/513 ,  B32B15/04 ,  H01J37/34 ,  H01L23/552 ,  C23C30/00 ,  C23C4/10 ,  B32B15/18 ,  B32B15/01 ,  B32B15/20 ,  C23C16/12 ,  C23C4/04

Abstract: A device including a hard shield material; a layer including aluminum or copper; and a silicon layer having a first thickness is disclosed. The device can also include a silicon layer having a second thickness. A method of making the device is also disclosed.